DE69939069D1 - Herstellung eines halbleiterbauelements mit einer gemeinsamen geteilten gate-elektrode - Google Patents

Herstellung eines halbleiterbauelements mit einer gemeinsamen geteilten gate-elektrode

Info

Publication number
DE69939069D1
DE69939069D1 DE69939069T DE69939069T DE69939069D1 DE 69939069 D1 DE69939069 D1 DE 69939069D1 DE 69939069 T DE69939069 T DE 69939069T DE 69939069 T DE69939069 T DE 69939069T DE 69939069 D1 DE69939069 D1 DE 69939069D1
Authority
DE
Germany
Prior art keywords
preparation
gate electrode
semiconductor component
divided gate
common divided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69939069T
Other languages
German (de)
English (en)
Inventor
Mark I Gardner
H Jim Fulford
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalFoundries Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Application granted granted Critical
Publication of DE69939069D1 publication Critical patent/DE69939069D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D88/00—Three-dimensional [3D] integrated devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D88/00—Three-dimensional [3D] integrated devices
    • H10D88/01—Manufacture or treatment
DE69939069T 1998-12-01 1999-08-09 Herstellung eines halbleiterbauelements mit einer gemeinsamen geteilten gate-elektrode Expired - Lifetime DE69939069D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/201,995 US6177687B1 (en) 1998-12-01 1998-12-01 Semiconductor device having gate electrode shared between two sets of active regions and fabrication thereof
PCT/US1999/018038 WO2000033381A1 (en) 1998-12-01 1999-08-09 Semiconductor device having shared gate electrode and fabrication thereof

Publications (1)

Publication Number Publication Date
DE69939069D1 true DE69939069D1 (de) 2008-08-21

Family

ID=22748149

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69939069T Expired - Lifetime DE69939069D1 (de) 1998-12-01 1999-08-09 Herstellung eines halbleiterbauelements mit einer gemeinsamen geteilten gate-elektrode

Country Status (6)

Country Link
US (1) US6177687B1 (enExample)
EP (1) EP1142018B1 (enExample)
JP (1) JP4598955B2 (enExample)
KR (1) KR100577447B1 (enExample)
DE (1) DE69939069D1 (enExample)
WO (1) WO2000033381A1 (enExample)

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1191970A (en) * 1982-11-09 1985-08-13 Abdalla A. Naem Stacked mos transistor
US4686758A (en) * 1984-06-27 1987-08-18 Honeywell Inc. Three-dimensional CMOS using selective epitaxial growth
JPS62155556A (ja) * 1985-12-27 1987-07-10 Nec Corp 半導体装置の製造方法
US4654121A (en) * 1986-02-27 1987-03-31 Ncr Corporation Fabrication process for aligned and stacked CMOS devices
JPH02117166A (ja) * 1988-10-27 1990-05-01 Ricoh Co Ltd 半導体装置
US5310696A (en) 1989-06-16 1994-05-10 Massachusetts Institute Of Technology Chemical method for the modification of a substrate surface to accomplish heteroepitaxial crystal growth
JPH03104158A (ja) * 1989-09-18 1991-05-01 Matsushita Electron Corp Ｃｍｏｓ型半導体装置
US5215932A (en) 1991-09-24 1993-06-01 Micron Technology, Inc. Self-aligned 3-dimensional PMOS devices without selective EPI
JPH0590517A (ja) * 1991-09-30 1993-04-09 Toshiba Corp 半導体装置及びその製造方法
WO1993009567A1 (en) * 1991-10-31 1993-05-13 Vlsi Technology, Inc. Auxiliary gate lightly doped drain (agldd) structure with dielectric sidewalls
US5324960A (en) * 1993-01-19 1994-06-28 Motorola, Inc. Dual-transistor structure and method of formation
JP2500924B2 (ja) * 1994-08-12 1996-05-29 株式会社東芝 半導体装置
JP3323381B2 (ja) * 1995-12-14 2002-09-09 三菱電機株式会社 半導体装置及びその製造方法
JP3081543B2 (ja) * 1996-03-29 2000-08-28 三洋電機株式会社 スプリットゲート型トランジスタ、スプリットゲート型トランジスタの製造方法、不揮発性半導体メモリ
US5882959A (en) * 1996-10-08 1999-03-16 Advanced Micro Devices, Inc. Multi-level transistor fabrication method having an inverted, upper level transistor which shares a gate conductor with a non-inverted, lower level transistor
US5770482A (en) * 1996-10-08 1998-06-23 Advanced Micro Devices, Inc. Multi-level transistor fabrication method with a patterned upper transistor substrate and interconnection thereto
US5714394A (en) 1996-11-07 1998-02-03 Advanced Micro Devices, Inc. Method of making an ultra high density NAND gate using a stacked transistor arrangement
US5843816A (en) * 1997-07-28 1998-12-01 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated self-aligned butt contact process flow and structure for six transistor full complementary metal oxide semiconductor static random access memory cell
US5949092A (en) * 1997-08-01 1999-09-07 Advanced Micro Devices, Inc. Ultra-high-density pass gate using dual stacked transistors having a gate structure with planarized upper surface in relation to interlayer insulator
KR100290899B1 (ko) * 1998-02-06 2001-06-01 김영환 반도체소자및이의제조방법

Also Published As

Publication number Publication date
KR100577447B1 (ko) 2006-05-10
EP1142018B1 (en) 2008-07-09
KR20010081049A (ko) 2001-08-25
US6177687B1 (en) 2001-01-23
EP1142018A1 (en) 2001-10-10
JP2002531949A (ja) 2002-09-24
JP4598955B2 (ja) 2010-12-15
WO2000033381A1 (en) 2000-06-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: GLOBALFOUNDRIES INC., GRAND CAYMAN, KY

8328 Change in the person/name/address of the agent

Representative=s name: GRUENECKER, KINKELDEY, STOCKMAIR & SCHWANHAEUSSER,