DE69904755D1 - Electrostatische halterorrichtung - Google Patents

Electrostatische halterorrichtung

Info

Publication number
DE69904755D1
DE69904755D1 DE69904755T DE69904755T DE69904755D1 DE 69904755 D1 DE69904755 D1 DE 69904755D1 DE 69904755 T DE69904755 T DE 69904755T DE 69904755 T DE69904755 T DE 69904755T DE 69904755 D1 DE69904755 D1 DE 69904755D1
Authority
DE
Germany
Prior art keywords
electrostatic
electrodes
maintaining
bracket
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69904755T
Other languages
English (en)
Other versions
DE69904755T2 (de
Inventor
Yvon Pellegrin
Jose Hernandez
Richard Claude
William Hale
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semco Engineering SA
Original Assignee
Semco Engineering SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semco Engineering SA filed Critical Semco Engineering SA
Application granted granted Critical
Publication of DE69904755D1 publication Critical patent/DE69904755D1/de
Publication of DE69904755T2 publication Critical patent/DE69904755T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Motor Or Generator Frames (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Developing Agents For Electrophotography (AREA)
  • Materials For Medical Uses (AREA)
  • Excavating Of Shafts Or Tunnels (AREA)
  • Liquid Crystal (AREA)
  • Plasma Technology (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
DE69904755T 1998-11-10 1999-11-10 Electrostatische halterorrichtung Expired - Lifetime DE69904755T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9814161A FR2785737B1 (fr) 1998-11-10 1998-11-10 Dispositif de maintien electrostatique
PCT/FR1999/002767 WO2000028654A1 (fr) 1998-11-10 1999-11-10 Dispositif de maintien electrostatique

Publications (2)

Publication Number Publication Date
DE69904755D1 true DE69904755D1 (de) 2003-02-06
DE69904755T2 DE69904755T2 (de) 2003-10-16

Family

ID=9532599

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69904755T Expired - Lifetime DE69904755T2 (de) 1998-11-10 1999-11-10 Electrostatische halterorrichtung

Country Status (9)

Country Link
EP (1) EP1138111B1 (de)
JP (1) JP4763890B2 (de)
AT (1) ATE230526T1 (de)
AU (1) AU1166500A (de)
CA (1) CA2350653C (de)
DE (1) DE69904755T2 (de)
DK (1) DK1138111T3 (de)
FR (1) FR2785737B1 (de)
WO (1) WO2000028654A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7232591B2 (en) * 2002-04-09 2007-06-19 Matsushita Electric Industrial Co., Ltd. Method of using an adhesive for temperature control during plasma processing
FR2878371B1 (fr) * 2004-11-25 2007-03-02 Semco Engineering Sa Sa Dispositif de maintien electrostatique a plusieurs sources d'alimentation
JP6281825B2 (ja) * 2013-03-29 2018-02-21 株式会社クリエイティブテクノロジー チャック装置
WO2017192911A1 (en) 2016-05-04 2017-11-09 Idea Pond Llc Adaptive flashlight control module

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4724510A (en) * 1986-12-12 1988-02-09 Tegal Corporation Electrostatic wafer clamp
JPS63257481A (ja) * 1987-04-14 1988-10-25 Abisare:Kk 静電保持装置
US5001594A (en) * 1989-09-06 1991-03-19 Mcnc Electrostatic handling device
JPH0435043A (ja) * 1990-05-31 1992-02-05 Fujitsu Ltd 静電チャック装置
US5055964A (en) * 1990-09-07 1991-10-08 International Business Machines Corporation Electrostatic chuck having tapered electrodes
JPH04132239A (ja) * 1990-09-21 1992-05-06 Fujitsu Ltd ウエハーチャック
US5184398A (en) * 1991-08-30 1993-02-09 Texas Instruments Incorporated In-situ real-time sheet resistance measurement method
WO1994011944A1 (en) * 1992-11-06 1994-05-26 Varian Associates, Inc. Electrostatic wafer clamp
JPH0855900A (ja) * 1994-08-11 1996-02-27 Fujitsu Ltd 静電吸着方法とその装置と半導体装置の製造方法
JP4079992B2 (ja) * 1994-10-17 2008-04-23 バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド 導電性被処理体を載置部材に締め付けるための装置及び静電クランピング方法
JP3191139B2 (ja) * 1994-12-14 2001-07-23 株式会社日立製作所 試料保持装置
JP3911787B2 (ja) * 1996-09-19 2007-05-09 株式会社日立製作所 試料処理装置及び試料処理方法

Also Published As

Publication number Publication date
JP2003520416A (ja) 2003-07-02
WO2000028654A1 (fr) 2000-05-18
DE69904755T2 (de) 2003-10-16
FR2785737A1 (fr) 2000-05-12
ATE230526T1 (de) 2003-01-15
FR2785737B1 (fr) 2001-01-05
JP4763890B2 (ja) 2011-08-31
CA2350653A1 (fr) 2000-05-18
EP1138111B1 (de) 2003-01-02
EP1138111A1 (de) 2001-10-04
DK1138111T3 (da) 2003-04-22
CA2350653C (fr) 2008-01-15
AU1166500A (en) 2000-05-29

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Legal Events

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