DK0816018T3 - Polerskivebærer og fremgangsmåde til polering - Google Patents

Polerskivebærer og fremgangsmåde til polering

Info

Publication number
DK0816018T3
DK0816018T3 DK97401394T DK97401394T DK0816018T3 DK 0816018 T3 DK0816018 T3 DK 0816018T3 DK 97401394 T DK97401394 T DK 97401394T DK 97401394 T DK97401394 T DK 97401394T DK 0816018 T3 DK0816018 T3 DK 0816018T3
Authority
DK
Denmark
Prior art keywords
layer
polishing
disc
softer
disc carrier
Prior art date
Application number
DK97401394T
Other languages
Danish (da)
English (en)
Inventor
Georges Henri Broido
Original Assignee
Lam Plan Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Plan Sa filed Critical Lam Plan Sa
Application granted granted Critical
Publication of DK0816018T3 publication Critical patent/DK0816018T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DK97401394T 1996-06-28 1997-06-18 Polerskivebærer og fremgangsmåde til polering DK0816018T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9608076A FR2750354B1 (fr) 1996-06-28 1996-06-28 Support de disque de polissage et procede de polissage

Publications (1)

Publication Number Publication Date
DK0816018T3 true DK0816018T3 (da) 1999-12-06

Family

ID=9493524

Family Applications (1)

Application Number Title Priority Date Filing Date
DK97401394T DK0816018T3 (da) 1996-06-28 1997-06-18 Polerskivebærer og fremgangsmåde til polering

Country Status (10)

Country Link
US (1) US6048261A (fr)
EP (1) EP0816018B1 (fr)
JP (1) JPH1076471A (fr)
AT (1) ATE182829T1 (fr)
CA (1) CA2208430A1 (fr)
DE (2) DE69700374T4 (fr)
DK (1) DK0816018T3 (fr)
ES (1) ES2136460T3 (fr)
FR (1) FR2750354B1 (fr)
ZA (1) ZA975747B (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20106228U1 (de) 2001-04-09 2001-06-28 Jobra Metall GmbH, 84056 Rottenburg Trägerteller für Lamellenschleifscheiben
EP2939788A1 (fr) * 2010-10-05 2015-11-04 Black & Decker Inc. Disque abrasif universel

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2747343A (en) * 1954-09-02 1956-05-29 Contur Abrasive Company Inc Abrasive articles and the like and holders therefor
DE2013896A1 (en) * 1970-03-23 1971-10-14 Alkor Werk, Karl Lissmann KG, 8000 München Semiconductor lapping machine
JPH01193166A (ja) * 1988-01-28 1989-08-03 Showa Denko Kk 半導体ウェハ鏡面研磨用パッド
US5564965A (en) * 1993-12-14 1996-10-15 Shin-Etsu Handotai Co., Ltd. Polishing member and wafer polishing apparatus
KR0165748B1 (ko) * 1994-05-10 1999-03-20 유미꾸라 레이이찌 불소계 수지 발포체 및 그의 제조 방법
JPH09321001A (ja) * 1996-05-31 1997-12-12 Komatsu Electron Metals Co Ltd 半導体ウェハの研磨方法
JP2738392B1 (ja) * 1996-11-05 1998-04-08 日本電気株式会社 半導体装置の研磨装置及び研磨方法

Also Published As

Publication number Publication date
US6048261A (en) 2000-04-11
JPH1076471A (ja) 1998-03-24
ATE182829T1 (de) 1999-08-15
FR2750354B1 (fr) 1998-08-07
DE69700374T2 (de) 1999-11-25
DE69700374D1 (de) 1999-09-09
ES2136460T3 (es) 1999-11-16
CA2208430A1 (fr) 1997-12-28
EP0816018B1 (fr) 1999-08-04
ZA975747B (en) 1998-12-28
EP0816018A1 (fr) 1998-01-07
FR2750354A1 (fr) 1998-01-02
DE69700374T4 (de) 2000-04-06

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