DE69933873D1 - Ic-stapel mit sekundären leiterrahmen - Google Patents

Ic-stapel mit sekundären leiterrahmen

Info

Publication number
DE69933873D1
DE69933873D1 DE69933873T DE69933873T DE69933873D1 DE 69933873 D1 DE69933873 D1 DE 69933873D1 DE 69933873 T DE69933873 T DE 69933873T DE 69933873 T DE69933873 T DE 69933873T DE 69933873 D1 DE69933873 D1 DE 69933873D1
Authority
DE
Germany
Prior art keywords
stack
ladder frame
secondary ladder
frame
ladder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69933873T
Other languages
English (en)
Inventor
Floyd Eide
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Irvine Sensors Corp
Original Assignee
Irvine Sensors Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Irvine Sensors Corp filed Critical Irvine Sensors Corp
Application granted granted Critical
Publication of DE69933873D1 publication Critical patent/DE69933873D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49537Plurality of lead frames mounted in one device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1017All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1029All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being a lead frame
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1047Details of electrical connections between containers
    • H01L2225/107Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE69933873T 1998-06-10 1999-06-10 Ic-stapel mit sekundären leiterrahmen Expired - Lifetime DE69933873D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/095,415 US6028352A (en) 1997-06-13 1998-06-10 IC stack utilizing secondary leadframes
PCT/US1999/013173 WO1999065062A2 (en) 1998-06-10 1999-06-10 Ic stack utilizing secondary leadframes

Publications (1)

Publication Number Publication Date
DE69933873D1 true DE69933873D1 (de) 2006-12-14

Family

ID=22251900

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69933873T Expired - Lifetime DE69933873D1 (de) 1998-06-10 1999-06-10 Ic-stapel mit sekundären leiterrahmen

Country Status (5)

Country Link
US (1) US6028352A (de)
EP (1) EP1097467B1 (de)
JP (1) JP3511008B2 (de)
DE (1) DE69933873D1 (de)
WO (1) WO1999065062A2 (de)

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FR2797348B1 (fr) * 1999-08-02 2001-10-19 Cit Alcatel Procede d'obtention d'un module, a haute densite, a partir de composants electroniques, modulaires, encapsules et module ainsi obtenu
US6572387B2 (en) * 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
DE10006445C2 (de) 2000-02-14 2002-03-28 Infineon Technologies Ag Zwischenrahmen für einen Gehäuserahmen von Halbleiterchips
US6713854B1 (en) 2000-10-16 2004-03-30 Legacy Electronics, Inc Electronic circuit module with a carrier having a mounting pad array
US7102892B2 (en) * 2000-03-13 2006-09-05 Legacy Electronics, Inc. Modular integrated circuit chip carrier
US6487078B2 (en) * 2000-03-13 2002-11-26 Legacy Electronics, Inc. Electronic module having a three dimensional array of carrier-mounted integrated circuit packages
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US7337522B2 (en) * 2000-10-16 2008-03-04 Legacy Electronics, Inc. Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
US20030221313A1 (en) * 2001-01-26 2003-12-04 Gann Keith D. Method for making stacked integrated circuits (ICs) using prepackaged parts
US7174627B2 (en) * 2001-01-26 2007-02-13 Irvine Sensors Corporation Method of fabricating known good dies from packaged integrated circuits
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Also Published As

Publication number Publication date
JP2003521806A (ja) 2003-07-15
WO1999065062A9 (en) 2000-09-08
JP3511008B2 (ja) 2004-03-29
WO1999065062A3 (en) 2003-07-03
WO1999065062A2 (en) 1999-12-16
EP1097467A1 (de) 2001-05-09
EP1097467A4 (de) 2002-02-06
US6028352A (en) 2000-02-22
EP1097467B1 (de) 2006-11-02

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