EP2182787A1 - Verbesserungen in Bezug auf additive Herstellungsverfahren - Google Patents

Verbesserungen in Bezug auf additive Herstellungsverfahren Download PDF

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Publication number
EP2182787A1
EP2182787A1 EP08275066A EP08275066A EP2182787A1 EP 2182787 A1 EP2182787 A1 EP 2182787A1 EP 08275066 A EP08275066 A EP 08275066A EP 08275066 A EP08275066 A EP 08275066A EP 2182787 A1 EP2182787 A1 EP 2182787A1
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EP
European Patent Office
Prior art keywords
substrate
electrolyte
patterned area
tool
curable composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP08275066A
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English (en)
French (fr)
Inventor
designation of the inventor has not yet been filed The
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems PLC
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BAE Systems PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BAE Systems PLC filed Critical BAE Systems PLC
Priority to EP08275066A priority Critical patent/EP2182787A1/de
Priority to ES09744438T priority patent/ES2395316T3/es
Priority to PCT/GB2009/051446 priority patent/WO2010049730A1/en
Priority to CA2741925A priority patent/CA2741925C/en
Priority to EP09744438A priority patent/EP2351472B1/de
Priority to AU2009309436A priority patent/AU2009309436B2/en
Priority to BRPI0920003A priority patent/BRPI0920003A2/pt
Priority to US13/126,914 priority patent/US20110203937A1/en
Publication of EP2182787A1 publication Critical patent/EP2182787A1/de
Priority to IL212565A priority patent/IL212565A/en
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/101—Using electrical induction, e.g. for heating during soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

Definitions

  • This invention concerns improvements relating to additive manufacturing processes.
  • Direct Write is commonly used to describe a range of technologies which allows the fabrication of two or three-dimensional functional structures using processes that are compatible with being carried out directly onto potentially large complex shapes (DTI Report February 2004 "Direct Writing").
  • Direct Write manufacturing techniques include: Ink jet, Micro-spray, Quill, Pen, Aerosol, Pulsed laser evaporation, and Laser direct etching.
  • Direct Write has the ability to fabricate active and passive functional devices directly onto structural parts and assemblies. The benefits of utilising these techniques are increased functionality, reduced size and weight, reduced cost, design simplification, reduction in component number and a reduction in time to market.
  • In the field of Aerospace there are applications for Direct Write such as electronic circuits, sensors, RF devices, displays, stealth materials, meta-materials, packaging, sensors and harnesses.
  • Additive manufacturing is a generic term used to describe a process by which successive layers of a structure, device or mechanism are formed, and in which in each layer components such as electrical circuit components may be formed by a Direct Write method.
  • additive is used to contrast conventional manufacturing processes such as lithography, milling, turning etc, in which material from a solid layer or object is taken away or removed.
  • writing or printing materials are referred to as inks, although the actual form of the material may comprise a wide range of powders, suspensions, plasters, colloids, solutes, vapours etc, which may be capable of fluid flow and which may be applied in pastes, gels, sprays, aerosols, liquid droplets, liquid flows, etc.
  • the material may be fixed by curing, consolidating, sintering or allowing to dry, frequently involving application of heat to change the state of the material to a solid phase.
  • the term "Direct Write ink” is intended to cover all such materials.
  • the object or structure (which may be a very large three-dimensional object) on which the deposition is performed is referred to in the art by the term "substrate", and this is the sense of the term as used in the present specification.
  • the deposited ink once fixed on the substrate, forms a component or part or layer or precursor of a structure that is to be manufactured.
  • the substrates can be virtually any structural or non-structural components or objects or structures.
  • Direct Write can be useful where the substrate is a structural component having a flat surface or having a conformal surface, by which is meant a surface curved in two directions.
  • Direct Write might be particularly suited to the application of printed electronics, sensors and wiring directly onto structural components of a substrate or an object, for example where there was a desire to save weight.
  • Some examples of functional structures which might be applied to such a substrate include antennae and frequency selective surfaces, microwave filters, wires on a surface of a large object such as an aircraft, the inside of the car, inside a helmet or other item of clothing etc.
  • a factor which tends to limit the application of Direct Write in circumstances where in the current state of the art bulk wire with conventional bulk metal properties is used is the limited conductivity of commonly available printed materials.
  • the electrical conductivity of deposited and fixed Direct Write Ink is much less than that of typical bulk metal wire conductor, and can be as low as a few percent of the bulk metal.
