DE69911941D1 - Verfahren zur herstellung von leiterzügen auf einer leiterplatte und vorrichtung zur durchführung des verfahrens - Google Patents

Verfahren zur herstellung von leiterzügen auf einer leiterplatte und vorrichtung zur durchführung des verfahrens

Info

Publication number
DE69911941D1
DE69911941D1 DE69911941T DE69911941T DE69911941D1 DE 69911941 D1 DE69911941 D1 DE 69911941D1 DE 69911941 T DE69911941 T DE 69911941T DE 69911941 T DE69911941 T DE 69911941T DE 69911941 D1 DE69911941 D1 DE 69911941D1
Authority
DE
Germany
Prior art keywords
tracks
electrode
electro
implementing
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69911941T
Other languages
English (en)
Other versions
DE69911941T2 (de
Inventor
John Michael Lowe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDAO Ltd
Original Assignee
TDAO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDAO Ltd filed Critical TDAO Ltd
Publication of DE69911941D1 publication Critical patent/DE69911941D1/de
Application granted granted Critical
Publication of DE69911941T2 publication Critical patent/DE69911941T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C25D5/06—Brush or pad plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Threshing Machine Elements (AREA)
  • Devices For Checking Fares Or Tickets At Control Points (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Insulated Conductors (AREA)
DE69911941T 1998-04-06 1999-04-06 Verfahren zur herstellung von leiterzügen auf einer leiterplatte und vorrichtung zur durchführung des verfahrens Expired - Fee Related DE69911941T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9807280 1998-04-06
GB9807280A GB2336161B (en) 1998-04-06 1998-04-06 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
PCT/GB1999/000890 WO1999052336A1 (en) 1998-04-06 1999-04-06 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method

Publications (2)

Publication Number Publication Date
DE69911941D1 true DE69911941D1 (de) 2003-11-13
DE69911941T2 DE69911941T2 (de) 2004-09-09

Family

ID=10829875

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69921515T Expired - Fee Related DE69921515T2 (de) 1998-04-06 1999-04-06 Verfahren zur Erzeugung von Leiterbahnen auf einer gedruckten Schaltung
DE69911941T Expired - Fee Related DE69911941T2 (de) 1998-04-06 1999-04-06 Verfahren zur herstellung von leiterzügen auf einer leiterplatte und vorrichtung zur durchführung des verfahrens

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69921515T Expired - Fee Related DE69921515T2 (de) 1998-04-06 1999-04-06 Verfahren zur Erzeugung von Leiterbahnen auf einer gedruckten Schaltung

Country Status (15)

Country Link
US (2) US6524462B1 (de)
EP (2) EP1311145B1 (de)
JP (1) JP2002511643A (de)
KR (1) KR100634221B1 (de)
AT (2) ATE281059T1 (de)
AU (1) AU748566C (de)
BR (1) BR9909489A (de)
CA (1) CA2327574A1 (de)
DE (2) DE69921515T2 (de)
DK (1) DK1072176T3 (de)
ES (2) ES2234980T3 (de)
GB (1) GB2336161B (de)
PT (1) PT1072176E (de)
RU (1) RU2218680C2 (de)
WO (1) WO1999052336A1 (de)

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GB0303397D0 (en) * 2003-02-14 2003-03-19 Technology Dev Associate Opera Electro-plating method and apparatus
US20100193367A1 (en) * 2004-02-11 2010-08-05 Daniel Luch Methods and structures for the production of electrically treated items and electrical connections
US20050176270A1 (en) * 2004-02-11 2005-08-11 Daniel Luch Methods and structures for the production of electrically treated items and electrical connections
US7705439B2 (en) * 2005-01-25 2010-04-27 Teledyne Technologies Incorporated Destructor integrated circuit chip, interposer electronic device and methods
US7489013B1 (en) 2005-10-17 2009-02-10 Teledyne Technologies Incorporated Destructor integrated circuit chip, interposer electronic device and methods
US7640658B1 (en) 2005-10-18 2010-01-05 Teledyne Technologies Incorporated Methods for forming an anti-tamper pattern
WO2008018719A1 (en) 2006-08-07 2008-02-14 Inktec Co., Ltd. Manufacturing methods for metal clad laminates
MY155485A (en) * 2008-06-18 2015-10-30 Basf Se Process for producing electrodes for solar cells
EP2182787A1 (de) * 2008-10-30 2010-05-05 BAE Systems PLC Verbesserungen in Bezug auf additive Herstellungsverfahren
EP2351472B1 (de) * 2008-10-30 2012-09-12 BAE Systems PLC Verbesserungen in bezug auf additive herstellungsprozesse
CN101950771A (zh) * 2010-07-27 2011-01-19 中国科学院苏州纳米技术与纳米仿生研究所 一种复合电极的制备方法
KR101283009B1 (ko) * 2011-05-26 2013-07-05 주승기 전기 도금장치 및 전기 도금방법
US9255339B2 (en) 2011-09-19 2016-02-09 Fei Company Localized, in-vacuum modification of small structures
US9721886B2 (en) 2013-06-28 2017-08-01 Intel Corporation Preservation of fine pitch redistribution lines
DE102013113485A1 (de) 2013-12-04 2015-06-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Ausbilden einer elektrisch leitfähigen Struktur auf einem Kunststoffsubstrat
RU2739750C1 (ru) * 2019-12-16 2020-12-28 Федеральное государственное бюджетное учреждение науки Новосибирский институт органической химии им. Н.Н. Ворожцова Сибирского отделения Российской академии наук (НИОХ СО РАН) Способ получения микронных электропроводящих дорожек на подложках анодированного алюминия

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Also Published As

Publication number Publication date
US20030024819A1 (en) 2003-02-06
KR20010042464A (ko) 2001-05-25
GB2336161B (en) 2003-03-26
GB2336161A (en) 1999-10-13
CA2327574A1 (en) 1999-10-14
JP2002511643A (ja) 2002-04-16
RU2218680C2 (ru) 2003-12-10
EP1311145A1 (de) 2003-05-14
DE69911941T2 (de) 2004-09-09
DE69921515T2 (de) 2006-02-02
AU748566C (en) 2007-03-15
KR100634221B1 (ko) 2006-10-16
PT1072176E (pt) 2004-02-27
WO1999052336B1 (en) 1999-11-18
ATE251836T1 (de) 2003-10-15
ES2234980T3 (es) 2005-07-01
BR9909489A (pt) 2000-12-19
ATE281059T1 (de) 2004-11-15
AU3337999A (en) 1999-10-25
US6524462B1 (en) 2003-02-25
AU748566B2 (en) 2002-06-06
US6949171B2 (en) 2005-09-27
EP1072176A1 (de) 2001-01-31
EP1072176B1 (de) 2003-10-08
EP1311145B1 (de) 2004-10-27
ES2211064T3 (es) 2004-07-01
DK1072176T3 (da) 2004-02-02
DE69921515D1 (de) 2004-12-02
WO1999052336A1 (en) 1999-10-14
GB9807280D0 (en) 1998-06-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee