WO2001061732A3 - Einrichtung zum schutz eines auf einem trägersubstrat angeordneten elektrischen und/oder elektronischen bauteils vor elektrostatischen entladungen - Google Patents

Einrichtung zum schutz eines auf einem trägersubstrat angeordneten elektrischen und/oder elektronischen bauteils vor elektrostatischen entladungen Download PDF

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Publication number
WO2001061732A3
WO2001061732A3 PCT/DE2001/000512 DE0100512W WO0161732A3 WO 2001061732 A3 WO2001061732 A3 WO 2001061732A3 DE 0100512 W DE0100512 W DE 0100512W WO 0161732 A3 WO0161732 A3 WO 0161732A3
Authority
WO
WIPO (PCT)
Prior art keywords
protecting
electric
electronic component
carrier substrate
electroconductive
Prior art date
Application number
PCT/DE2001/000512
Other languages
English (en)
French (fr)
Other versions
WO2001061732A2 (de
Inventor
Edwin Fauser
Herman Roozenbeek
Wolfgang Schilling
Hans Seitel
Thomas Wizemann
Reinhard Pfendtner
Werner Butschkau
Wolfgang Hiller
Stefan Josten
Original Assignee
Bosch Gmbh Robert
Edwin Fauser
Herman Roozenbeek
Wolfgang Schilling
Hans Seitel
Thomas Wizemann
Reinhard Pfendtner
Werner Butschkau
Wolfgang Hiller
Stefan Josten
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10065019A external-priority patent/DE10065019A1/de
Application filed by Bosch Gmbh Robert, Edwin Fauser, Herman Roozenbeek, Wolfgang Schilling, Hans Seitel, Thomas Wizemann, Reinhard Pfendtner, Werner Butschkau, Wolfgang Hiller, Stefan Josten filed Critical Bosch Gmbh Robert
Priority to KR1020017013194A priority Critical patent/KR20010112432A/ko
Priority to JP2001560429A priority patent/JP2003533013A/ja
Priority to EP01921149A priority patent/EP1336202A2/de
Publication of WO2001061732A2 publication Critical patent/WO2001061732A2/de
Publication of WO2001061732A3 publication Critical patent/WO2001061732A3/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0066—Constructional details of transient suppressor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
    • H01T4/00—Overvoltage arresters using spark gaps
    • H01T4/08—Overvoltage arresters using spark gaps structurally associated with protected apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/026—Spark gaps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

Es wird vorgeschlagen, dass die Schutzeinrichtung eine mit dem gefährdeten Kontaktelement leitend verbundene erste elektrisch leitende Struktur une eine dazu auf dem Trägersubstrat benachbart angeordneten, mit dem Masseanschluss leitend verbundene zweite elektrisch leitende Struktur umfasst, wobei einander zugewandte Abschnitte der elektrisch leitenden Strukturen durch einen definierten Spalt räumlich derart voneinander beabstandet sind, dass eine auf das Kontaktelement übertragene überspannung durch eine Funkenentladung in dem Spalt von dem Abschnitt der ersten elektrisch leitenden Struktur auf den Abschnitt der zweiten elektrisch leitenden Struktur übertragen und zum Masseanschluss abgeleitet wird.
PCT/DE2001/000512 2000-02-18 2001-02-10 Einrichtung zum schutz eines auf einem trägersubstrat angeordneten elektrischen und/oder elektronischen bauteils vor elektrostatischen entladungen WO2001061732A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020017013194A KR20010112432A (ko) 2000-02-18 2001-02-10 캐리어 기판 상에 배치된 전기 및/또는 전자 부품을정전기 방전으로부터 보호하기 위한 장치
JP2001560429A JP2003533013A (ja) 2000-02-18 2001-02-10 支持基板上に配置された電気的および／または電子的構成部材を静電放電から保護するための装置
EP01921149A EP1336202A2 (de) 2000-02-18 2001-02-10 Einrichtung zum schutz eines auf einem trägersubstrat angeordneten elektrischen und/oder elektronischen bauteils vor elektrostatischen entladungen

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE10006787.5 2000-02-18
DE10006787 2000-02-18
DE10065019.8 2000-12-23
DE10065019A DE10065019A1 (de) 2000-02-18 2000-12-23 Einrichtung zum Schutz eines auf einem Trägersubstrat angeordneten elektrischen und/oder elektronischen Bauteils vor elektrostatischen Entladungen

Publications (2)

Publication Number Publication Date
WO2001061732A2 WO2001061732A2 (de) 2001-08-23
WO2001061732A3 true WO2001061732A3 (de) 2003-06-12

Family

ID=26004345

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2001/000512 WO2001061732A2 (de) 2000-02-18 2001-02-10 Einrichtung zum schutz eines auf einem trägersubstrat angeordneten elektrischen und/oder elektronischen bauteils vor elektrostatischen entladungen

Country Status (4)

Country Link
US (1) US20020151200A1 (de)
EP (1) EP1336202A2 (de)
JP (1) JP2003533013A (de)
WO (1) WO2001061732A2 (de)

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US6879004B2 (en) * 2002-11-05 2005-04-12 Silicon Labs Cp, Inc. High voltage difference amplifier with spark gap ESD protection
DE10303446B4 (de) * 2003-01-29 2008-12-18 Siemens Ag Vorrichtung zum Schutz von auf Flachbaugruppen verwendeten elektronischen Bauteilen vor einer Zerstörung durch elektrostatische Entladungsvorgänge
US7161784B2 (en) * 2004-06-30 2007-01-09 Research In Motion Limited Spark gap apparatus and method for electrostatic discharge protection
US7508644B2 (en) * 2004-06-30 2009-03-24 Research In Motion Limited Spark gap apparatus and method for electrostatic discharge protection
US20070173909A1 (en) * 2006-01-24 2007-07-26 Cyberonics, Inc. Spark gap in an implantable medical device
TWI318814B (en) 2006-08-14 2009-12-21 Giga Byte Tech Co Ltd Connection apparatus and high voltage impulse protection methods thereof
JP2009009728A (ja) * 2007-06-26 2009-01-15 Taiko Denki Co Ltd レセプタクル
TW200901592A (en) * 2007-06-27 2009-01-01 Inpaq Technology Co Ltd Over voltage protection device with air-gap
KR101478870B1 (ko) * 2008-09-25 2015-01-02 파나소닉 오토모티브 시스템즈 컴퍼니 오브 어메리카, 디비젼 오브 파나소닉 코포레이션 오브 노쓰 어메리카 정전 방전（ｅｓｄ） 보호 회로 및 방법
CN101969194B (zh) * 2010-10-12 2012-12-12 福建星网锐捷网络有限公司 接口防静电方法、防静电保护电路及电气设备
JP2012134253A (ja) * 2010-12-20 2012-07-12 Toyoda Gosei Co Ltd 照明用ｌｅｄモジュール
JP5725840B2 (ja) * 2010-12-20 2015-05-27 キヤノン株式会社 設計支援装置およびその情報処理方法
JP6018187B2 (ja) * 2011-06-08 2016-11-02 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． ダイオード照明構成
US20130194708A1 (en) * 2012-01-30 2013-08-01 Sony Ericsson Mobile Communications Ab Current Carrying Structures Having Enhanced Electrostatic Discharge Protection And Methods Of Manufacture
US9053279B2 (en) * 2013-03-14 2015-06-09 Taiwan Semiconductor Manufacturing Company, Ltd. Pattern modification with a preferred position function
KR102069626B1 (ko) * 2013-09-03 2020-01-23 삼성전기주식회사 인쇄회로기판
WO2015160723A1 (en) * 2014-04-14 2015-10-22 Skyworks Solutions, Inc. Mems devices having discharge circuits
FR3032664B1 (fr) 2015-02-13 2017-03-03 Valeo Vision Dispositif lumineux pour un vehicule automobile integrant des moyens de protection contre des decharges electrostatiques
JP2017076702A (ja) * 2015-10-15 2017-04-20 三菱電機株式会社 プリント配線基板
US10651113B2 (en) 2016-05-31 2020-05-12 Mitsubishi Electric Corporation Semiconductor apparatus, ignition device for internal combustion engine, and internal combustion engine system
FR3052538B1 (fr) * 2016-06-09 2018-07-20 Valeo Vision Dispositif lumineux pour un vehicule automobile integrant des moyens de protection contre des decharges electrostatiques
US10677822B2 (en) 2016-09-27 2020-06-09 Analog Devices Global Unlimited Company Electrical overstress detection device
JP2018129418A (ja) * 2017-02-09 2018-08-16 オムロンオートモーティブエレクトロニクス株式会社 回路基板、電子装置
FR3070014B1 (fr) * 2017-08-08 2020-11-20 Dominique Dervieux Dispositif de soulagement de douleurs et contractures comprenant un dispositif de protection contre l'electricite statique et un dispositif de declenchement de l'allumage
US11112436B2 (en) 2018-03-26 2021-09-07 Analog Devices International Unlimited Company Spark gap structures for detection and protection against electrical overstress events
US11329013B2 (en) * 2020-05-28 2022-05-10 Nxp Usa, Inc. Interconnected substrate arrays containing electrostatic discharge protection grids and associated microelectronic packages

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AU532286B2 (en) * 1979-10-16 1983-09-22 Laube, R. Printed lightning protector for electric fence
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Also Published As

Publication number Publication date
JP2003533013A (ja) 2003-11-05
EP1336202A2 (de) 2003-08-20
WO2001061732A2 (de) 2001-08-23
US20020151200A1 (en) 2002-10-17

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