DE69934960D1 - Tetracarbonsäuredianhydrid, Derivat und Herstellung davon, Polyimidvorläufer, Polyimid, Harzzusammensetzung, photoempfindliche Harzzusammensetzung, Verfahren zur Erzeugung von Prägemustern und elektronisches Bauteil - Google Patents
Tetracarbonsäuredianhydrid, Derivat und Herstellung davon, Polyimidvorläufer, Polyimid, Harzzusammensetzung, photoempfindliche Harzzusammensetzung, Verfahren zur Erzeugung von Prägemustern und elektronisches BauteilInfo
- Publication number
- DE69934960D1 DE69934960D1 DE69934960T DE69934960T DE69934960D1 DE 69934960 D1 DE69934960 D1 DE 69934960D1 DE 69934960 T DE69934960 T DE 69934960T DE 69934960 T DE69934960 T DE 69934960T DE 69934960 D1 DE69934960 D1 DE 69934960D1
- Authority
- DE
- Germany
- Prior art keywords
- resin composition
- polyimide
- derivative
- preparation
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/76—Esters of carboxylic acids having a carboxyl group bound to a carbon atom of a six-membered aromatic ring
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D307/00—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
- C07D307/77—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom ortho- or peri-condensed with carbocyclic rings or ring systems
- C07D307/87—Benzo [c] furans; Hydrogenated benzo [c] furans
- C07D307/89—Benzo [c] furans; Hydrogenated benzo [c] furans with two oxygen atoms directly attached in positions 1 and 3
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31052298 | 1998-10-30 | ||
JP31052298 | 1998-10-30 | ||
JP33948098 | 1998-11-30 | ||
JP33948098 | 1998-11-30 | ||
JP1839399 | 1999-01-27 | ||
JP1839399 | 1999-01-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69934960D1 true DE69934960D1 (de) | 2007-03-15 |
DE69934960T2 DE69934960T2 (de) | 2007-12-06 |
Family
ID=27282194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69934960T Expired - Lifetime DE69934960T2 (de) | 1998-10-30 | 1999-10-28 | Tetracarbonsäuredianhydrid, Derivat und Herstellung davon, Polyimidvorläufer, Polyimid, Harzzusammensetzung, photoempfindliche Harzzusammensetzung, Verfahren zur Erzeugung von Prägemustern und elektronisches Bauteil |
Country Status (3)
Country | Link |
---|---|
US (2) | US6329494B1 (de) |
EP (1) | EP1013650B1 (de) |
DE (1) | DE69934960T2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014084188A1 (ja) * | 2012-11-28 | 2014-06-05 | セントラル硝子株式会社 | 含フッ素重合性単量体およびそれを用いた高分子化合物 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7842824B2 (en) * | 2004-06-28 | 2010-11-30 | Mitsubishi Chemical Corporation | Biphenyltetracarboxylic acid dianhydride and process for producing the same, and polyimide formed from the same and process for producing the same |
JP4509757B2 (ja) * | 2004-12-03 | 2010-07-21 | ソニーケミカル&インフォメーションデバイス株式会社 | 多層配線基板の製造方法 |
KR20080018899A (ko) * | 2005-06-03 | 2008-02-28 | 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. | 전처리 조성물 |
US7652378B2 (en) * | 2006-10-17 | 2010-01-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Aluminum-based interconnection in bond pad layer |
KR101620675B1 (ko) * | 2011-03-25 | 2016-05-12 | 가부시키가이샤 아이.에스.티 | 폴리이미드 전구체 용액, 폴리이미드 전구체, 폴리이미드 수지, 합제 슬러리, 전극, 합제 슬러리 제조 방법, 및 전극 형성 방법 |
KR101612159B1 (ko) | 2013-06-21 | 2016-04-12 | 제일모직주식회사 | 연속식 고상중합 장치 및 방법 |
KR101657271B1 (ko) | 2013-07-10 | 2016-09-13 | 롯데첨단소재(주) | 연속식 고상중합 장치 및 방법 |
KR102074952B1 (ko) | 2013-07-19 | 2020-02-10 | 삼성전자주식회사 | 조성물, 고분자 필름 및 표시 장치 |
