DE7915004U1 - Steckverbindungsanordnung - Google Patents
SteckverbindungsanordnungInfo
- Publication number
- DE7915004U1 DE7915004U1 DE19797915004 DE7915004U DE7915004U1 DE 7915004 U1 DE7915004 U1 DE 7915004U1 DE 19797915004 DE19797915004 DE 19797915004 DE 7915004 U DE7915004 U DE 7915004U DE 7915004 U1 DE7915004 U1 DE 7915004U1
- Authority
- DE
- Germany
- Prior art keywords
- contact
- carrier
- base
- arrangement according
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 16
- 239000000919 ceramic Substances 0.000 claims description 13
- 230000010354 integration Effects 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000013024 troubleshooting Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
- H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Connecting Device With Holders (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US90815278A | 1978-05-22 | 1978-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE7915004U1 true DE7915004U1 (de) | 1979-10-31 |
Family
ID=25425284
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19797915004 Expired DE7915004U1 (de) | 1978-05-22 | 1979-05-21 | Steckverbindungsanordnung |
| DE19792920943 Granted DE2920943A1 (de) | 1978-05-22 | 1979-05-21 | Steckverbindungsanordnung |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19792920943 Granted DE2920943A1 (de) | 1978-05-22 | 1979-05-21 | Steckverbindungsanordnung |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS54153570A (enrdf_load_stackoverflow) |
| CA (1) | CA1116708A (enrdf_load_stackoverflow) |
| DE (2) | DE7915004U1 (enrdf_load_stackoverflow) |
| FR (1) | FR2427029A1 (enrdf_load_stackoverflow) |
| GB (1) | GB2021878B (enrdf_load_stackoverflow) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2479563A1 (fr) * | 1980-03-26 | 1981-10-02 | Ouest Electronic Connecteurs | Etrier de verrouillage pour circuit integre |
| US4351580A (en) * | 1980-05-15 | 1982-09-28 | Augat Inc. | Carrier socket for leadless integrated circuit devices |
| US4359252A (en) | 1980-09-08 | 1982-11-16 | Amp Incorporated | Socket for a bubble memory package |
| JPS5826152B2 (ja) * | 1980-11-14 | 1983-06-01 | 日本電信電話株式会社 | 多極コネクタ |
| US4491377A (en) * | 1982-04-19 | 1985-01-01 | Pfaff Wayne | Mounting housing for leadless chip carrier |
| US4620761A (en) * | 1985-01-30 | 1986-11-04 | Texas Instruments Incorporated | High density chip socket |
| US4761140A (en) * | 1987-02-20 | 1988-08-02 | Augat Inc. | Minimum insertion force self-cleaning anti-overstress PLCC receiving socket |
| JPH02113574U (enrdf_load_stackoverflow) * | 1989-02-28 | 1990-09-11 | ||
| JPH02113575U (enrdf_load_stackoverflow) * | 1989-02-28 | 1990-09-11 | ||
| JPH02113573U (enrdf_load_stackoverflow) * | 1989-02-28 | 1990-09-11 | ||
| JPH0675416B2 (ja) * | 1991-12-20 | 1994-09-21 | 山一電機株式会社 | 接続器 |
| DE102005048450B4 (de) * | 2005-10-07 | 2010-07-15 | Eads Deutschland Gmbh | Sensor mit einem auswechselbaren Sensorelement, insbesondere Drucksensor |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE789688A (fr) * | 1971-10-06 | 1973-04-04 | Amp Inc | Connecteur |
| US3831131A (en) * | 1971-11-08 | 1974-08-20 | Bunker Ramo | Integrated circuit package connectors |
| US3999827A (en) * | 1975-10-10 | 1976-12-28 | Burroughs Corporation | Electrical connector for semiconductor device package |
-
1979
- 1979-04-18 CA CA000325654A patent/CA1116708A/en not_active Expired
- 1979-05-21 DE DE19797915004 patent/DE7915004U1/de not_active Expired
- 1979-05-21 GB GB7917547A patent/GB2021878B/en not_active Expired
- 1979-05-21 DE DE19792920943 patent/DE2920943A1/de active Granted
- 1979-05-21 FR FR7912858A patent/FR2427029A1/fr active Granted
- 1979-05-21 JP JP6255879A patent/JPS54153570A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6225262B2 (enrdf_load_stackoverflow) | 1987-06-02 |
| JPS54153570A (en) | 1979-12-03 |
| GB2021878A (en) | 1979-12-05 |
| DE2920943C2 (enrdf_load_stackoverflow) | 1989-06-08 |
| GB2021878B (en) | 1983-02-23 |
| DE2920943A1 (de) | 1979-11-29 |
| FR2427029B1 (enrdf_load_stackoverflow) | 1985-01-25 |
| CA1116708A (en) | 1982-01-19 |
| FR2427029A1 (fr) | 1979-12-21 |
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