DE8703604U1 - Kühlkörper mit Halbleiterschalter - Google Patents
Kühlkörper mit HalbleiterschalterInfo
- Publication number
- DE8703604U1 DE8703604U1 DE8703604U DE8703604U DE8703604U1 DE 8703604 U1 DE8703604 U1 DE 8703604U1 DE 8703604 U DE8703604 U DE 8703604U DE 8703604 U DE8703604 U DE 8703604U DE 8703604 U1 DE8703604 U1 DE 8703604U1
- Authority
- DE
- Germany
- Prior art keywords
- heat sink
- semiconductor switch
- ing
- sink according
- dipl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title claims description 24
- 238000001816 cooling Methods 0.000 claims description 13
- 229910001385 heavy metal Inorganic materials 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 8
- 238000013016 damping Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- 238000005516 engineering process Methods 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 238000003801 milling Methods 0.000 claims 1
- 230000005284 excitation Effects 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000011358 absorbing material Substances 0.000 description 2
- UNILWMWFPHPYOR-KXEYIPSPSA-M 1-[6-[2-[3-[3-[3-[2-[2-[3-[[2-[2-[[(2r)-1-[[2-[[(2r)-1-[3-[2-[2-[3-[[2-(2-amino-2-oxoethoxy)acetyl]amino]propoxy]ethoxy]ethoxy]propylamino]-3-hydroxy-1-oxopropan-2-yl]amino]-2-oxoethyl]amino]-3-[(2r)-2,3-di(hexadecanoyloxy)propyl]sulfanyl-1-oxopropan-2-yl Chemical compound O=C1C(SCCC(=O)NCCCOCCOCCOCCCNC(=O)COCC(=O)N[C@@H](CSC[C@@H](COC(=O)CCCCCCCCCCCCCCC)OC(=O)CCCCCCCCCCCCCCC)C(=O)NCC(=O)N[C@H](CO)C(=O)NCCCOCCOCCOCCCNC(=O)COCC(N)=O)CC(=O)N1CCNC(=O)CCCCCN\1C2=CC=C(S([O-])(=O)=O)C=C2CC/1=C/C=C/C=C/C1=[N+](CC)C2=CC=C(S([O-])(=O)=O)C=C2C1 UNILWMWFPHPYOR-KXEYIPSPSA-M 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE8703604U DE8703604U1 (de) | 1987-03-11 | 1987-03-11 | Kühlkörper mit Halbleiterschalter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE8703604U DE8703604U1 (de) | 1987-03-11 | 1987-03-11 | Kühlkörper mit Halbleiterschalter |
Publications (1)
Publication Number | Publication Date |
---|---|
DE8703604U1 true DE8703604U1 (de) | 1988-07-21 |
Family
ID=6805672
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8703604U Expired DE8703604U1 (de) | 1987-03-11 | 1987-03-11 | Kühlkörper mit Halbleiterschalter |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE8703604U1 (es) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009037259A1 (de) * | 2009-08-12 | 2011-02-17 | Semikron Elektronik Gmbh & Co. Kg | Anordnung mit einer Kühleinrichtung und einem Leistungshalbleitermodul |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1764231A1 (de) * | 1967-05-24 | 1971-07-01 | Comp Generale Electricite | Halbleiter-Bauelement und Verfahren zu dessen Herstellung |
DE2211513A1 (de) * | 1971-07-30 | 1973-02-08 | Stanley Electric Co Ltd | Halbleiterelement mit radiator |
GB2079052A (en) * | 1980-06-30 | 1982-01-13 | Alusuisse | Cooling bodies for semiconductors or the like |
DE8118336U1 (de) * | 1982-04-29 | Robert Bosch Gmbh, 7000 Stuttgart | "Halbleitergleichrichter" | |
DE3127457A1 (de) * | 1981-07-11 | 1983-02-03 | Brown, Boveri & Cie Ag, 6800 Mannheim | Stromrichtermodul |
-
1987
- 1987-03-11 DE DE8703604U patent/DE8703604U1/de not_active Expired
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE8118336U1 (de) * | 1982-04-29 | Robert Bosch Gmbh, 7000 Stuttgart | "Halbleitergleichrichter" | |
DE1764231A1 (de) * | 1967-05-24 | 1971-07-01 | Comp Generale Electricite | Halbleiter-Bauelement und Verfahren zu dessen Herstellung |
DE2211513A1 (de) * | 1971-07-30 | 1973-02-08 | Stanley Electric Co Ltd | Halbleiterelement mit radiator |
GB2079052A (en) * | 1980-06-30 | 1982-01-13 | Alusuisse | Cooling bodies for semiconductors or the like |
DE3127457A1 (de) * | 1981-07-11 | 1983-02-03 | Brown, Boveri & Cie Ag, 6800 Mannheim | Stromrichtermodul |
Non-Patent Citations (1)
Title |
---|
DE-Z: Elektrie, 1969, H. 2, S. 68 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009037259A1 (de) * | 2009-08-12 | 2011-02-17 | Semikron Elektronik Gmbh & Co. Kg | Anordnung mit einer Kühleinrichtung und einem Leistungshalbleitermodul |
DE102009037259B4 (de) * | 2009-08-12 | 2012-04-19 | Semikron Elektronik Gmbh & Co. Kg | Anordnung mit einer Kühleinrichtung und einem Leistungshalbleitermodul |
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