DE8912914U1 - Leiteranordnung aus gestanzten Leiterbahnen - Google Patents
Leiteranordnung aus gestanzten LeiterbahnenInfo
- Publication number
- DE8912914U1 DE8912914U1 DE8912914U DE8912914U DE8912914U1 DE 8912914 U1 DE8912914 U1 DE 8912914U1 DE 8912914 U DE8912914 U DE 8912914U DE 8912914 U DE8912914 U DE 8912914U DE 8912914 U1 DE8912914 U1 DE 8912914U1
- Authority
- DE
- Germany
- Prior art keywords
- conductor
- punched
- tracks
- arrangement according
- conductors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 title claims description 86
- 238000000034 method Methods 0.000 claims description 13
- 239000000969 carrier Substances 0.000 claims description 12
- 210000002105 tongue Anatomy 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000012815 thermoplastic material Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 239000013067 intermediate product Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/026—Multiple connections subassemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0352—Differences between the conductors of different layers of a multilayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0391—Using different types of conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE8912914U DE8912914U1 (de) | 1989-11-02 | 1989-11-02 | Leiteranordnung aus gestanzten Leiterbahnen |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE8912914U DE8912914U1 (de) | 1989-11-02 | 1989-11-02 | Leiteranordnung aus gestanzten Leiterbahnen |
Publications (1)
Publication Number | Publication Date |
---|---|
DE8912914U1 true DE8912914U1 (de) | 1989-12-28 |
Family
ID=6844201
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8912914U Expired - Lifetime DE8912914U1 (de) | 1989-11-02 | 1989-11-02 | Leiteranordnung aus gestanzten Leiterbahnen |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE8912914U1 (zh) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0634888A1 (de) * | 1993-07-15 | 1995-01-18 | Siemens Aktiengesellschaft | Steckbare Baugruppe, insbesondere Relaismodul für Kraftfahrzeuge |
DE4327584A1 (de) * | 1993-08-17 | 1995-02-23 | Bayerische Motoren Werke Ag | Elektrische Antriebseinheit |
WO1996008023A1 (de) * | 1994-09-09 | 1996-03-14 | Siemens Aktiengesellschaft | Verfahren zur kontaktierung von starkstrom-anschlusselementen eines elektrischen bauelementes und unter anwendung dieses verfahrens hergestellte baugruppe |
EP0722264A2 (en) * | 1995-01-13 | 1996-07-17 | Kabushiki Kaisha Toshiba | Circuit board & circuit board assembly |
DE19615432A1 (de) * | 1996-04-19 | 1997-10-23 | Abb Patent Gmbh | Montageplatte |
DE19707709C1 (de) * | 1997-02-26 | 1998-04-16 | Siemens Ag | Leiterplatte für elektrische Schaltungen und Verfahren zur Herstellung einer solchen Leiterplatte, sowie Anordnung einer Leiterplatte auf einem Stecksockel |
DE10101957A1 (de) * | 2001-01-17 | 2002-07-18 | Delphi Tech Inc | Elektromechanisches Bauteil |
DE10154234A1 (de) * | 2001-11-07 | 2003-05-22 | Kostal Leopold Gmbh & Co Kg | Anordnung bestehend aus einem paneelartig aufgebauten Modul und aus einer Anschlußeinheit, Anschlußeinheit für eine solche Anordnung, Verfahren zum Erstellen einer solchen Anordnung sowie Vorrichtung zum Herstellen einer solchen Anordnung |
DE10226766A1 (de) * | 2002-06-14 | 2004-01-29 | Gerhard Geiger Gmbh & Co | Antriebsvorrichtung |
DE4436523B4 (de) * | 1994-10-13 | 2007-04-26 | Siemens Ag | Verfahren zur Herstellung eines elektronischen Gerätes und Drehzahlsensor mit einer elektronischen Schaltung |
DE4404986B4 (de) * | 1994-02-17 | 2008-08-21 | Robert Bosch Gmbh | Einrichtung zur Kontaktierung elektrischer Leiter sowie Verfahren zur Herstellung einer derartigen Einrichtung |
DE102005049975B4 (de) * | 2005-10-17 | 2008-11-27 | Kiekert Ag | Komponententräger mit einem Leiterbahngebilde |
DE102008055836A1 (de) | 2008-11-04 | 2010-05-12 | Tyco Electronics Amp Gmbh | Bauteilträger |
DE102011102484A1 (de) * | 2011-05-24 | 2012-11-29 | Jumatech Gmbh | Leiterplatte mit Formteil und Verfahren zu dessen Herstellung |
-
1989
- 1989-11-02 DE DE8912914U patent/DE8912914U1/de not_active Expired - Lifetime
Cited By (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0634888A1 (de) * | 1993-07-15 | 1995-01-18 | Siemens Aktiengesellschaft | Steckbare Baugruppe, insbesondere Relaismodul für Kraftfahrzeuge |
US5446626A (en) * | 1993-07-15 | 1995-08-29 | Siemens Aktiengesellschaft | Pluggable assembly, particularly a relay module for motor vehicles |
DE4327584A1 (de) * | 1993-08-17 | 1995-02-23 | Bayerische Motoren Werke Ag | Elektrische Antriebseinheit |
DE4404986B4 (de) * | 1994-02-17 | 2008-08-21 | Robert Bosch Gmbh | Einrichtung zur Kontaktierung elektrischer Leiter sowie Verfahren zur Herstellung einer derartigen Einrichtung |
WO1996008023A1 (de) * | 1994-09-09 | 1996-03-14 | Siemens Aktiengesellschaft | Verfahren zur kontaktierung von starkstrom-anschlusselementen eines elektrischen bauelementes und unter anwendung dieses verfahrens hergestellte baugruppe |
US5847937A (en) * | 1994-09-09 | 1998-12-08 | Siemens Aktiengesellschaft | Method for contacting high-current connecting elements of an electrical component, and assembly made by such a method |
DE4436523B4 (de) * | 1994-10-13 | 2007-04-26 | Siemens Ag | Verfahren zur Herstellung eines elektronischen Gerätes und Drehzahlsensor mit einer elektronischen Schaltung |
EP0722264A2 (en) * | 1995-01-13 | 1996-07-17 | Kabushiki Kaisha Toshiba | Circuit board & circuit board assembly |
EP0722264A3 (en) * | 1995-01-13 | 1997-12-29 | Kabushiki Kaisha Toshiba | Circuit board & circuit board assembly |
DE19615432A1 (de) * | 1996-04-19 | 1997-10-23 | Abb Patent Gmbh | Montageplatte |
EP0863530A2 (de) * | 1997-02-26 | 1998-09-09 | Siemens Aktiengesellschaft | Leiterplatte für elektrische Schaltungen und Verfahren zur Herstellung einer solchen Leiterplatte |
US6049043A (en) * | 1997-02-26 | 2000-04-11 | Siemens Aktiengesellschaft | Printed circuit board |
EP0863530A3 (de) * | 1997-02-26 | 1999-05-06 | Siemens Aktiengesellschaft | Leiterplatte für elektrische Schaltungen und Verfahren zur Herstellung einer solchen Leiterplatte |
DE19707709C1 (de) * | 1997-02-26 | 1998-04-16 | Siemens Ag | Leiterplatte für elektrische Schaltungen und Verfahren zur Herstellung einer solchen Leiterplatte, sowie Anordnung einer Leiterplatte auf einem Stecksockel |
DE10101957A1 (de) * | 2001-01-17 | 2002-07-18 | Delphi Tech Inc | Elektromechanisches Bauteil |
DE10154234A1 (de) * | 2001-11-07 | 2003-05-22 | Kostal Leopold Gmbh & Co Kg | Anordnung bestehend aus einem paneelartig aufgebauten Modul und aus einer Anschlußeinheit, Anschlußeinheit für eine solche Anordnung, Verfahren zum Erstellen einer solchen Anordnung sowie Vorrichtung zum Herstellen einer solchen Anordnung |
US7002813B2 (en) | 2001-11-07 | 2006-02-21 | Leopold Kostal Gmbh & Co. Kg | Assembly comprised of a panel-like constructed module and of a connection unit, production method and device |
DE10226766A1 (de) * | 2002-06-14 | 2004-01-29 | Gerhard Geiger Gmbh & Co | Antriebsvorrichtung |
DE10226766B4 (de) * | 2002-06-14 | 2007-01-18 | Gerhard Geiger Gmbh & Co | Antriebsvorrichtung |
DE102005049975B4 (de) * | 2005-10-17 | 2008-11-27 | Kiekert Ag | Komponententräger mit einem Leiterbahngebilde |
DE102005049975C5 (de) * | 2005-10-17 | 2011-07-28 | Kiekert AG, 42579 | Komponententräger mit einem Leiterbahngebilde |
EP1776003B1 (de) * | 2005-10-17 | 2014-10-01 | Kiekert Aktiengesellschaft | Kraftfahrzeugtürverschluss |
DE102008055836A1 (de) | 2008-11-04 | 2010-05-12 | Tyco Electronics Amp Gmbh | Bauteilträger |
WO2010052202A1 (en) * | 2008-11-04 | 2010-05-14 | Tyco Electronics Amp Gmbh | Component support |
DE102008055836B4 (de) * | 2008-11-04 | 2010-08-19 | Tyco Electronics Amp Gmbh | Bauteilträger |
DE102011102484A1 (de) * | 2011-05-24 | 2012-11-29 | Jumatech Gmbh | Leiterplatte mit Formteil und Verfahren zu dessen Herstellung |
DE102011102484B4 (de) * | 2011-05-24 | 2020-03-05 | Jumatech Gmbh | Leiterplatte mit Formteil und Verfahren zu dessen Herstellung |
US10736214B2 (en) | 2011-05-24 | 2020-08-04 | Jumatech Gmbh | Printed circuit board having a molded part and method for the production thereof |
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