DE69939300D1 - Verfahren zur Herstellung einer Halbleiterstruktur mit einer leitenden Sicherung - Google Patents
Verfahren zur Herstellung einer Halbleiterstruktur mit einer leitenden SicherungInfo
- Publication number
- DE69939300D1 DE69939300D1 DE69939300T DE69939300T DE69939300D1 DE 69939300 D1 DE69939300 D1 DE 69939300D1 DE 69939300 T DE69939300 T DE 69939300T DE 69939300 T DE69939300 T DE 69939300T DE 69939300 D1 DE69939300 D1 DE 69939300D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- semiconductor structure
- conductive fuse
- fuse
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76885—By forming conductive members before deposition of protective insulating material, e.g. pillars, studs
-
- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01F—ADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
- E01F9/00—Arrangement of road signs or traffic signals; Arrangements for enforcing caution
-
- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01H—STREET CLEANING; CLEANING OF PERMANENT WAYS; CLEANING BEACHES; DISPERSING OR PREVENTING FOG IN GENERAL CLEANING STREET OR RAILWAY FURNITURE OR TUNNEL WALLS
- E01H1/00—Removing undesirable matter from roads or like surfaces, with or without moistening of the surface
- E01H1/02—Brushing apparatus, e.g. with auxiliary instruments for mechanically loosening dirt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/105,647 US6037648A (en) | 1998-06-26 | 1998-06-26 | Semiconductor structure including a conductive fuse and process for fabrication thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69939300D1 true DE69939300D1 (de) | 2008-09-25 |
Family
ID=22307017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69939300T Expired - Lifetime DE69939300D1 (de) | 1998-06-26 | 1999-06-17 | Verfahren zur Herstellung einer Halbleiterstruktur mit einer leitenden Sicherung |
Country Status (6)
Country | Link |
---|---|
US (1) | US6037648A (de) |
EP (1) | EP0981161B1 (de) |
JP (1) | JP2000058655A (de) |
KR (1) | KR100350545B1 (de) |
DE (1) | DE69939300D1 (de) |
TW (1) | TW415077B (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6121074A (en) * | 1998-11-05 | 2000-09-19 | Siemens Aktiengesellschaft | Fuse layout for improved fuse blow process window |
US6180503B1 (en) * | 1999-07-29 | 2001-01-30 | Vanguard International Semiconductor Corporation | Passivation layer etching process for memory arrays with fusible links |
US6495901B2 (en) | 2001-01-30 | 2002-12-17 | Infineon Technologies Ag | Multi-level fuse structure |
US6566171B1 (en) | 2001-06-12 | 2003-05-20 | Lsi Logic Corporation | Fuse construction for integrated circuit structure having low dielectric constant dielectric material |
KR100425452B1 (ko) * | 2001-07-04 | 2004-03-30 | 삼성전자주식회사 | 반도체 소자의 리페어 퓨즈 개구 방법 |
US6753210B2 (en) * | 2002-09-17 | 2004-06-22 | Taiwan Semiconductor Manufacturing Company | Metal fuse for semiconductor devices |
KR100695872B1 (ko) * | 2005-06-22 | 2007-03-19 | 삼성전자주식회사 | 반도체 장치의 퓨즈 및 그 형성 방법 |
KR100703983B1 (ko) * | 2006-02-07 | 2007-04-09 | 삼성전자주식회사 | 반도체 소자 및 그 제조 방법 |
US20090045484A1 (en) | 2007-08-16 | 2009-02-19 | International Business Machines Corporation | Methods and systems involving electrically reprogrammable fuses |
KR20090128102A (ko) * | 2008-06-10 | 2009-12-15 | 삼성전자주식회사 | 반도체 장치의 퓨즈 구조물 및 그의 형성 방법 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59200453A (ja) * | 1983-04-27 | 1984-11-13 | Hitachi Ltd | 半導体装置の製造方法 |
JPS6065545A (ja) * | 1983-09-21 | 1985-04-15 | Hitachi Micro Comput Eng Ltd | 半導体装置の製造方法 |
JPS6289338A (ja) * | 1985-10-16 | 1987-04-23 | Hitachi Ltd | 半導体集積回路装置及びその製造方法 |
JPS6480038A (en) * | 1987-09-19 | 1989-03-24 | Hitachi Ltd | Manufacture of semiconductor integrated circuit device |
US5300456A (en) * | 1993-06-17 | 1994-04-05 | Texas Instruments Incorporated | Metal-to-metal antifuse structure |
JPH0737988A (ja) * | 1993-07-20 | 1995-02-07 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
US5578517A (en) * | 1994-10-24 | 1996-11-26 | Taiwan Semiconductor Manufacturing Company Ltd. | Method of forming a highly transparent silicon rich nitride protective layer for a fuse window |
US5550399A (en) * | 1994-11-03 | 1996-08-27 | Kabushiki Kaisha Toshiba | Integrated circuit with windowed fuse element and contact pad |
TW278229B (en) * | 1994-12-29 | 1996-06-11 | Siemens Ag | Fuse structure for an integrated circuit device and method for manufacturing a fuse structure |
EP0762498A3 (de) * | 1995-08-28 | 1998-06-24 | International Business Machines Corporation | Fenster für Sicherung mit kontrollierter Sicherungsoxiddicke |
US5723358A (en) * | 1996-04-29 | 1998-03-03 | Vlsi Technology, Inc. | Method of manufacturing amorphous silicon antifuse structures |
-
1998
- 1998-06-26 US US09/105,647 patent/US6037648A/en not_active Expired - Lifetime
-
1999
- 1999-05-17 TW TW088107991A patent/TW415077B/zh not_active IP Right Cessation
- 1999-06-17 DE DE69939300T patent/DE69939300D1/de not_active Expired - Lifetime
- 1999-06-17 EP EP99304728A patent/EP0981161B1/de not_active Expired - Lifetime
- 1999-06-21 JP JP11174401A patent/JP2000058655A/ja active Pending
- 1999-06-23 KR KR1019990023659A patent/KR100350545B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0981161A2 (de) | 2000-02-23 |
KR20000006375A (ko) | 2000-01-25 |
TW415077B (en) | 2000-12-11 |
EP0981161A3 (de) | 2002-06-12 |
EP0981161B1 (de) | 2008-08-13 |
KR100350545B1 (ko) | 2002-08-28 |
US6037648A (en) | 2000-03-14 |
JP2000058655A (ja) | 2000-02-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8320 | Willingness to grant licences declared (paragraph 23) | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8364 | No opposition during term of opposition |