DE60209124D1 - Verfahren zur herstellung einer gedruckten schaltung und mit dieser gedruckten schaltung hergestellte planarantenne - Google Patents
Verfahren zur herstellung einer gedruckten schaltung und mit dieser gedruckten schaltung hergestellte planarantenneInfo
- Publication number
- DE60209124D1 DE60209124D1 DE60209124T DE60209124T DE60209124D1 DE 60209124 D1 DE60209124 D1 DE 60209124D1 DE 60209124 T DE60209124 T DE 60209124T DE 60209124 T DE60209124 T DE 60209124T DE 60209124 D1 DE60209124 D1 DE 60209124D1
- Authority
- DE
- Germany
- Prior art keywords
- printed circuit
- producing
- planar antenna
- antenna produced
- electrically conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0107115 | 2001-05-25 | ||
FR0107115A FR2825228B1 (fr) | 2001-05-25 | 2001-05-25 | Procede de fabrication d'un circuit imprime et antenne planaire fabriquee avec celui-ci |
PCT/EP2002/006921 WO2002096168A2 (en) | 2001-05-25 | 2002-05-23 | Method for the manufacture of a printed circuit and planar antenna manufactured with this printed circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60209124D1 true DE60209124D1 (de) | 2006-04-20 |
DE60209124T2 DE60209124T2 (de) | 2006-10-26 |
Family
ID=8863800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60209124T Expired - Lifetime DE60209124T2 (de) | 2001-05-25 | 2002-05-23 | Verfahren zur herstellung einer gedruckten schaltung und mit dieser gedruckten schaltung hergestellte planarantenne |
Country Status (11)
Country | Link |
---|---|
US (1) | US7060418B2 (de) |
EP (1) | EP1417871B1 (de) |
JP (1) | JP2004529499A (de) |
KR (1) | KR100940132B1 (de) |
CN (1) | CN1309282C (de) |
AT (1) | ATE317633T1 (de) |
BR (1) | BR0210086A (de) |
DE (1) | DE60209124T2 (de) |
FR (1) | FR2825228B1 (de) |
TW (1) | TW566063B (de) |
WO (1) | WO2002096168A2 (de) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2789202B1 (fr) * | 1999-01-29 | 2001-04-27 | Neopost Ind | Systeme autonome multifonctions de preparation de courrier |
FR2850490A1 (fr) * | 2003-01-24 | 2004-07-30 | Framatome Connectors Int | Antenne et procede de fabrication |
DE102004007457A1 (de) * | 2004-02-13 | 2005-09-01 | Man Roland Druckmaschinen Ag | Verfahren zur Herstellung von RFID Etiketten |
TW200530933A (en) * | 2004-03-12 | 2005-09-16 | Renesas Tech Corp | Production process of inlet for electronic tag |
US7255782B2 (en) | 2004-04-30 | 2007-08-14 | Kenneth Crouse | Selective catalytic activation of non-conductive substrates |
US7417550B2 (en) | 2004-12-20 | 2008-08-26 | 3M Innovative Properties Company | Environmentally friendly radio frequency identification (RFID) labels and methods of using such labels |
EP1689020B1 (de) * | 2005-01-28 | 2013-03-20 | Mondi Gronau GmbH | Folie mit aufgedruckter Antenne |
US8026851B2 (en) | 2005-03-25 | 2011-09-27 | Toray Industries, Inc. | Planar antenna and manufacturing method thereof |
EP1734799A1 (de) * | 2005-06-13 | 2006-12-20 | MBBS Holding SA | Passiver kompakter Transponder |
CA2516141A1 (en) * | 2005-08-17 | 2007-02-17 | Intelligent Devices Inc. | Printing press control system |
US7388542B2 (en) * | 2005-11-10 | 2008-06-17 | Rcd Technology, Inc. | Method for an element using two resist layers |
NL1030664C2 (nl) * | 2005-12-13 | 2007-06-14 | Meco Equip Eng | Werkwijze voor het verbinden van sporen aan tegenover elkaar gelegen zijden van een drager. |
WO2008080893A1 (de) * | 2007-01-05 | 2008-07-10 | Basf Se | Verfahren zur herstellung von elektrisch leitfähigen oberflächen |
TWI380500B (en) * | 2007-02-06 | 2012-12-21 | Mutual Pak Technology Co Ltd | Integrated circuit device having antenna conductors and the mothod for the same |
KR100845117B1 (ko) * | 2007-02-21 | 2008-07-10 | 김효순 | 안테나 및 그 제조방법 |
US20090035522A1 (en) * | 2007-07-31 | 2009-02-05 | Smith Gilbert G | Forming electrically isolated conductive traces |
DE102008039660A1 (de) * | 2007-09-06 | 2009-03-12 | Heidelberger Druckmaschinen Ag | Bedruckstoff bearbeitende Maschine und Verfahren in einer Bedruckstoff bearbeitenden Maschine |
EP2208172A1 (de) | 2007-11-07 | 2010-07-21 | NXP Semiconductors B.V. | System, gerät und verfahren für pcb-basierte automatisierungsverfolgbarkeit |
KR100857615B1 (ko) * | 2008-01-22 | 2008-09-09 | (주)휴먼테크 | Rfid안테나 제조방법 |
KR100945669B1 (ko) | 2008-02-21 | 2010-03-05 | 주식회사 이엠따블유 | 안테나 어레이 |
US20120031656A1 (en) * | 2009-04-24 | 2012-02-09 | Yoshio Oka | Substrate for printed wiring board, printed wiring board, and methods for producing same |
US20100301005A1 (en) * | 2009-05-29 | 2010-12-02 | Nilsson Peter L J | Method of Manufacturing an Electrical Circuit on a Substrate |
US20100301006A1 (en) * | 2009-05-29 | 2010-12-02 | Nilsson Peter L J | Method of Manufacturing an Electrical Component on a Substrate |
DE102009023848B4 (de) | 2009-06-04 | 2021-10-28 | Giesecke+Devrient Mobile Security Gmbh | Verfahren zur drucktechnischen Herstellung einer elektrischen Leiterbahn |
JP5874181B2 (ja) * | 2011-03-14 | 2016-03-02 | 株式会社村田製作所 | コイルモジュールおよび非接触電力伝送システム |
CN102156902B (zh) * | 2011-04-12 | 2013-06-19 | 管超 | 一种射频标签及其制备方法 |
MY166125A (en) | 2011-09-14 | 2018-05-24 | Microconnections Sas | Rfid antenna |
JP2014063287A (ja) * | 2012-09-20 | 2014-04-10 | Toyo Aluminium Kk | 回路構成体の製造方法 |
KR101823542B1 (ko) * | 2012-10-04 | 2018-01-30 | 엘지이노텍 주식회사 | 무선충전용 전자기 부스터 및 그 제조방법 |
CN103108492B (zh) * | 2013-01-17 | 2015-10-28 | 中国科学院苏州纳米技术与纳米仿生研究所 | 柔性印刷电路的制造方法及制造装置 |
CN106134299B (zh) | 2014-03-20 | 2018-10-23 | 住友电气工业株式会社 | 印刷线路板用基板、印刷线路板以及制造印刷线路板用基板的方法 |
CN106134298B (zh) | 2014-03-27 | 2019-02-22 | 住友电气工业株式会社 | 印刷线路板用基板、印刷线路板以及制造印刷线路板用基板的方法 |
US9985344B2 (en) * | 2014-12-23 | 2018-05-29 | Te Connectivity Corporation | Electronic article and process of producing an electronic article |
JPWO2016117575A1 (ja) | 2015-01-22 | 2017-10-26 | 住友電気工業株式会社 | プリント配線板用基材、プリント配線板及びプリント配線板の製造方法 |
TWI587763B (zh) * | 2015-11-17 | 2017-06-11 | The use of gravure printing method to form conductive totem | |
US11521785B2 (en) * | 2016-11-18 | 2022-12-06 | Hutchinson Technology Incorporated | High density coil design and process |
US11387033B2 (en) | 2016-11-18 | 2022-07-12 | Hutchinson Technology Incorporated | High-aspect ratio electroplated structures and anisotropic electroplating processes |
TWI685858B (zh) * | 2017-12-04 | 2020-02-21 | 希華晶體科技股份有限公司 | 薄型化扼流器的量產方法 |
KR20210096196A (ko) * | 2018-11-30 | 2021-08-04 | 허친슨 테크놀로지 인코포레이티드 | 고밀도 코일 설계 및 프로세스 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB574946A (en) * | 1942-11-05 | 1946-01-28 | Standard Telephones Cables Ltd | Improvements in or relating to electrically insulating plates provided with a systemof electrical connections |
JPS5086675A (de) * | 1973-12-06 | 1975-07-12 | ||
NL7906422A (nl) * | 1979-08-27 | 1981-03-03 | Enschede & Zonen Grafisch | Werkwijze voor diepdruk. |
US4682415A (en) | 1985-10-28 | 1987-07-28 | U.S. Product Development Company | Method of making printed circuits |
US5304411A (en) * | 1992-05-13 | 1994-04-19 | Borden, Inc. | Chemical embossed polyvinyl chloride film |
US5758575A (en) * | 1995-06-07 | 1998-06-02 | Bemis Company Inc. | Apparatus for printing an electrical circuit component with print cells in liquid communication |
US6027762A (en) * | 1996-05-23 | 2000-02-22 | Mitsumi Electric Co., Ltd. | Method for producing flexible board |
FR2755392B1 (fr) * | 1996-11-05 | 1998-12-04 | Pechiney Emballage Alimentaire | Procede d'impression par heliogravure avec des encres a faible teneur en solvants |
US6459588B1 (en) | 1998-07-08 | 2002-10-01 | Dai Nippon Printing Co., Ltd. | Noncontact IC card and fabrication method thereof |
DE19841804A1 (de) | 1998-09-12 | 2000-03-16 | Bayer Ag | Leiterbahnen aus Polyalkylendioxythiophen |
JP2000113147A (ja) * | 1998-10-08 | 2000-04-21 | Hitachi Chem Co Ltd | Icカードとその製造法 |
EP1142456A1 (de) * | 1998-12-03 | 2001-10-10 | RT Microwave Limited | Verfahren zur beschichtung von substraten mit leitenden schichten |
JP2001052129A (ja) * | 1999-08-04 | 2001-02-23 | Dainippon Printing Co Ltd | 非接触icカードとその製造方法 |
BR0114432B1 (pt) * | 2000-10-09 | 2011-04-05 | processo para produção de uma folha metalizada, e, folha metalizada. |
-
2001
- 2001-05-25 FR FR0107115A patent/FR2825228B1/fr not_active Expired - Fee Related
-
2002
- 2002-05-23 EP EP02747421A patent/EP1417871B1/de not_active Expired - Lifetime
- 2002-05-23 US US10/477,689 patent/US7060418B2/en not_active Expired - Lifetime
- 2002-05-23 JP JP2002592691A patent/JP2004529499A/ja active Pending
- 2002-05-23 DE DE60209124T patent/DE60209124T2/de not_active Expired - Lifetime
- 2002-05-23 AT AT02747421T patent/ATE317633T1/de not_active IP Right Cessation
- 2002-05-23 KR KR1020037015314A patent/KR100940132B1/ko active IP Right Grant
- 2002-05-23 CN CNB028088360A patent/CN1309282C/zh not_active Expired - Fee Related
- 2002-05-23 WO PCT/EP2002/006921 patent/WO2002096168A2/en active IP Right Grant
- 2002-05-23 BR BR0210086-0A patent/BR0210086A/pt not_active IP Right Cessation
- 2002-05-24 TW TW091111075A patent/TW566063B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1528109A (zh) | 2004-09-08 |
FR2825228B1 (fr) | 2003-09-19 |
WO2002096168A3 (en) | 2004-03-11 |
DE60209124T2 (de) | 2006-10-26 |
KR100940132B1 (ko) | 2010-02-03 |
WO2002096168A2 (en) | 2002-11-28 |
ATE317633T1 (de) | 2006-02-15 |
US7060418B2 (en) | 2006-06-13 |
EP1417871A2 (de) | 2004-05-12 |
CN1309282C (zh) | 2007-04-04 |
TW566063B (en) | 2003-12-11 |
EP1417871B1 (de) | 2006-02-08 |
KR20040008191A (ko) | 2004-01-28 |
BR0210086A (pt) | 2004-08-17 |
FR2825228A1 (fr) | 2002-11-29 |
US20040159257A1 (en) | 2004-08-19 |
JP2004529499A (ja) | 2004-09-24 |
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Legal Events
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