DE8912914U1 - Leiteranordnung aus gestanzten Leiterbahnen - Google Patents

Leiteranordnung aus gestanzten Leiterbahnen

Info

Publication number
DE8912914U1
DE8912914U1 DE8912914U DE8912914U DE8912914U1 DE 8912914 U1 DE8912914 U1 DE 8912914U1 DE 8912914 U DE8912914 U DE 8912914U DE 8912914 U DE8912914 U DE 8912914U DE 8912914 U1 DE8912914 U1 DE 8912914U1
Authority
DE
Germany
Prior art keywords
conductor
punched
tracks
arrangement according
conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8912914U
Other languages
German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ivo Irion & Vosseler & Co 7730 Villingen-Schwenningen De GmbH
Original Assignee
Ivo Irion & Vosseler & Co 7730 Villingen-Schwenningen De GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ivo Irion & Vosseler & Co 7730 Villingen-Schwenningen De GmbH filed Critical Ivo Irion & Vosseler & Co 7730 Villingen-Schwenningen De GmbH
Priority to DE8912914U priority Critical patent/DE8912914U1/de
Publication of DE8912914U1 publication Critical patent/DE8912914U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/026—Multiple connections subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0391—Using different types of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
DE8912914U 1989-11-02 1989-11-02 Leiteranordnung aus gestanzten Leiterbahnen Expired - Lifetime DE8912914U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8912914U DE8912914U1 (de) 1989-11-02 1989-11-02 Leiteranordnung aus gestanzten Leiterbahnen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE8912914U DE8912914U1 (de) 1989-11-02 1989-11-02 Leiteranordnung aus gestanzten Leiterbahnen

Publications (1)

Publication Number Publication Date
DE8912914U1 true DE8912914U1 (de) 1989-12-28

Family

ID=6844201

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8912914U Expired - Lifetime DE8912914U1 (de) 1989-11-02 1989-11-02 Leiteranordnung aus gestanzten Leiterbahnen

Country Status (1)

Country Link
DE (1) DE8912914U1 (zh)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0634888A1 (de) * 1993-07-15 1995-01-18 Siemens Aktiengesellschaft Steckbare Baugruppe, insbesondere Relaismodul für Kraftfahrzeuge
DE4327584A1 (de) * 1993-08-17 1995-02-23 Bayerische Motoren Werke Ag Elektrische Antriebseinheit
WO1996008023A1 (de) * 1994-09-09 1996-03-14 Siemens Aktiengesellschaft Verfahren zur kontaktierung von starkstrom-anschlusselementen eines elektrischen bauelementes und unter anwendung dieses verfahrens hergestellte baugruppe
EP0722264A2 (en) * 1995-01-13 1996-07-17 Kabushiki Kaisha Toshiba Circuit board & circuit board assembly
DE19615432A1 (de) * 1996-04-19 1997-10-23 Abb Patent Gmbh Montageplatte
DE19707709C1 (de) * 1997-02-26 1998-04-16 Siemens Ag Leiterplatte für elektrische Schaltungen und Verfahren zur Herstellung einer solchen Leiterplatte, sowie Anordnung einer Leiterplatte auf einem Stecksockel
DE10101957A1 (de) * 2001-01-17 2002-07-18 Delphi Tech Inc Elektromechanisches Bauteil
DE10154234A1 (de) * 2001-11-07 2003-05-22 Kostal Leopold Gmbh & Co Kg Anordnung bestehend aus einem paneelartig aufgebauten Modul und aus einer Anschlußeinheit, Anschlußeinheit für eine solche Anordnung, Verfahren zum Erstellen einer solchen Anordnung sowie Vorrichtung zum Herstellen einer solchen Anordnung
DE10226766A1 (de) * 2002-06-14 2004-01-29 Gerhard Geiger Gmbh & Co Antriebsvorrichtung
DE4436523B4 (de) * 1994-10-13 2007-04-26 Siemens Ag Verfahren zur Herstellung eines elektronischen Gerätes und Drehzahlsensor mit einer elektronischen Schaltung
DE4404986B4 (de) * 1994-02-17 2008-08-21 Robert Bosch Gmbh Einrichtung zur Kontaktierung elektrischer Leiter sowie Verfahren zur Herstellung einer derartigen Einrichtung
DE102005049975B4 (de) * 2005-10-17 2008-11-27 Kiekert Ag Komponententräger mit einem Leiterbahngebilde
DE102008055836A1 (de) 2008-11-04 2010-05-12 Tyco Electronics Amp Gmbh Bauteilträger
DE102011102484A1 (de) * 2011-05-24 2012-11-29 Jumatech Gmbh Leiterplatte mit Formteil und Verfahren zu dessen Herstellung

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0634888A1 (de) * 1993-07-15 1995-01-18 Siemens Aktiengesellschaft Steckbare Baugruppe, insbesondere Relaismodul für Kraftfahrzeuge
US5446626A (en) * 1993-07-15 1995-08-29 Siemens Aktiengesellschaft Pluggable assembly, particularly a relay module for motor vehicles
DE4327584A1 (de) * 1993-08-17 1995-02-23 Bayerische Motoren Werke Ag Elektrische Antriebseinheit
DE4404986B4 (de) * 1994-02-17 2008-08-21 Robert Bosch Gmbh Einrichtung zur Kontaktierung elektrischer Leiter sowie Verfahren zur Herstellung einer derartigen Einrichtung
WO1996008023A1 (de) * 1994-09-09 1996-03-14 Siemens Aktiengesellschaft Verfahren zur kontaktierung von starkstrom-anschlusselementen eines elektrischen bauelementes und unter anwendung dieses verfahrens hergestellte baugruppe
US5847937A (en) * 1994-09-09 1998-12-08 Siemens Aktiengesellschaft Method for contacting high-current connecting elements of an electrical component, and assembly made by such a method
DE4436523B4 (de) * 1994-10-13 2007-04-26 Siemens Ag Verfahren zur Herstellung eines elektronischen Gerätes und Drehzahlsensor mit einer elektronischen Schaltung
EP0722264A2 (en) * 1995-01-13 1996-07-17 Kabushiki Kaisha Toshiba Circuit board & circuit board assembly
EP0722264A3 (en) * 1995-01-13 1997-12-29 Kabushiki Kaisha Toshiba Circuit board & circuit board assembly
DE19615432A1 (de) * 1996-04-19 1997-10-23 Abb Patent Gmbh Montageplatte
EP0863530A2 (de) * 1997-02-26 1998-09-09 Siemens Aktiengesellschaft Leiterplatte für elektrische Schaltungen und Verfahren zur Herstellung einer solchen Leiterplatte
US6049043A (en) * 1997-02-26 2000-04-11 Siemens Aktiengesellschaft Printed circuit board
EP0863530A3 (de) * 1997-02-26 1999-05-06 Siemens Aktiengesellschaft Leiterplatte für elektrische Schaltungen und Verfahren zur Herstellung einer solchen Leiterplatte
DE19707709C1 (de) * 1997-02-26 1998-04-16 Siemens Ag Leiterplatte für elektrische Schaltungen und Verfahren zur Herstellung einer solchen Leiterplatte, sowie Anordnung einer Leiterplatte auf einem Stecksockel
DE10101957A1 (de) * 2001-01-17 2002-07-18 Delphi Tech Inc Elektromechanisches Bauteil
DE10154234A1 (de) * 2001-11-07 2003-05-22 Kostal Leopold Gmbh & Co Kg Anordnung bestehend aus einem paneelartig aufgebauten Modul und aus einer Anschlußeinheit, Anschlußeinheit für eine solche Anordnung, Verfahren zum Erstellen einer solchen Anordnung sowie Vorrichtung zum Herstellen einer solchen Anordnung
US7002813B2 (en) 2001-11-07 2006-02-21 Leopold Kostal Gmbh & Co. Kg Assembly comprised of a panel-like constructed module and of a connection unit, production method and device
DE10226766A1 (de) * 2002-06-14 2004-01-29 Gerhard Geiger Gmbh & Co Antriebsvorrichtung
DE10226766B4 (de) * 2002-06-14 2007-01-18 Gerhard Geiger Gmbh & Co Antriebsvorrichtung
DE102005049975B4 (de) * 2005-10-17 2008-11-27 Kiekert Ag Komponententräger mit einem Leiterbahngebilde
DE102005049975C5 (de) * 2005-10-17 2011-07-28 Kiekert AG, 42579 Komponententräger mit einem Leiterbahngebilde
EP1776003B1 (de) * 2005-10-17 2014-10-01 Kiekert Aktiengesellschaft Kraftfahrzeugtürverschluss
DE102008055836A1 (de) 2008-11-04 2010-05-12 Tyco Electronics Amp Gmbh Bauteilträger
WO2010052202A1 (en) * 2008-11-04 2010-05-14 Tyco Electronics Amp Gmbh Component support
DE102008055836B4 (de) * 2008-11-04 2010-08-19 Tyco Electronics Amp Gmbh Bauteilträger
DE102011102484A1 (de) * 2011-05-24 2012-11-29 Jumatech Gmbh Leiterplatte mit Formteil und Verfahren zu dessen Herstellung
DE102011102484B4 (de) * 2011-05-24 2020-03-05 Jumatech Gmbh Leiterplatte mit Formteil und Verfahren zu dessen Herstellung
US10736214B2 (en) 2011-05-24 2020-08-04 Jumatech Gmbh Printed circuit board having a molded part and method for the production thereof

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