DE7119711U - Halbleiterbauelement - Google Patents
HalbleiterbauelementInfo
- Publication number
- DE7119711U DE7119711U DE19717119711 DE7119711U DE7119711U DE 7119711 U DE7119711 U DE 7119711U DE 19717119711 DE19717119711 DE 19717119711 DE 7119711 U DE7119711 U DE 7119711U DE 7119711 U DE7119711 U DE 7119711U
- Authority
- DE
- Germany
- Prior art keywords
- insulating body
- semiconductor component
- component according
- semiconductor
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title claims description 73
- 239000003795 chemical substances by application Substances 0.000 claims description 35
- 230000007704 transition Effects 0.000 claims description 20
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 6
- 238000002161 passivation Methods 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 230000035699 permeability Effects 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 238000011109 contamination Methods 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000007789 gas Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000000314 lubricant Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 239000003223 protective agent Substances 0.000 claims 1
- 239000012535 impurity Substances 0.000 description 7
- 239000011230 binding agent Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 239000000356 contaminant Substances 0.000 description 5
- 238000012856 packing Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 241000209202 Bromus secalinus Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 108091007412 Piwi-interacting RNA Proteins 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 230000002485 urinary effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Electrodes Of Semiconductors (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Thyristors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3965070A | 1970-05-22 | 1970-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE7119711U true DE7119711U (de) | 1972-02-03 |
Family
ID=21906611
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19717119711 Expired DE7119711U (de) | 1970-05-22 | 1971-05-21 | Halbleiterbauelement |
| DE19712125106 Pending DE2125106A1 (de) | 1970-05-22 | 1971-05-21 | Halbleiterbauelement |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19712125106 Pending DE2125106A1 (de) | 1970-05-22 | 1971-05-21 | Halbleiterbauelement |
Country Status (4)
| Country | Link |
|---|---|
| DE (2) | DE7119711U (enrdf_load_stackoverflow) |
| FR (1) | FR2090206A1 (enrdf_load_stackoverflow) |
| GB (1) | GB1356157A (enrdf_load_stackoverflow) |
| IE (1) | IE35063B1 (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5754043B2 (enrdf_load_stackoverflow) * | 1973-05-21 | 1982-11-16 | ||
| GB1553243A (en) * | 1975-08-04 | 1979-09-26 | Gen Electric | Semiconductor |
| GB1563421A (en) * | 1975-12-18 | 1980-03-26 | Gen Electric | Polyimide-siloxane copolymer protective coating for semiconductor devices |
| DE4040753A1 (de) * | 1990-12-19 | 1992-06-25 | Siemens Ag | Leistungshalbleiterbauelement |
| DE102009017732A1 (de) * | 2009-04-11 | 2010-10-21 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleiterbauelement mit einer Randpassivierung und Verfahren zu dessen Herstellung |
| CN104124215B (zh) * | 2014-06-26 | 2017-02-15 | 江苏省宜兴电子器件总厂 | 一种焊接、键合和密封同步完成的封装结构和封装工艺 |
-
1971
- 1971-04-16 IE IE47371A patent/IE35063B1/xx unknown
- 1971-05-19 FR FR7118100A patent/FR2090206A1/fr not_active Withdrawn
- 1971-05-21 DE DE19717119711 patent/DE7119711U/de not_active Expired
- 1971-05-21 DE DE19712125106 patent/DE2125106A1/de active Pending
- 1971-05-24 GB GB1675671A patent/GB1356157A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| IE35063B1 (en) | 1975-10-29 |
| FR2090206A1 (enrdf_load_stackoverflow) | 1972-01-14 |
| IE35063L (en) | 1971-11-22 |
| GB1356157A (en) | 1974-06-12 |
| DE2125106A1 (de) | 1971-12-02 |
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