  • electroless plating is known in which a seed layer is printed over the area which is to be plated, the coated surfaces then immersed in a metal solution, and metal lines then condense onto the activating layer.
  • time and temperature By controlling time and temperature the thickness of the coating can be controlled, and thick coatings (tens of microns or more) can be grown which approximate more to bulk metal properties.
  • the technique is generally considered to be incompatible with Direct Write as the fine control of temperature and immersion time required for good uniform coatings imposes a requirement that the component plus seed layer be immersed in a bath of solution. This is not compatible with printing directly onto large structural substrates.
  • Electroplating may similarly involve the coating of the surface with an initial seed layer.
  • the substrate is then immersed in a metal solution, a current is passed through the seed layer, and metal lines from the solution condense onto the seed layer. Again, it is usual to require a bath. Again, therefore, the technique offers limited compatibility to Direct Write.
  • Electroplating methods which do not involve a bath are known. For example, in brush electroplating, localized areas or entire items are plated using a brush saturated with plating solution. A refinement of a localized bathless electroplating method is described in WO99/52336 and W02004/07320 . The effectiveness of such a method may depend on the provision of a suitable deposition surface.
  • the present invention aims to overcome or at least substantially reduce some or all of the above discussed drawbacks.
  • the invention combines principles of Direct Write techniques or other techniques offering comparable flexibility in applying patterns to the surfaces of conformal objects and principles of electroplating to lay down functional materials on a substrate that approximate better than conventional Direct Write materials to bulk metal conductivity, but that overcome the need in an electroplating process of placing a substrate in a bath, and preferably further the need in a Direct Write process of placing a substrate in an oven.
  • a suitable surface preparation step is carried out to create an at least partially conducting patterned area in an appropriate pattern on a substrate surface.
  • a surface layer material such as a Direct Write ink is applied to form an at least partially conducting patterned area in an appropriate pattern.
  • This serves as an initial layer which may be of limited conductivity, but is sufficiently conductive to act as a seed layer for electroplating of a conductor.
  • the conductor is plated in situ in a bathless process. For example the conductor is plated in situ as part of a continuous process immediately subsequent to the Direct Write printing and fixing of the initial layer.
  • the present invention provides a method of forming a component of a conductive structure on a substrate, comprising: in a first step applying a surface treatment to said substrate to form a patterned area having at least some electrical conductivity; in a second step electroplating onto the patterned area by means of a tool comprising a first electrode and an electrolyte source for in situ supply of electrolyte, by providing an anode current to the first electrode, causing the patterned area at least in the vicinity of the tool to function as a cathode, and passing electrolyte between said patterned area and said first electrode, thereby to deposit conductive material onto said patterned area.
  • selected areas of the surface of said substrate defining the patterned area are subjected to a physical treatment that modifies the conductive properties of the substrate itself, for example by application of an external energy source such as a light source to selected areas of the surface of the substrate.
  • an external energy source such as a light source
  • selected areas of the substrate itself have modified conductive properties sufficiently conductive to act as a seed layer for electroplating of a conductor in the second step.
  • a surface layer material is applied to selected areas of the surface of said substrate defining the patterned area to create a patterned area having at least some electrical conductivity.
  • the surface layer material is at least sufficiently conductive to act as a seed layer for electroplating of a conductor in the second step.
  • the surface layer material may conveniently comprise a material adapted to be applied in fluid form (for example as a liquid, colloid, solution or other flowable composition) and secondarily treated to form a consistent and for example solid conductive layer.
  • the first step of the method thus comprises applying such a fluid material to selected areas of the surface of the substrate and secondarily treating the fluid material to fix it in situ thereon.
  • the surface layer material is for example a curable composition, and the first step of the method comprises applying a curable composition to selected areas of the surface and curing the same in situ thereon.
  • the fluid material may be secondarily treated and fixed in any known manner, and for example may be a curable material to be cured thermally, via a photocure, a chemical cure or otherwise.
  • the fluid material may be secondarily treated for example via a batch or continuous method.
  • the secondary treatment step of fixing the fluid material comprises a step of secondarily treating the fluid material and for example curing a curable composition in situ via a continuous method, for example by means of a drying process, a thermal cure, a photocure, a chemical cure etc in familiar manner.
  • the step of secondarily treating the fluid material and for example curing the curable composition is performed closely consecutively to the step of applying the fluid material or curable composition in a continuous progressive process, so that a pattern of a fluid material/ curable composition is applied onto and fixed in situ on a predetermined region of the substrate in a continuous manner.
  • the fluid material is a curable composition requiring an input energy for cure, for example to effect a thermal cure or photocure
  • the step of curing the curable composition comprises positioning a means to supply a curing energy to the region having the curable composition applied and operating the same to input energy to the region in order to fix the curable composition.
  • the means to supply a curing energy is adapted to supply a curing energy in localised manner to a local portion of a region having the curable composition applied, most preferably to a local portion closely successively behind a printing site so that a pattern of a curable composition may be applied onto and cured in situ on a substrate in a progressive continuous manner.
  • the heating means is an inductive heating means and the step of curing the curable composition comprises positioning such inductive heating means adjacent to said region having said curable composition applied, and passing an electrical current through said inductive heating means such as to heat said region by electromagnetic inductive effects, in order to cure the curable composition.
  • the height of the inductive heating means above the curable composition as applied is controlled in such manner as to control the amount of magnetic flux applied to the substrate.
  • the means to supply a curing energy is an electromagnetic radiation source and the step of curing the curable composition comprises positioning such radiation source remotely spaced from but adjacent to said region having said curable composition applied, and operating the radiation source such as to expose said region to incident radiation in order to photocure the curable composition.
  • the radiation source is a light source for example of visible or ultraviolet light.
  • the steps of applying the surface treatment to the substrate and plating the conductor are performed closely consecutively in a continuous progressive process, so that a pattern of areas of seed conductivity is created on a surface of a substrate, for example in the preferred embodiment in that a secondarily fixable material such as a curable composition is applied onto and fixed onto a surface of a substrate, and a conductor is then deposited onto a substrate in a continuous manner.
  • a secondarily fixable material such as a curable composition is applied onto and fixed onto a surface of a substrate, and a conductor is then deposited onto a substrate in a continuous manner.
  • a plating tool which comprises electrolyte holding means to hold a locally isolated supply of electrolyte, for example comprising an absorptive member in which electrolyte can be carried, in which the means to supply an anode current is an electrode in electrical connection with electrolyte carried by the electrolyte holding means, and in which a coating of electrolyte is applied to the substrate by bringing the electrolyte holding means into function association with the patterned area, and for example into contact with the patterned area.
  • a means to cause the patterned area at least in the vicinity of the tool to function as a cathode is a second electrode, electrically insulated from the first electrode and spaced from the electrolyte holding means, and the method comprises bringing the second electrode into contact with the patterned area spaced from but simultaneously with bringing the electrolyte holding means into functional association with, and in the preferred case bringing the absorptive member into contact with the patterned area.
  • the patterned area may be treated with a scanning electron beam to ionise the patterned and create an opposite polarity to the polarity of the first electrode.
  • the present invention provides an apparatus for forming a component on a substrate, comprising: a surface treatment tool adapted to treat the surface of said substrate for example in the form of a line or at least one line to form a patterned area having at least some electrical conductivity; and an electroplating tool comprising a first electrode and a current supply for providing an anode current to the first electrode, a means to cause the patterned area at least in the vicinity of the electroplating means to function as a cathode, and an electrolyte source for in situ supply of electrolyte between said patterned area and said first electrode, thereby to deposit conductive material onto said patterned area.
  • the surface treatment tool is adapted to apply a physical treatment that modifies the conductive properties of the substrate itself, for example comprising an external energy source such as a light source directable to act upon selected areas of the surface of the substrate.
  • a physical treatment that modifies the conductive properties of the substrate itself, for example comprising an external energy source such as a light source directable to act upon selected areas of the surface of the substrate.
  • the surface treatment tool may comprise a source of a surface layer material as above described adapted to enable the surface layer material to be applied in use to selected areas of the surface of said substrate defining the patterned area to create a patterned area having at least some electrical conductivity.
  • the surface layer material may conveniently comprise a fluid material adapted to be applied in fluid form and secondarily treated to form a consistent and for example solid conductive layer.
  • the surface layer material is for example a curable composition such as a Direct Write ink composition.
  • the surface treatment tool preferably comprises a printer including fluid material/ curable composition deposition means for applying a fluid material/ curable composition onto a region of a substrate for example in the form of a line or at least one line to form a patterned area having at least some electrical conductivity; electroplating means comprising a first electrode and a current supply for providing an anode current to the first electrode, a means to cause the patterned area at least in the vicinity of the electroplating means to function as a cathode, and an electrolyte source for in situ supply of electrolyte between said patterned area and said first electrode, thereby to deposit conductive material onto said patterned area.
  • the printer further comprises fixing means to fix fluid material/ curing means to cure curable composition deposited on a substrate.
  • the fixing means comprises a means to fix surface layer material deposited on a substrate in situ.
  • the fixing means comprises a means positioned to fix surface layer material immediately subsequently to deposition on a substrate to allow print and fix on a predetermined region of the substrate in a progressively continuous manner.
  • the surface layer material is a curable composition requiring an input energy for cure, for example to effect a thermal cure or photocure
  • the fixing means comprises a means supply a curing energy to the region having the curable composition applied to cure the same.
  • the means to supply a curing energy is adapted to supply a curing energy in localised manner to a local portion of a region having the curable composition applied, most preferably to a local portion closely successively behind a printing site so that a pattern of a curable composition may be applied onto and cured in situ on a substrate in a progressive continuous manner.
  • the means to supply a curing energy is mounted in spaced relationship with the curable material deposition means, conveniently on a common Direct Write head, so that the curable material deposition means and the means to supply a curing energy may be brought into successive functional contact with a substrate in use to deposit cured material onto the substrate in a progressively continuous manner.
  • the fixing means comprises a means to heat curable material in said region in situ and cure the same.
  • the fixing means comprises inductive heating means for positioning adjacent said region such as to heat said region by electromagnetic inductive effects as above described.
  • the fixing means comprises an electromagnetic radiation source for use with a radiation cured curable material, and for example an optically cured curable material, for positioning adjacent said region such as to expose said region to curing radiation.
  • a radiation source is for example a light source, and is for example a source of optical or uv light.
  • a radiation source preferably provided focused radiation, and is for example a laser source.
  • the electroplating tool comprises a means adapted to electroplate conductor onto areas of seed conductivity immediately subsequently to those areas being formed by the surface treatment tool allow creation of a seed layer and subsequent plating of conductor on the substrate in a continuous manner.
  • the electroplating tool is juxtaposed in close association behind the surface treatment tool is a use direction to be so adapted.
  • the electroplating tool includes an electrolyte source to hold a locally isolated supply of electrolyte in which electrolyte can be carried, an electrode in electrical connection with electrolyte carried by the electrolyte source and adapted for connection with a means to supply an anode current , and a means to bring the electrolyte source into selective functional association to effect plating, for example by contact, with the patterned area.
  • the means to hold a locally isolated supply of electrolyte and provide an electrolyte source comprises an absorptive member in which electrolyte can be carried.
  • the absorptive member is a brush that can be wiped across the surface of the substrate to coat electrolyte onto the patterned area.
  • the absorptive member comprises a flexible foam material having interconnecting pores.
  • the tool may additionally comprise an electrolyte supply to feed a supply of electrolyte to electrolyte source.
  • a means to cause the patterned area at least in the vicinity of the tool to function as a cathode is a second electrode, electrically insulated from the first electrode and spaced from the electrolyte source, the electroplating means includes means to bring the second electrode into selective contact with the patterned area.
  • the second electrode may comprise two electrically connected second electrodes mounted on opposite sides of the electrolyte source such that as the electrolyte source progressively contacts the surface of a substrate in use one of the second electrodes leads the electrolyte source and the other second electrode, trails the electrolyte source.
  • a means to cause the patterned area at least in the vicinity of the tool to function as a cathode comprises a scanning electron beam source to ionise the patterned area in the vicinity of the beam and create an opposite polarity to the polarity of the first electrode.
  • Means may be provided to focus the electron beam by tuning of voltages applied within an electron gun; and/ or to spread the electron beam by tuning of voltages applied within an electron gun; and/ or to vary the position of the electron beam at the target; and/ or to direct a plurality of electron beams to one or more regions of the target; and for example to direct at least two electron beams which are on opposite sides of the target.
  • the electron beam source may conveniently be co-located with an anode as above described in an electroplating tool.
  • the invention relies upon the combination of a surface preparation processes, such as Direct Write ink printing process or other processes to create controlled patterned areas typically of relatively low conductivity, to print an initial strike layer for the electroplating process, and the use of a localised electroplating process to print conductor, and for example metal, to a sufficient thickness to have properties which approximate to bulk properties, onto this strike layer.
  • a surface preparation processes such as Direct Write ink printing process or other processes to create controlled patterned areas typically of relatively low conductivity
  • a localised electroplating process to print conductor, and for example metal
  • the layer initially applied to or created on the surface does not need to have a high electrical conduction, and that offered by typical Direct Write inks for example is sufficient.
  • the bulk properties of the fabricated functional material are provided in large part by the electroplated layer.
  • a conductive layer may be deposited consistently and accurately to what amounts to a sufficient thickness to approximate to bulk metal conduction properties.
  • deposition takes place via an additive process based on Direct Write or other controllable surface patterning process which allows both the surface to be prepared and the subsequent conductive layer to be deposited in situ on a substrate surface without requiring the substrate to be transferred to a curing oven or electroplating bath.
  • the method and apparatus of the invention are applicable to the direct printing of conductors in substitution for electrical wires, or of the direct in situ fabrication of electronic devices and elements, in a desired position on a large structural object.
  • a curable composition is fixed in situ by provision of a fixing means for example comprising a curing energy source spaced from but able to impart curing energy to a region in which the ink has been applied.
  • a fixing means for example comprising a curing energy source spaced from but able to impart curing energy to a region in which the ink has been applied.
  • a localised heating source such as an induction coil as above described, or a localised photocure source such as a laser is used.
  • the curing of a curable composition applied to a conformal surface by means of such a curing tool permits localisation of the energy input to the region in which ink has been applied, but since the tool is spaced from the substrate, the tool may follow the non-linear shape of the surface.
  • the use of an electroplating method which relies upon the fixed curable composition such as Direct Write Ink on such a conformal surface, with its limited conductivity, to serve as a seed layer in conjunction with the first electrode, and lays down the primary conducting material by an electroplating process similarly conveniently involves the movement of an electroplating head in close proximity to, but spaced from the substrate, so that the electroplating head may similarly follow the non-linear shape of the surface.
  • the method comprises the performance of the steps of the method closely successively on a given region of substrate. Conveniently, each is performed as a continuous process progressively across a substrate until a desired component has been formed.
  • the surface treatment tool and the electroplating tool are so disposed on a common apparatus as to be movable across the substrate surface such that the surface treatment tool and the electroplating tool are brought in use consecutively in close succession into functional contact (that is, either into actual contact or into sufficiently close proximity to achieve the desired effect as above described) with the surface.
  • the surface treatment tool comprises a printer including fluid surface layer material deposition means and fluid surface layer material fixing means
  • the deposition means, fixing means and electroplating tool are so disposed on a common apparatus as to be movable across the substrate surface such that the deposition means, fixing means and the electroplating tool are brought consecutively in close succession into functional contact with the surface.
  • a combined working head is provided, for example as part of a suitable machine which may move the working head in a desired pattern across the surface of a substrate, including, disposed for successive functional contact with the surface of the substrate, a surface treatment tool such as a printer comprising deposition means and fixing means, and an electroplating means as above described.
  • a plating tool is used which brings only a small and localised quantity of electrolyte into contact with the substrate.
  • the method can to some extent be regarded as a substantially dry electroplating method. It is possible to electroplate functional materials with a range of complex and disconnected shapes and properties on a conformal substrate in a manner which would not be practical by an immersion system. It is possible to plate discrete and separate components on a single substrate. For example, using the method or apparatus of the invention, it is possible, via a localised process based on Direct Write or other similarly controllable surface preparation treatment, to provide a variety of electronics, sensors and wiring directly onto substrates having difficult conformal surfaces.
  • the properties of the conductive layer, and in particular the thickness of the conductive layer, can be closely controlled.
  • the thickness of the conductive layer is essentially determined by the current/ time profile for the third, electroplating step. Functional structures of a range of desired thicknesses can be built up on an initial surface, and in particular structures can be built which have a sufficient thickness to approximate to the properties of more conventionally fabricated bulk metal components.
  • the components formed by the process may typically be tracks or lines, which are long in relation to their width and height above the substrate. Such tracks or lines may form electrical interconnects, electrical resistive or reactive components, or passive components such as filters. Where areas of deposited ink are required, for example rectangular capacitance pads, these may be formed by deposition of a large number of parallel lines, closely spaced or touching one another. Alternatively, the lines may be distributed over a surface in such a way as to give the surface desired electromagnetic reflective and absorbent characteristics.
  • the width of tracks formed the process depend on various factors, including inherent ink and substrate characteristics such as viscosity, surface writing temperature, as well as the process parameters of pressure, nozzle size, tip to substrate offset and processing speed.
  • the width of the tracks may be less than about 5 mm, for example between 3 and 5 mm. However the width may be decreased to any desired value, depending mainly on the nozzle diameter and the distance of the nozzle from the substrate. Currently a minimum width of about 50 ⁇ m may be envisaged.
  • Conductive tracks may be built up from a series of parallel tracks of much smaller width. For example, a 5 mm wide track may be formed from 5 narrow tracks 900 mm wide.
  • the fixing of the curable composition is performed in a possible embodiment using an induction coil through which an oscillating current is passed.
  • the coil is placed above the region to be cured.
  • the oscillating current induces charge movement (eddy currents) in the region to be cured and the resistance to this charge movement causes Joule heating in the affected area and thus curing and sintering the inks.
  • the current required for curing will depend on the dimensions of the area to be cured and its electrical and thermal properties, and will thus vary depending on the specifics of the application.
  • a problem with other curing methods that may use localised radiation (such as laser or lamp radiation) is that it is difficult to ascertain when curing has been completed or indeed what the state of the inks being cured is.
  • An additional advantage of this preferred embodiment is that there may be a degree of self control and inherent process monitoring; as the curing progresses the resistance of the inks decreases and thus the rate of curing may decrease. This effect may be monitored and curing automatically adjusted as the curing progresses.
  • the width of a track of curable composition deposited is a key parameter in determining the dimension of an induction coil for heating the track, since the magnetic flux generated should preferably cover the whole width of the track. Equally a coil which produces substantial flux outside the width of the track will be wasteful of energy and may interfere with neighbouring structures.
  • an induction coil of small diameter, comparable to track width. If tracks are formed as a series of parallel lines, the coil may have a diameter comparable to the width of an individual line.
  • a cylindrical coil is vertically disposed above a track so as to produce a strong flux density at its end adjacent the track.
  • the coil may be formed in a U shape so that both ends are positioned adjacent the track. Flux focussing elements such as ferromagnetic core elements may be employed. However any shape or configuration of coil may be used as desired, e.g. toroidal, flat.
  • the spacing of the coil above the track is also recognised to be a key factor, and a spacing of less than about 50 ⁇ m is desirable.
  • a capacitance bridge is employed to sense the spacing.
  • the amount of heating produced in the track will depend on the electrical resistance of the ink. Typically inks will have an initial resistance >100s ⁇ /m, but as curing takes place this will decrease, and with suitable curing conditions this can be reduced to ⁇ 1 ⁇ /m.
  • the track dimensions (height, width) of the deposited ink will also have a direct effect on resistance. For electrical interconnects, a resistance of 3.5 ⁇ /m is typical.
  • the fixing of the curable composition is performed in an alternative possible embodiment using a radiation source such as a laser source from which a beam is directed towards a region to be cured.
  • the radiation source is placed above the region to be cured. Radiation such as optical radiation is generated.
  • the frequency and intensity of radiation for curing will depend on the dimensions of the area to be cured and on its particular optical cure properties, and will thus vary depending on the specifics of the application. Suitable combinations of radiation curable ink and radiation source will be familiar to the skilled person.
  • a surface layer material in accordance with the invention need not have high electrical conductivity, but needs to be sufficiently conductive to serve as a strike layer for the subsequent electroplating step.
  • the surface layer material is thus preferably a conductive ink, for example comprising a curable polymer composition loaded with electrically conductive particles.
  • the polymer may be for example radiation curable, and for example photocurable, or may be thermally curable or otherwise curable or fixable.
  • the electrolyte comprises a plating solution for laying down a conductive layer of conductive material, and in particular a layer of conductive metallic material in such manner as to approximate to bulk metal properties.
  • the electrolyte is conveniently any suitable metal salt or like composition from which such a metallic conductor layer can be deposited onto the patterned prepared surface as above described. Suitable salts will be familiar.
  • FIG. 1 there is shown a schematic diagram of a combination working head for a Direct Write process according to the principles of the invention incorporating a Direct Write head with an inductive heating coil and a plating head.
  • an initial surface preparation treatment to create a limited conductivity strike surface for subsequent plating is via deposition of a Direct Write ink, It will be appreciated that an initial surface preparation involving other deposited curable or other surface layer materials, or direct modification of the surface itself, for example by exposure to light, will be within the scope of the invention.
  • a working head 10 of a deposition mechanism in accordance with the invention includes a Direct Write portion 11 having a nozzle 12 for emitting a Direct Write ink (which could be in the form of a vapour, particles, jet, or a liquid extrusion).
  • the Direct Write ink is deposited as a track 2 on the substrate 4.
