DE69943342D1 - Herstellungsverfahren eines mit lot beschichteten ial - Google Patents

Herstellungsverfahren eines mit lot beschichteten ial

Info

Publication number
DE69943342D1
DE69943342D1 DE69943342T DE69943342T DE69943342D1 DE 69943342 D1 DE69943342 D1 DE 69943342D1 DE 69943342 T DE69943342 T DE 69943342T DE 69943342 T DE69943342 T DE 69943342T DE 69943342 D1 DE69943342 D1 DE 69943342D1
Authority
DE
Germany
Prior art keywords
ial
preparing
lot
coated
lot coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69943342T
Other languages
English (en)
Inventor
Mitsuo Zen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Application granted granted Critical
Publication of DE69943342D1 publication Critical patent/DE69943342D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/004—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a metal of the iron group
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C23C2/026—Deposition of sublayers, e.g. adhesion layers or pre-applied alloying elements or corrosion protection
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08—Tin or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/934—Electrical process
    • Y10S428/935—Electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating With Molten Metal (AREA)
  • Electroplating Methods And Accessories (AREA)
DE69943342T 1999-10-20 1999-10-20 Herstellungsverfahren eines mit lot beschichteten ial Expired - Lifetime DE69943342D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1999/005777 WO2001028726A1 (fr) 1998-04-20 1999-10-20 Materiau de revetement a brasure et procede de production correspondant

Publications (1)

Publication Number Publication Date
DE69943342D1 true DE69943342D1 (de) 2011-05-19

Family

ID=14237035

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69943342T Expired - Lifetime DE69943342D1 (de) 1999-10-20 1999-10-20 Herstellungsverfahren eines mit lot beschichteten ial

Country Status (4)

Country Link
US (1) US6758387B1 (de)
EP (1) EP1211011B1 (de)
DE (1) DE69943342D1 (de)
WO (1) WO2001028726A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4328462B2 (ja) * 2000-12-14 2009-09-09 千住金属工業株式会社 はんだコートリッド
JP3960156B2 (ja) * 2002-07-19 2007-08-15 千住金属工業株式会社 板状基板封止用リッドの製造方法
US7984841B2 (en) * 2005-06-17 2011-07-26 Fujitsu Limited Member formed with coating film having tin as its main component, coating film forming method and soldering method
KR101004589B1 (ko) * 2006-09-01 2010-12-29 센주긴조쿠고교 가부시키가이샤 기능 부품용 리드와 그 제조 방법
CN104476019B (zh) * 2014-11-25 2016-08-24 中国电子科技集团公司第三十八研究所 一种铝合金真空钎焊用钎料的制备方法及电镀液
DE102019134595A1 (de) * 2019-12-16 2021-06-17 Endress+Hauser SE+Co. KG Fügen von zwei Bauteilen eines Feldgeräts der Prozess- und Automatisierungstechnik

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1957034A1 (de) * 1969-11-13 1971-05-19 Siemens Ag Verfahren zum Herstellen von Zinnschichten oder Zinnlegierungsschichten auf Draht aus Kupfer oder Kupferlegierungen durch Feuerverzinnen
GB1389542A (en) * 1971-06-17 1975-04-03 Mullard Ltd Methods of securing a semiconductor body to a support
DE2340423A1 (de) * 1973-08-09 1975-02-20 Siemens Ag Weichgeloetete kontaktanordnung
JPS51138561A (en) * 1975-05-27 1976-11-30 Asahi Glass Co Ltd Soldering method of oxidized metal surface
US4119770A (en) * 1976-05-07 1978-10-10 Polaroid Corporation Electrical cells and batteries
USRE34484E (en) * 1978-09-05 1993-12-21 Ngk Spark Plug Co., Ltd. Gold-plated electronic components
US4291815B1 (en) * 1980-02-19 1998-09-29 Semiconductor Packaging Materi Ceramic lid assembly for hermetic sealing of a semiconductor chip
US4331258A (en) * 1981-03-05 1982-05-25 Raychem Corporation Sealing cover for an hermetically sealed container
DE3136794C2 (de) * 1981-09-16 1983-07-28 Siemens AG, 1000 Berlin und 8000 München Lötfähiges Schichtensystem, seine Verwendung und Verfahren zu seiner Herstellung
AT373188B (de) * 1981-12-30 1983-12-27 Karl Neumayer Ges M B H Loetfaehiger eisendraht
US4666078A (en) * 1982-04-20 1987-05-19 Seiko Epson Kabushiki Kaisha Electroless plated terminals of display panel
US4541358A (en) * 1983-11-28 1985-09-17 The Htc Corporation Method and apparatus for solder removal
JPS61165272A (ja) * 1985-01-17 1986-07-25 Masami Kobayashi アモルフアス合金に半田を施す方法
US5262718A (en) * 1985-08-05 1993-11-16 Raychem Limited Anisotropically electrically conductive article
US4763829A (en) * 1986-06-04 1988-08-16 American Telephone And Telegraph Company, At&T Bell Laboratories Soldering of electronic components
JPS6386254A (ja) * 1986-09-29 1988-04-16 Toshiba Battery Co Ltd 扁平形電池
US4978052A (en) * 1986-11-07 1990-12-18 Olin Corporation Semiconductor die attach system
JPS63304636A (ja) * 1987-06-05 1988-12-12 Hitachi Ltd はんだキヤリア及びその製法並びにこれを用いた半導体装置の実装方法
JPS6418583U (de) * 1987-07-21 1989-01-30
US4821947A (en) * 1988-02-08 1989-04-18 Union Carbide Corporation Fluxless application of a metal-comprising coating
US5156322A (en) * 1988-07-22 1992-10-20 Hoechst Ceramtec Aktiengesellschaft Process for the production of a solder coating on metallized materials
JPH02270990A (ja) * 1989-04-11 1990-11-06 Nippon Mining Co Ltd リフローはんだめっき材の製造方法
JP2781017B2 (ja) * 1989-09-04 1998-07-30 新光電気工業株式会社 セラミックパッケージ
KR920000127A (ko) * 1990-02-26 1992-01-10 미다 가쓰시게 반도체 패키지와 그것을 위한 리드프레임
JP2901091B2 (ja) * 1990-09-27 1999-06-02 株式会社日立製作所 半導体装置
US5322205A (en) * 1991-04-22 1994-06-21 Nippon Aluminum Co., Ltd. Joining method of aluminum member to dissimilar metal member
US5518674A (en) * 1991-06-28 1996-05-21 Texas Instruments Incorporated Method of forming thin film flexible interconnect for infrared detectors
US5372295A (en) * 1991-10-04 1994-12-13 Ryoden Semiconductor System Engineering Corporation Solder material, junctioning method, junction material, and semiconductor device
EP0537982A2 (de) * 1991-10-14 1993-04-21 Fujitsu Limited Halbleiteranordnung mit verbesserten Leitern
US5232562A (en) * 1991-12-16 1993-08-03 Electrovert Ltd. Electrochemical reduction treatment for soldering
JP2511614B2 (ja) * 1992-01-21 1996-07-03 株式会社日本アルミ 金属部材とセラミック部材との接合方法
US6652990B2 (en) * 1992-03-27 2003-11-25 The Louis Berkman Company Corrosion-resistant coated metal and method for making the same
US5541447A (en) * 1992-04-22 1996-07-30 Yamaha Corporation Lead frame
US6165819A (en) * 1992-10-20 2000-12-26 Fujitsu Limited Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure
KR950702068A (ko) * 1993-04-06 1995-05-17 쓰지 가오루 반도체 소자용 패키지(package for semiconductor chip)
US5735912A (en) * 1993-06-02 1998-04-07 Micron Communications, Inc. Methods of forming battery electrodes
WO1996022008A1 (fr) * 1995-01-10 1996-07-18 Hitachi, Ltd. Appareil electronique a faible interference electromagnetique, carte de circuit a faible interference electromagnetique et procede de fabrication de la carte de circuit a faible interference
EP0753989B1 (de) * 1995-07-11 2005-09-21 Delphi Technologies, Inc. Beschichtungen und Verfahren, insbesondere für Leiterplatten
US6224690B1 (en) * 1995-12-22 2001-05-01 International Business Machines Corporation Flip-Chip interconnections using lead-free solders
JP2836575B2 (ja) * 1996-04-25 1998-12-14 日本電気株式会社 半導体装置とその製造方法
JPH09293958A (ja) * 1996-04-26 1997-11-11 Senju Metal Ind Co Ltd プリント基板のはんだ付け方法およびはんだ付け装置
JPH09293817A (ja) * 1996-04-26 1997-11-11 Matsushita Electron Corp 電子部品
JP3545549B2 (ja) * 1996-09-26 2004-07-21 株式会社大和化成研究所 電気・電子回路部品
JP3592486B2 (ja) * 1997-06-18 2004-11-24 株式会社東芝 ハンダ付け装置
EP1023580A4 (de) * 1997-06-27 2000-08-09 Patrick H Potega Apparatus zur temperaturüberwachung einer energiequelle
JP3658160B2 (ja) * 1997-11-17 2005-06-08 キヤノン株式会社 モールドレス半導体装置
US6390353B1 (en) * 1998-01-06 2002-05-21 Williams Advanced Materials, Inc. Integral solder and plated sealing cover and method of making the same
JP3767169B2 (ja) * 1998-04-20 2006-04-19 千住金属工業株式会社 はんだコーティング材の製造方法
US6066402A (en) * 1998-05-22 2000-05-23 Innova Electronics, Inc. High temperature electronics assembly using lead-antimony-tin alloys
JPH11354705A (ja) * 1998-06-04 1999-12-24 Toshiba Corp 半導体装置及び半導体装置の製造方法
US6084775A (en) * 1998-12-09 2000-07-04 International Business Machines Corporation Heatsink and package structures with fusible release layer
US6250984B1 (en) * 1999-01-25 2001-06-26 Agere Systems Guardian Corp. Article comprising enhanced nanotube emitter structure and process for fabricating article

Also Published As

Publication number Publication date
EP1211011A1 (de) 2002-06-05
EP1211011B1 (de) 2011-04-06
EP1211011A4 (de) 2007-05-02
US6758387B1 (en) 2004-07-06
WO2001028726A1 (fr) 2001-04-26

Similar Documents

Publication Publication Date Title
DE69739424D1 (de) Herstellungsverfahren eines schleifmittels mit gemusterter oberfläche
PT1105382E (pt) Metodo para a preparacao de citalopran
DE69803176T2 (de) Verfahren zur herstellung von einer pharmacologisch aktiven substanz
DE69725566D1 (de) Verfahren zur befestigung einer physiologischen mitralklappe
DE60016449D1 (de) Beschichtungsverfahren
FI20000863A0 (fi) Uusi hoitomenetelmä
DE69943189D1 (de) Verfahren zum Herstellen einer Überzugsschicht
DE60006450D1 (de) Herstellungsverfahren eines strukturellen Körpers mit drehendem Reibungschweissen
DE60036571D1 (de) Rotationsbeschichtungsverfahren
FR2811978B1 (fr) Enduit de jointement pour element de construction, son procede de preparation et procede de realisation d'un ouvrage
PL344208A1 (en) Novel salts, novel stereisomers, method of obtaining esters and method of obtaining a novel salt
DE69929072D1 (de) Herstellungsverfahren eines Mikrogreifers
DE60019193D1 (de) Stellung eines Hebezeuges
DE60030198D1 (de) Verfahren zur Herstellung eines Dreiwegkatalysators
NO994324D0 (no) Anvendelse av en termisk spröytemetode for fremstilling av et varmedemmende sjikt
DE50008722D1 (de) Herstellverfahren eines Befestigungselementes
DE69943342D1 (de) Herstellungsverfahren eines mit lot beschichteten ial
DE60003470D1 (de) Verfahren zur Herstellung eines Triarylamindimeres
DE60008961D1 (de) Wellenkonstruktion eines Beschichtungwerkzeugs
DE69920553D1 (de) Flansch eines hohlen Gegenstandes
DE60017466D1 (de) Verfahren zur herstellung von absorbierschaum mit dreidimensionaler struktur
DE60006652D1 (de) Betriebsverfahren einer tuftingmaschine
DE50009162D1 (de) Rotormast eines hubschraubers
GB2349392B (en) A method of depositing a layer
NO20021028L (no) Fremgangsmåte for overflatemodifisering av en medisinsk slange