JP6663320B2 (ja) * | 2016-07-25 | 2020-03-11 | 信越化学工業株式会社 | テトラカルボン酸ジエステル化合物、ポリイミド前駆体の重合体及びその製造方法、ネガ型感光性樹脂組成物、パターン形成方法、及び硬化被膜形成方法 |
CN111937500A (zh) * | 2018-04-04 | 2020-11-13 | 住友电工印刷电路株式会社 | 柔性印刷线路板用覆膜以及柔性印刷线路板 |
JP7027541B2 (ja) * | 2018-06-11 | 2022-03-01 | 富士フイルム株式会社 | ジシクロヘキサンジカルボン酸ジエステルの製造方法およびジシクロヘキサンジカルボン酸の製造方法 |
CN112390725B (zh) * | 2019-08-16 | 2021-10-29 | 沈阳中化农药化工研发有限公司 | 一种酰胺类化合物的制备方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5624343A (en) * | 1979-08-06 | 1981-03-07 | Hitachi Ltd | Photosensitive heat resistant polymer composition |
US4499149A (en) * | 1980-12-15 | 1985-02-12 | M&T Chemicals Inc. | Siloxane-containing polymers |
US4515887A (en) * | 1983-08-29 | 1985-05-07 | General Electric Company | Photopatternable dielectric compositions, method for making and use |
US5077415A (en) * | 1990-01-19 | 1991-12-31 | Ciba-Geigy Corporation | Disubstituted aromatic dianhydrides |
US6045975A (en) * | 1990-04-16 | 2000-04-04 | Fujitsu Limited | Photosensitive, heat-resistant resin composition for forming patterns |
JPH05112641A (ja) * | 1991-04-17 | 1993-05-07 | Hitachi Ltd | 共重合ポリイミド |
JPH05171018A (ja) | 1991-12-25 | 1993-07-09 | Kanebo Ltd | 熱可塑性樹脂組成物 |
US5472823A (en) * | 1992-01-20 | 1995-12-05 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition |
US5756260A (en) * | 1993-02-16 | 1998-05-26 | Sumitomo Bakelite Company Limited | Photosensitive polyimide resin composition containing a stabilizer and method for formation of relief pattern using same |
AU6711694A (en) * | 1993-04-21 | 1994-11-08 | University Of Akron, The | Negative birefringent polyimide films |
US5446074A (en) * | 1993-12-17 | 1995-08-29 | International Business Machines Corporation | Photosensitive polyimide precursors |
US5395918A (en) * | 1994-04-21 | 1995-03-07 | The University Of Akron | Organo-soluble polyimides from substituted dianhydrides |
US5777068A (en) * | 1994-09-13 | 1998-07-07 | Nippon Zeon Co., Ltd. | Photosensitive polyimide resin composition |
JPH08234433A (ja) * | 1994-12-28 | 1996-09-13 | Toray Ind Inc | 化学線感応性重合体組成物 |
JPH08335653A (ja) * | 1995-04-07 | 1996-12-17 | Nitto Denko Corp | 半導体装置およびその製法並びに上記半導体装置の製造に用いる半導体装置用テープキャリア |
US6071667A (en) * | 1995-04-13 | 2000-06-06 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition containing a photosensitive polyamide resin |
JP2826978B2 (ja) * | 1995-05-22 | 1998-11-18 | 旭化成工業株式会社 | i線露光用組成物 |
JP3321548B2 (ja) * | 1996-06-17 | 2002-09-03 | 株式会社日立製作所 | 感光性ポリイミド前駆体組成物、およびそれを用いたパターン形成方法 |
JP3968885B2 (ja) * | 1998-05-14 | 2007-08-29 | 日本メクトロン株式会社 | 感光性組成物 |
-
1999
- 1999-10-28 DE DE69934960T patent/DE69934960T2/de not_active Expired - Lifetime
- 1999-10-28 EP EP99120891A patent/EP1013650B1/de not_active Expired - Lifetime
- 1999-11-01 US US09/431,773 patent/US6329494B1/en not_active Expired - Lifetime
-
2001
- 2001-08-30 US US09/941,703 patent/US6600053B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014084188A1 (ja) * | 2012-11-28 | 2014-06-05 | セントラル硝子株式会社 | 含フッ素重合性単量体およびそれを用いた高分子化合物 |
Also Published As
Publication number | Publication date |
---|---|
US6600053B2 (en) | 2003-07-29 |
EP1013650A2 (de) | 2000-06-28 |
US6329494B1 (en) | 2001-12-11 |
EP1013650A3 (de) | 2001-10-24 |
EP1013650B1 (de) | 2007-01-24 |
US20020037991A1 (en) | 2002-03-28 |
DE69934960T2 (de) | 2007-12-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |