DK144919C - Stabil vandig sensibiliseringsoploesning og stamoploesning til fremstilling heraf - Google Patents
Stabil vandig sensibiliseringsoploesning og stamoploesning til fremstilling herafInfo
- Publication number
- DK144919C DK144919C DK48471A DK48471A DK144919C DK 144919 C DK144919 C DK 144919C DK 48471 A DK48471 A DK 48471A DK 48471 A DK48471 A DK 48471A DK 144919 C DK144919 C DK 144919C
- Authority
- DK
- Denmark
- Prior art keywords
- solution
- sensibilization
- preparation
- stable auxiliary
- stock solution
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Catalysts (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US906070A | 1970-02-05 | 1970-02-05 | |
US906070 | 1992-06-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
DK144919B DK144919B (da) | 1982-07-05 |
DK144919C true DK144919C (da) | 1982-11-22 |
Family
ID=21735359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK48471A DK144919C (da) | 1970-02-05 | 1971-02-04 | Stabil vandig sensibiliseringsoploesning og stamoploesning til fremstilling heraf |
Country Status (12)
Country | Link |
---|---|
US (1) | US3682671A (ja) |
JP (3) | JPS5237971B1 (ja) |
AT (1) | AT308487B (ja) |
CA (1) | CA931301A (ja) |
CH (1) | CH564094A5 (ja) |
DE (1) | DE2105898C3 (ja) |
DK (1) | DK144919C (ja) |
ES (1) | ES387979A1 (ja) |
FR (1) | FR2078132A5 (ja) |
GB (1) | GB1306201A (ja) |
NL (1) | NL165790C (ja) |
SE (1) | SE427189B (ja) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4662944A (en) * | 1972-07-11 | 1987-05-05 | Kollmorgen Technologies Corporation | Process and composition for sensitizing articles for metallization |
US3960573A (en) * | 1972-08-07 | 1976-06-01 | Photocircuits Division Of Kollmorgan Corporation | Novel precious metal sensitizing solutions |
CA1005808A (en) * | 1973-06-27 | 1977-02-22 | Shipley Company Inc. | Catalyst solution for electroless metal deposition on a substrate |
CA1021761A (en) * | 1973-08-01 | 1977-11-29 | Kollmorgen Corporation | Sensitizers for electroless metal deposition |
US3961109A (en) * | 1973-08-01 | 1976-06-01 | Photocircuits Division Of Kollmorgen Corporation | Sensitizers and process for electroless metal deposition |
US3993491A (en) * | 1973-12-07 | 1976-11-23 | Surface Technology, Inc. | Electroless plating |
US4004051A (en) * | 1974-02-15 | 1977-01-18 | Crown City Plating Company | Aqueous noble metal suspensions for one stage activation of nonconductors for electroless plating |
US3963841A (en) * | 1975-01-06 | 1976-06-15 | International Business Machines Corporation | Catalytic surface preparation for electroless plating |
US4239538A (en) * | 1976-03-30 | 1980-12-16 | Surface Technology, Inc. | Catalytic primer |
ZA77897B (en) * | 1976-04-13 | 1977-12-28 | Kollmorgen Corp | Liquid seeders and catalyzation processes for electroless metal deposition |
US4259113A (en) * | 1976-05-26 | 1981-03-31 | Kollmorgen Technologies Corporation | Composition for sensitizing articles for metallization |
US4066809A (en) * | 1976-06-28 | 1978-01-03 | International Business Machines Corporation | Method for preparing substrate surfaces for electroless deposition |
ZA774561B (en) * | 1976-09-20 | 1978-06-28 | Kollmorgen Tech Corp | Preparation of solid precious metal sensitizing compositions |
DE2659680C2 (de) * | 1976-12-30 | 1985-01-31 | Ibm Deutschland Gmbh, 7000 Stuttgart | Verfahren zum Aktivieren von Oberflächen |
IT1107840B (it) * | 1978-07-25 | 1985-12-02 | Alfachimici Spa | Soluzione catalitica per la deposizione anelettrica di metalli |
WO1983004268A1 (en) * | 1982-05-26 | 1983-12-08 | Macdermid Incorporated | Catalyst solutions for activating non-conductive substrates and electroless plating process |
DE3323476A1 (de) * | 1982-07-01 | 1984-01-05 | Kollmorgen Technologies Corp., 75201 Dallas, Tex. | Verbessertes verfahren zur galvanischen metallabscheidung auf nichtmetallischen oberflaechen |
US4610895A (en) * | 1984-02-01 | 1986-09-09 | Shipley Company Inc. | Process for metallizing plastics |
US4592929A (en) * | 1984-02-01 | 1986-06-03 | Shipley Company Inc. | Process for metallizing plastics |
US4717421A (en) * | 1986-04-28 | 1988-01-05 | Mcgean-Rohco, Inc. | Solid tin-palladium catalyst for electroless deposition incorporating stannous salts of organic acids |
DE3843903C1 (en) * | 1988-12-24 | 1990-06-28 | Deutsche Automobilgesellschaft Mbh, 3000 Hannover, De | Activation solution for electrically non-conductive plastic substrate surfaces and process for the preparation thereof and the use thereof |
DE3928500A1 (de) * | 1989-08-29 | 1991-03-14 | Deutsche Automobilgesellsch | Verfahren zum waschen und spuelen chemisch metallisierter substratbahnen |
US5418064A (en) * | 1992-11-16 | 1995-05-23 | Allied Signal Inc. | Electroless plating of substrates |
US5292557A (en) * | 1992-11-16 | 1994-03-08 | Allied-Signal Inc. | Electroless plating of substrates |
CA2222158C (en) * | 1993-03-18 | 2001-01-30 | Nayan Harsukhrai Joshi | Self accelerating and replenishing non-formaldehyde immersion coating method and composition |
US6261637B1 (en) * | 1995-12-15 | 2001-07-17 | Enthone-Omi, Inc. | Use of palladium immersion deposition to selectively initiate electroless plating on Ti and W alloys for wafer fabrication |
US5753304A (en) * | 1997-06-23 | 1998-05-19 | The Metal Arts Company, Inc. | Activation bath for electroless nickel plating |
PT1988192E (pt) | 2007-05-03 | 2013-01-24 | Atotech Deutschland Gmbh | Processo para aplicação de um revestimento metálico a um substrato não condutor |
JP5458758B2 (ja) * | 2009-09-11 | 2014-04-02 | 上村工業株式会社 | 触媒付与溶液並びにこれを用いた無電解めっき方法及びダイレクトプレーティング方法 |
EP2305856A1 (en) | 2009-09-28 | 2011-04-06 | ATOTECH Deutschland GmbH | Process for applying a metal coating to a non-conductive substrate |
EP2767614A1 (en) | 2013-02-13 | 2014-08-20 | ATOTECH Deutschland GmbH | Method for depositing a first metallic layer onto non-conductive polymers |
JP5649150B1 (ja) * | 2014-07-17 | 2015-01-07 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 無電解メッキ用前処理液および無電解メッキ方法 |
CZ309565B6 (cs) * | 2022-02-02 | 2023-04-12 | EGO 93 s.r.o | Senzibilační roztok a způsob jeho přípravy |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3011920A (en) * | 1959-06-08 | 1961-12-05 | Shipley Co | Method of electroless deposition on a substrate and catalyst solution therefor |
DE1446224B2 (de) * | 1960-09-01 | 1971-09-16 | Photocircuits Corp , Glen Cove, NY (V St A ) | Saure waessrige loesung zum sensibilisieren von oberflaechen zur anschliessenden stromlosen metallabscheidung |
GB1174851A (en) * | 1967-07-05 | 1969-12-17 | Technograph Ltd | Sensitization Process for Electroless Plating |
-
1970
- 1970-02-05 US US3682671D patent/US3682671A/en not_active Expired - Lifetime
- 1970-09-02 CA CA092191A patent/CA931301A/en not_active Expired
- 1970-09-25 JP JP8458070A patent/JPS5237971B1/ja active Pending
-
1971
- 1971-01-18 GB GB232771A patent/GB1306201A/en not_active Expired
- 1971-02-01 SE SE119871A patent/SE427189B/xx unknown
- 1971-02-01 AT AT81871A patent/AT308487B/de active
- 1971-02-01 CH CH142671A patent/CH564094A5/xx not_active IP Right Cessation
- 1971-02-03 FR FR7103580A patent/FR2078132A5/fr not_active Expired
- 1971-02-04 DE DE2105898A patent/DE2105898C3/de not_active Expired
- 1971-02-04 DK DK48471A patent/DK144919C/da not_active IP Right Cessation
- 1971-02-05 ES ES387979A patent/ES387979A1/es not_active Expired
- 1971-02-05 NL NL7101596A patent/NL165790C/xx not_active IP Right Cessation
-
1974
- 1974-01-11 JP JP696074A patent/JPS5426495B1/ja active Pending
- 1974-01-11 JP JP696174A patent/JPS5373429A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPS5373429A (en) | 1978-06-29 |
GB1306201A (ja) | 1973-02-07 |
NL165790C (nl) | 1981-05-15 |
DE2105898A1 (de) | 1971-09-02 |
JPS5237971B1 (ja) | 1977-09-26 |
AT308487B (de) | 1973-07-10 |
CH564094A5 (ja) | 1975-07-15 |
JPS5426495B1 (ja) | 1979-09-04 |
FR2078132A5 (ja) | 1971-11-05 |
NL165790B (nl) | 1980-12-15 |
ES387979A1 (es) | 1973-06-01 |
DE2105898B2 (de) | 1975-07-31 |
CA931301A (en) | 1973-08-07 |
US3682671A (en) | 1972-08-08 |
DE2105898C3 (de) | 1982-08-19 |
DK144919B (da) | 1982-07-05 |
SE427189B (sv) | 1983-03-14 |
NL7101596A (ja) | 1971-08-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUP | Patent expired |