  • the Direct Write ink forms a layer of fixable material which in the embodiment is susceptible to a thermal cure.
  • the track comprises a thermally curable polymer.
  • the Direct Write ink is to some extent electrically conductive, and for example comprises a thermally curable polymer having inherently conductive properties and/ or loaded with conductive particles.
  • Thermal cure is effected locally by means of induction heating means, removing the need to place the object in a curing tank or oven.
  • An induction coil 6 is formed as a flat coil in a printed circuit, and is affixed to the underside of the head.
  • a source of alternating current 14 is coupled to the coil 6, and an ammeter 16 is used to monitor the current through the coil 6.
  • the gap 8 of the print head 10 and coil 6 above the ink 2 has an associated capacitance Ch, dependent on the height of the head.
  • This capacitance value Ch is measured in a capacitance bridge 18, against a reference capacitance CR (as shown in Figure 2 ).
  • a resulting voltage V is employed to adjust the height of the head by a suitable mechanism 20.
  • Capacitance value Ch provides a means of monitoring the height of the head 10 for ensuring optimum deposition and heating. Measurement of the heating current provides a means of controlling the overall heating of the deposited ink, as schematically indicated at 22, since as the ink changes to a solid phase, the impedance of the ink to current flow will change and therefore the heating current will change accordingly. Depending on the precise ink and line characteristics, the resistance or reactance of the ink line may decrease (or increase).
  • FIG 2 there is shown a schematic diagram which demonstrates the principle of operation of the inductive fixing means in greater detail.
  • Ink 2 to be cured is deposited on a substrate 4 (which can be flat or curved).
  • the ink 2 to be cured is then scanned over with an induction coil 6, following the printed/deposition features of the ink.
  • the gap 8 between the ink 2 and the coil 6 and the scanning speed are controlled to provide optimum heating.
  • the coil 6 is attached to the deposition head in figure 1 so that it automatically and immediately follows the deposition as the head is moved in direction d so that deposition and curing is done in a single step.
  • the curing step can be isolated from the deposition step and the coil scans the deposited area independently of the deposition head.
  • an induction coil to impart a localised curing energy to the printed ink track 2 is merely an example embodiment of the invention.
  • at least some form of localised cure is employed, in particular in close succession to the deposition step.
  • a curing tool is provided which imparts such a curing energy.
  • an induction coil is just one such example.
  • Further examples of such curing tools might include a laser for an optically curable ink.
  • the combination deposition head 10 further includes a plating tool 24 to supply an electroplating solution in a controlled manner to an area of the surface of the substrate 4 on which has been deposited and cured a track of ink 2 in the manner above described.
  • the plating tool is disposed to be applied to the ink track 2 closely subsequently to its cure by the action of the coil 6.
  • the tool includes an electrolyte retaining formation 26, which may for example be an absorptive member impregnated with a suitable plating solution for electroplating a desired conductor.
  • a first electrode 29 makes electrical contact with the solution and supplies an anode current so that the arrangement serves as an anode.
  • the tool 24 is moved into contact with the surface of the printed track so that plating solution makes contact with the surface, for example in the case of a use of an absorptive member, in that a tip of the absorptive member presses onto the track surface.
  • a pair of second Electrodes 28 makes additional contact with the track surface.
  • the first electrode 29 is connected to a positive pole of an electroplating circuit to provide an anode and the second electrodes 28 are connected to a negative pole of an electroplating circuit to provide a cathode in familiar manner.
  • the electrolyte retaining formation 26 serves as an anode and the printed track serves as a cathode.
  • printed inks might have relatively low conductivity, the ink is selected to have at least sufficient conductivity that it can serve as a precursor surface by functioning as a cathode as part of an electroplating circuit in this way.
  • the tool 24 may make progressive contact across printed regions of the substrate to plate continuously on printed tracks.
  • the tool forms part of a combined deposition head so that if the deposition head is moved in a direction d the plating step automatically and immediately follows the deposition and cure steps, so that deposition, curing and plating are done in a single step process as the combination head is moved.
  • the plating step can be isolated from the deposition step or combined deposition and cure step and the plating tool 24 may scan the deposited track area independently of the rest of the deposition head.
  • the combination tool may be used to deposit in situ complex and discrete functional structures with properties which substantially approximate to those of the bulk conductor which is electroplated even on difficult conformal substrates.
  • the Direct Write ink track 2 serves merely as a precursor layer, forming a cathode of the electroplating circuit with the electroplating tool, but ultimately playing a negligible role in the bulk properties of the final fabricated structure. Accordingly, as will be familiar for Direct Write inks, it can have relatively low conductivity.
  • the structure need not be immersed in a plating solution.
  • a preferred embodiment as illustrated nor need it be immersed in a curing oven or the like.
  • the tool illustrated allows a precursor conductive layer to be deposited and cured, and a substantive layer having substantially bulk metal properties to be plated thereon, by a simple combination tool via a progressive serial and continuous process in situ.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
EP08275066A 2008-10-30 2008-10-30 Verbesserungen in Bezug auf additive Herstellungsverfahren Ceased EP2182787A1 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
EP08275066A EP2182787A1 (de) 2008-10-30 2008-10-30 Verbesserungen in Bezug auf additive Herstellungsverfahren
ES09744438T ES2395316T3 (es) 2008-10-30 2009-10-28 Mejoras relativas a procesos de fabricación aditivos
PCT/GB2009/051446 WO2010049730A1 (en) 2008-10-30 2009-10-28 Improvements relating to additive manufacturing processes
CA2741925A CA2741925C (en) 2008-10-30 2009-10-28 Improvements relating to additive manufacturing processes
EP09744438A EP2351472B1 (de) 2008-10-30 2009-10-28 Verbesserungen in bezug auf additive herstellungsprozesse
AU2009309436A AU2009309436B2 (en) 2008-10-30 2009-10-28 Improvements relating to additive manufacturing processes
BRPI0920003A BRPI0920003A2 (pt) 2008-10-30 2009-10-28 método para formar um componente de uma estrutura condutora em um subtrato, e, aparelho para formar um componente em um substrato.
US13/126,914 US20110203937A1 (en) 2008-10-30 2009-10-28 Additive manufacturing processes
IL212565A IL212565A (en) 2008-10-30 2011-04-28 METHOD AND DEVICE FOR PRODUCING A COMPONENT OF A CONDUCTIVE STRUCTURE ON A SUBSTRATE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP08275066A EP2182787A1 (de) 2008-10-30 2008-10-30 Verbesserungen in Bezug auf additive Herstellungsverfahren

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3292990A4 (de) * 2015-05-07 2019-03-27 LG Chem, Ltd. 3d-drucker
EP3525217A1 (de) * 2018-02-12 2019-08-14 United Technologies Corporation Verfahren und materialien für bedruckte magnete
US11648731B2 (en) 2015-10-29 2023-05-16 Hewlett-Packard Development Company, L.P. Forming three-dimensional (3D) printed electronics

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2060699A (en) * 1979-10-03 1981-05-07 Metadalic Ltd Electroplating apparatus
WO1999034036A1 (en) * 1997-12-31 1999-07-08 Mclaughlin Daniel A Portable self-powered hand-held electroplating wand
WO1999052336A1 (en) 1998-04-06 1999-10-14 John Michael Lowe Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
US20030173225A1 (en) * 1998-04-06 2003-09-18 Lowe John Michael Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
WO2004007320A1 (fr) 2002-07-05 2004-01-22 Gebo Industries (Societe Anonyme) Tapis de convoyage

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2060699A (en) * 1979-10-03 1981-05-07 Metadalic Ltd Electroplating apparatus
WO1999034036A1 (en) * 1997-12-31 1999-07-08 Mclaughlin Daniel A Portable self-powered hand-held electroplating wand
WO1999052336A1 (en) 1998-04-06 1999-10-14 John Michael Lowe Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
EP1311145A1 (de) * 1998-04-06 2003-05-14 Technology Development Associate Operations Limited Verfahren zur Erzeugung von Leiterbahnen auf einer gedruckten Schaltung
US20030173225A1 (en) * 1998-04-06 2003-09-18 Lowe John Michael Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
WO2004007320A1 (fr) 2002-07-05 2004-01-22 Gebo Industries (Societe Anonyme) Tapis de convoyage

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3292990A4 (de) * 2015-05-07 2019-03-27 LG Chem, Ltd. 3d-drucker
US10974455B2 (en) 2015-05-07 2021-04-13 Lg Chem, Ltd. 3D printer
US11648731B2 (en) 2015-10-29 2023-05-16 Hewlett-Packard Development Company, L.P. Forming three-dimensional (3D) printed electronics
EP3525217A1 (de) * 2018-02-12 2019-08-14 United Technologies Corporation Verfahren und materialien für bedruckte magnete

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