DE69925528D1 - Wärmeleitfähige, elektrisch nicht leitende Zusammensetzung - Google Patents
Wärmeleitfähige, elektrisch nicht leitende ZusammensetzungInfo
- Publication number
- DE69925528D1 DE69925528D1 DE69925528T DE69925528T DE69925528D1 DE 69925528 D1 DE69925528 D1 DE 69925528D1 DE 69925528 T DE69925528 T DE 69925528T DE 69925528 T DE69925528 T DE 69925528T DE 69925528 D1 DE69925528 D1 DE 69925528D1
- Authority
- DE
- Germany
- Prior art keywords
- conductive
- electrically non
- composition
- thermally conductive
- thermally
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/02—Polyamines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6977898 | 1998-03-19 | ||
JP6977898 | 1998-03-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69925528D1 true DE69925528D1 (de) | 2005-07-07 |
DE69925528T2 DE69925528T2 (de) | 2006-01-26 |
Family
ID=13412584
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69925528T Expired - Lifetime DE69925528T2 (de) | 1998-03-19 | 1999-03-09 | Wärmeleitfähige, elektrisch nicht leitende Zusammensetzung |
Country Status (3)
Country | Link |
---|---|
US (1) | US6261481B1 (de) |
EP (1) | EP0944098B1 (de) |
DE (1) | DE69925528T2 (de) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000273196A (ja) * | 1999-03-24 | 2000-10-03 | Polymatech Co Ltd | 熱伝導性樹脂基板および半導体パッケージ |
DE19954314A1 (de) * | 1999-11-11 | 2001-05-17 | Hilti Ag | Elektromotor |
JP4118691B2 (ja) * | 2001-05-18 | 2008-07-16 | 株式会社日立製作所 | 熱硬化性樹脂硬化物 |
JP2004149722A (ja) * | 2002-10-31 | 2004-05-27 | Polymatech Co Ltd | 熱伝導性高分子成形体 |
JP4414674B2 (ja) * | 2003-05-07 | 2010-02-10 | ポリマテック株式会社 | 熱伝導性エポキシ樹脂成形体及びその製造方法 |
US7268174B2 (en) * | 2003-07-11 | 2007-09-11 | Siemens Power Generation, Inc. | Homogeneous alumoxane-LCT-epoxy polymers and methods for making the same |
US7781063B2 (en) | 2003-07-11 | 2010-08-24 | Siemens Energy, Inc. | High thermal conductivity materials with grafted surface functional groups |
US7033670B2 (en) * | 2003-07-11 | 2006-04-25 | Siemens Power Generation, Inc. | LCT-epoxy polymers with HTC-oligomers and method for making the same |
US20050176835A1 (en) * | 2004-01-12 | 2005-08-11 | Toshikazu Kobayashi | Thermally conductive thermoplastic resin compositions |
EP1734068A4 (de) * | 2004-03-09 | 2011-01-19 | Polymatech Co Ltd | Polymerverbundformkörper, leiterplatte mit dem formkörper und herstellungsverfahren dafür |
US7553781B2 (en) * | 2004-06-15 | 2009-06-30 | Siemens Energy, Inc. | Fabrics with high thermal conductivity coatings |
US20080050580A1 (en) * | 2004-06-15 | 2008-02-28 | Stevens Gary C | High Thermal Conductivity Mica Paper Tape |
US20050277721A1 (en) | 2004-06-15 | 2005-12-15 | Siemens Westinghouse Power Corporation | High thermal conductivity materials aligned within resins |
US7776392B2 (en) * | 2005-04-15 | 2010-08-17 | Siemens Energy, Inc. | Composite insulation tape with loaded HTC materials |
US7592045B2 (en) * | 2004-06-15 | 2009-09-22 | Siemens Energy, Inc. | Seeding of HTC fillers to form dendritic structures |
US8216672B2 (en) * | 2004-06-15 | 2012-07-10 | Siemens Energy, Inc. | Structured resin systems with high thermal conductivity fillers |
US20050274774A1 (en) * | 2004-06-15 | 2005-12-15 | Smith James D | Insulation paper with high thermal conductivity materials |
US7553438B2 (en) * | 2004-06-15 | 2009-06-30 | Siemens Energy, Inc. | Compression of resin impregnated insulating tapes |
US7651963B2 (en) * | 2005-04-15 | 2010-01-26 | Siemens Energy, Inc. | Patterning on surface with high thermal conductivity materials |
US7846853B2 (en) * | 2005-04-15 | 2010-12-07 | Siemens Energy, Inc. | Multi-layered platelet structure |
US7955661B2 (en) * | 2005-06-14 | 2011-06-07 | Siemens Energy, Inc. | Treatment of micropores in mica materials |
US8357433B2 (en) * | 2005-06-14 | 2013-01-22 | Siemens Energy, Inc. | Polymer brushes |
US7655295B2 (en) | 2005-06-14 | 2010-02-02 | Siemens Energy, Inc. | Mix of grafted and non-grafted particles in a resin |
US20070026221A1 (en) * | 2005-06-14 | 2007-02-01 | Siemens Power Generation, Inc. | Morphological forms of fillers for electrical insulation |
US7781057B2 (en) * | 2005-06-14 | 2010-08-24 | Siemens Energy, Inc. | Seeding resins for enhancing the crystallinity of polymeric substructures |
US7851059B2 (en) * | 2005-06-14 | 2010-12-14 | Siemens Energy, Inc. | Nano and meso shell-core control of physical properties and performance of electrically insulating composites |
US7547847B2 (en) * | 2006-09-19 | 2009-06-16 | Siemens Energy, Inc. | High thermal conductivity dielectric tape |
US8545986B2 (en) * | 2007-03-13 | 2013-10-01 | United States of America as represented by the Administrator of the National Aeronautics and Spacing Administration | Composite insulated conductor |
EP2348071B1 (de) * | 2008-10-30 | 2019-02-13 | Kaneka Corporation | Thermoplastisches harz enthaltende zusammensetzung mit hoher wärmeleitfähigkeit und thermoplastisches harz |
US8465666B2 (en) | 2009-02-25 | 2013-06-18 | Panasonic Corporation | Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition |
EP2479202B1 (de) * | 2009-09-16 | 2019-02-13 | Kaneka Corporation | Wärmeleitfähiger organischer zusatzstoff, harzzusammensetzung und gehärtetes produkt |
CN103755921B (zh) * | 2009-09-29 | 2017-06-23 | 日立化成工业株式会社 | 树脂组合物、树脂片以及树脂固化物及其制造方法 |
KR20130103310A (ko) * | 2010-04-19 | 2013-09-23 | 카네카 코포레이션 | 고 열전도성 열가소성 수지 |
US9742165B2 (en) | 2012-03-30 | 2017-08-22 | Elwha Llc | Apparatus and system for scheduling mobile device operations on a power transmission system |
US9304519B2 (en) * | 2012-04-24 | 2016-04-05 | Elwha Llc | Transmission-line coupled closed-cycle heat transfer device |
CN106661439B (zh) | 2014-08-11 | 2019-10-15 | 株式会社I.S.T | 弹性体的导热性改性剂及导热性改性液晶性弹性体 |
JP6696283B2 (ja) * | 2015-04-28 | 2020-05-20 | Tdk株式会社 | 樹脂組成物、樹脂シート、樹脂硬化物および樹脂基板 |
SG11202006971XA (en) | 2018-01-22 | 2020-08-28 | Merck Patent Gmbh | Dielectric materials |
KR102171222B1 (ko) | 2018-08-17 | 2020-10-28 | 한국과학기술연구원 | 고열전도성 고분자 복합체 및 제조방법 |
KR20210078520A (ko) | 2018-10-18 | 2021-06-28 | 메르크 파텐트 게엠베하 | 유전체 공중합체 재료 |
SG11202103758TA (en) | 2018-10-18 | 2021-05-28 | Merck Patent Gmbh | Dielectric copolymer materials |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61291649A (ja) * | 1985-06-18 | 1986-12-22 | Nippon Telegr & Teleph Corp <Ntt> | 熱伝導性に高い異方性を有する高分子フイルムとその製造方法 |
JPS61296068A (ja) * | 1985-06-20 | 1986-12-26 | シ−メンス、アクチエンゲゼルシヤフト | プラスチツクコンパウンド |
JPS62100577A (ja) * | 1985-10-28 | 1987-05-11 | Polyplastics Co | 熱伝導性組成物 |
US4837407A (en) * | 1987-03-30 | 1989-06-06 | Aisin Seiki Company, Ltd. | Plastic electrically insulating substrates for wiring circuit boards and a method of manufacturing thereof |
JPH01149303A (ja) * | 1987-12-04 | 1989-06-12 | Nippon Telegr & Teleph Corp <Ntt> | 垂直配向分子絶縁層の作製方法 |
JPH025307A (ja) * | 1988-06-24 | 1990-01-10 | Nippon Telegr & Teleph Corp <Ntt> | 垂直配向高分子絶縁導体 |
JPH0228352A (ja) * | 1988-07-18 | 1990-01-30 | Nippon Telegr & Teleph Corp <Ntt> | Icチップ搭載用配線板 |
JPH02127438A (ja) * | 1988-11-08 | 1990-05-16 | Nippon Telegr & Teleph Corp <Ntt> | 垂直配向ポリイミド膜 |
DE4040471A1 (de) * | 1990-08-01 | 1992-02-06 | Bayer Ag | Haertbare mischungen zur herstellung von epoxidnetzwerken, verfahren zu deren herstellung und verwendung |
JPH06240137A (ja) * | 1991-04-02 | 1994-08-30 | Hitachi Ltd | ポリイミド前駆体組成物とその製法並びに該前駆体を用いた電子装置 |
DE69322294T2 (de) * | 1992-01-29 | 1999-06-02 | Ebara Corp | Thermotrope Flüssigkristallpolymerzusammensetzung sowie Isolator |
JP3468996B2 (ja) * | 1995-08-01 | 2003-11-25 | 株式会社東芝 | エポキシ樹脂組成物及び樹脂封止型半導体装置 |
US5811504A (en) | 1995-08-03 | 1998-09-22 | Cornell Research Foundation, Inc. | Liquid crystalline epoxy monomer and liquid crystalline epoxy resin containing mesogen twins |
JPH09194687A (ja) * | 1996-01-12 | 1997-07-29 | Hitachi Ltd | エポキシ樹脂組成物およびその製造方法 |
US5904984A (en) * | 1996-10-17 | 1999-05-18 | Siemens Westinghouse Power Corporation | Electrical insulation using liquid crystal thermoset epoxy resins |
-
1999
- 1999-03-09 DE DE69925528T patent/DE69925528T2/de not_active Expired - Lifetime
- 1999-03-09 EP EP99103953A patent/EP0944098B1/de not_active Expired - Lifetime
- 1999-03-15 US US09/267,670 patent/US6261481B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0944098A3 (de) | 2001-04-11 |
US6261481B1 (en) | 2001-07-17 |
DE69925528T2 (de) | 2006-01-26 |
EP0944098B1 (de) | 2005-06-01 |
EP0944098A2 (de) | 1999-09-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |