FR2427029A1 - Dispositif de connexion, pour un element a circuits integres du type lsi - Google Patents
Dispositif de connexion, pour un element a circuits integres du type lsiInfo
- Publication number
- FR2427029A1 FR2427029A1 FR7912858A FR7912858A FR2427029A1 FR 2427029 A1 FR2427029 A1 FR 2427029A1 FR 7912858 A FR7912858 A FR 7912858A FR 7912858 A FR7912858 A FR 7912858A FR 2427029 A1 FR2427029 A1 FR 2427029A1
- Authority
- FR
- France
- Prior art keywords
- integrated circuit
- plate
- circuit element
- base
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012423 maintenance Methods 0.000 abstract 1
- 238000005259 measurement Methods 0.000 abstract 1
- 238000004377 microelectronic Methods 0.000 abstract 1
- 230000000284 resting effect Effects 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000009423 ventilation Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
- H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Connecting Device With Holders (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US90815278A | 1978-05-22 | 1978-05-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2427029A1 true FR2427029A1 (fr) | 1979-12-21 |
FR2427029B1 FR2427029B1 (enrdf_load_stackoverflow) | 1985-01-25 |
Family
ID=25425284
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7912858A Granted FR2427029A1 (fr) | 1978-05-22 | 1979-05-21 | Dispositif de connexion, pour un element a circuits integres du type lsi |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS54153570A (enrdf_load_stackoverflow) |
CA (1) | CA1116708A (enrdf_load_stackoverflow) |
DE (2) | DE2920943A1 (enrdf_load_stackoverflow) |
FR (1) | FR2427029A1 (enrdf_load_stackoverflow) |
GB (1) | GB2021878B (enrdf_load_stackoverflow) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2479563A1 (fr) * | 1980-03-26 | 1981-10-02 | Ouest Electronic Connecteurs | Etrier de verrouillage pour circuit integre |
US4351580A (en) * | 1980-05-15 | 1982-09-28 | Augat Inc. | Carrier socket for leadless integrated circuit devices |
US4359252A (en) | 1980-09-08 | 1982-11-16 | Amp Incorporated | Socket for a bubble memory package |
JPS5826152B2 (ja) * | 1980-11-14 | 1983-06-01 | 日本電信電話株式会社 | 多極コネクタ |
US4491377A (en) * | 1982-04-19 | 1985-01-01 | Pfaff Wayne | Mounting housing for leadless chip carrier |
US4620761A (en) * | 1985-01-30 | 1986-11-04 | Texas Instruments Incorporated | High density chip socket |
US4761140A (en) * | 1987-02-20 | 1988-08-02 | Augat Inc. | Minimum insertion force self-cleaning anti-overstress PLCC receiving socket |
JPH02113575U (enrdf_load_stackoverflow) * | 1989-02-28 | 1990-09-11 | ||
JPH02113573U (enrdf_load_stackoverflow) * | 1989-02-28 | 1990-09-11 | ||
JPH02113574U (enrdf_load_stackoverflow) * | 1989-02-28 | 1990-09-11 | ||
JPH0675416B2 (ja) * | 1991-12-20 | 1994-09-21 | 山一電機株式会社 | 接続器 |
DE102005048450B4 (de) * | 2005-10-07 | 2010-07-15 | Eads Deutschland Gmbh | Sensor mit einem auswechselbaren Sensorelement, insbesondere Drucksensor |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2159337A1 (enrdf_load_stackoverflow) * | 1971-11-08 | 1973-06-22 | Bunker Ramo | |
US3999827A (en) * | 1975-10-10 | 1976-12-28 | Burroughs Corporation | Electrical connector for semiconductor device package |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE789688A (fr) * | 1971-10-06 | 1973-04-04 | Amp Inc | Connecteur |
-
1979
- 1979-04-18 CA CA000325654A patent/CA1116708A/en not_active Expired
- 1979-05-21 FR FR7912858A patent/FR2427029A1/fr active Granted
- 1979-05-21 DE DE19792920943 patent/DE2920943A1/de active Granted
- 1979-05-21 JP JP6255879A patent/JPS54153570A/ja active Granted
- 1979-05-21 DE DE19797915004 patent/DE7915004U1/de not_active Expired
- 1979-05-21 GB GB7917547A patent/GB2021878B/en not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2159337A1 (enrdf_load_stackoverflow) * | 1971-11-08 | 1973-06-22 | Bunker Ramo | |
US3999827A (en) * | 1975-10-10 | 1976-12-28 | Burroughs Corporation | Electrical connector for semiconductor device package |
Also Published As
Publication number | Publication date |
---|---|
JPS6225262B2 (enrdf_load_stackoverflow) | 1987-06-02 |
DE7915004U1 (de) | 1979-10-31 |
FR2427029B1 (enrdf_load_stackoverflow) | 1985-01-25 |
DE2920943A1 (de) | 1979-11-29 |
JPS54153570A (en) | 1979-12-03 |
CA1116708A (en) | 1982-01-19 |
GB2021878B (en) | 1983-02-23 |
DE2920943C2 (enrdf_load_stackoverflow) | 1989-06-08 |
GB2021878A (en) | 1979-12-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2427029A1 (fr) | Dispositif de connexion, pour un element a circuits integres du type lsi | |
ATE22369T1 (de) | Halbleiterbaueinheit mit wenigstens zwei halbleiterbauelementen. | |
DE59504284D1 (de) | Trägerelement für integrierten schaltkreis | |
DE3785835D1 (de) | Chip-sicherung. | |
EP0975019A3 (en) | Chip mounting board and method of measuring it | |
DE3571700D1 (en) | Semiconductor integrated circuit device having a test circuit | |
DE3783089D1 (de) | Kontaktanordnung fuer einschiebbare leistungsschalter. | |
KR920010872A (ko) | 멀티칩 모듈 | |
FR2556515B1 (fr) | Procede et dispositif de connexion electrique fixe de tresses sur des plages d'amenee de courant | |
ATE235751T1 (de) | Kontaktierungssystem für zwei leiterplatten | |
DE69008578D1 (de) | Schaltung zum Regeln des Basisstroms eines Halbleiterleistungsgerätes. | |
ES2124480T3 (es) | Regletas de distribucion con distribucion transversal de la potencia electrica (i). | |
KR960005966A (ko) | 반도체 장치와 그의 제조 및 실장방법 | |
FR2386964A1 (fr) | Appareil de controle de plaquettes de circuit | |
EP0182222A3 (en) | Semiconductor integrated circuit device constructed by polycell technique | |
FR2542920B1 (fr) | Procede de positionnement d'une ligne d'interconnexion sur un trou de contact electrique d'un circuit integre | |
KR940010258A (ko) | 번인 테스트용 지그 | |
GB1442339A (en) | Substrate connector | |
FR2795234B1 (fr) | Procede de fabrication de tout ou partie d'un dispositif electronique par jet de matiere | |
WO2002067322A3 (en) | Semiconductor device having signal contacts and high current power contacts | |
DE59009276D1 (de) | Kühlvorrichtung für elektrische Schaltungsanordnungen. | |
GB2202994B (en) | Circuit assembly, e.g. for an electronic timepiece | |
DE69430114D1 (de) | Element-Anschlussfläche für Halbleiteranordnungsmontageplatte | |
ATE237921T1 (de) | Elektronische schalteinrichtung, insbesondere elektronisches relais, für steckmontage | |
ATE324025T1 (de) | Wärmeleitende einlegematte für elektrische und elektronische geräte |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |