DE69900783T2 - Hochschmelzende polyamidzusammensetzungen für den elektronikbereich - Google Patents
Hochschmelzende polyamidzusammensetzungen für den elektronikbereichInfo
- Publication number
- DE69900783T2 DE69900783T2 DE69900783T DE69900783T DE69900783T2 DE 69900783 T2 DE69900783 T2 DE 69900783T2 DE 69900783 T DE69900783 T DE 69900783T DE 69900783 T DE69900783 T DE 69900783T DE 69900783 T2 DE69900783 T2 DE 69900783T2
- Authority
- DE
- Germany
- Prior art keywords
- polyamide compositions
- electronics area
- melting polyamide
- melting
- electronics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004952 Polyamide Substances 0.000 title 1
- 238000002844 melting Methods 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 229920002647 polyamide Polymers 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/02—Halogenated hydrocarbons
- C08K5/03—Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL1008443A NL1008443C2 (nl) | 1998-03-02 | 1998-03-02 | Hoogsmeltende polyamidesamenstelling voor electronicatoepassingen. |
PCT/NL1999/000109 WO1999045070A1 (en) | 1998-03-02 | 1999-03-02 | High-melting polyamide composition for electronic applications |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69900783D1 DE69900783D1 (de) | 2002-02-28 |
DE69900783T2 true DE69900783T2 (de) | 2002-09-12 |
Family
ID=19766628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69900783T Expired - Lifetime DE69900783T2 (de) | 1998-03-02 | 1999-03-02 | Hochschmelzende polyamidzusammensetzungen für den elektronikbereich |
Country Status (10)
Country | Link |
---|---|
US (1) | US6441072B1 (de) |
EP (1) | EP1060215B1 (de) |
JP (1) | JP4335443B2 (de) |
KR (1) | KR100572799B1 (de) |
CN (1) | CN1134508C (de) |
AU (1) | AU2860399A (de) |
DE (1) | DE69900783T2 (de) |
NL (1) | NL1008443C2 (de) |
TW (1) | TW574316B (de) |
WO (1) | WO1999045070A1 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IL136965A0 (en) * | 2000-06-22 | 2001-06-14 | Bromine Compounds Ltd | Flame-retarded polyamides |
US6956099B2 (en) * | 2003-03-20 | 2005-10-18 | Arizona Chemical Company | Polyamide-polyether block copolymer |
EP1479728A1 (de) * | 2003-05-22 | 2004-11-24 | DSM IP Assets B.V. | Flammhemmende Polyamid-Zusammensetzung |
DE102004054389A1 (de) * | 2004-11-11 | 2006-05-18 | Rehau Ag + Co. | Polymere Werkstoffzusammensetzung |
EP1683830A1 (de) | 2005-01-12 | 2006-07-26 | DSM IP Assets B.V. | Thermostabilisierte Formmassen |
EP1681313A1 (de) * | 2005-01-17 | 2006-07-19 | DSM IP Assets B.V. | Hitzestabilisierte Formmasse |
CN101553535B (zh) | 2006-12-20 | 2012-05-23 | 东洋纺织株式会社 | 结晶聚酰胺类树脂组合物 |
JP5634155B2 (ja) * | 2009-07-29 | 2014-12-03 | 旭化成ケミカルズ株式会社 | ポリアミド組成物 |
CN105555869B (zh) * | 2013-09-27 | 2018-01-16 | 旭化成株式会社 | 聚酰胺树脂组合物和成型品 |
ES2767296T3 (es) * | 2013-11-28 | 2020-06-17 | Lanxess Deutschland Gmbh | Composiciones de poliamida |
KR101685771B1 (ko) | 2013-12-10 | 2016-12-13 | 주식회사 엘지화학 | 할로겐계 난연 유리섬유 강화 폴리아미드 수지 조성물, 및 제조방법 |
US10450491B2 (en) | 2016-08-08 | 2019-10-22 | Ticona Llc | Thermally conductive polymer composition for a heat sink |
KR20190091472A (ko) * | 2016-12-22 | 2019-08-06 | 디에스엠 아이피 어셋츠 비.브이. | 개선된 열- 및 전기-저항성 열가소성 수지 조성물 |
EP3728474B1 (de) * | 2017-12-20 | 2024-05-15 | Basf Se | Polyamidformmasse mit hoher hitzebeständigkeit |
CN111875957A (zh) * | 2020-06-29 | 2020-11-03 | 金发科技股份有限公司 | 一种聚酰胺组合物及其制备方法和应用 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59191759A (ja) * | 1983-04-13 | 1984-10-30 | Mitsubishi Gas Chem Co Inc | 難燃性ポリアミド組成物 |
US5256718A (en) * | 1990-02-14 | 1993-10-26 | Mitsui Petrochemical Industries, Ltd. | Flame retardant polyamide thermoplastic resin composition |
NL9101624A (nl) * | 1990-10-15 | 1992-05-06 | Dsm Nv | Polyamide/aromatische polyester samenstelling. |
JPH04202459A (ja) * | 1990-11-30 | 1992-07-23 | Polyplastics Co | 難燃性ポリエステル樹脂組成物 |
US5852165A (en) * | 1994-05-31 | 1998-12-22 | Ube Industries, Ltd. | Terpolymer polyamide, polyamide resin composition containing the same, and automotive parts obtaining from these |
JPH083327A (ja) * | 1994-06-21 | 1996-01-09 | Japan Synthetic Rubber Co Ltd | コネクター |
BE1009118A3 (nl) * | 1995-02-16 | 1996-11-05 | Dsm Nv | Polyamide 4.6 samenstelling. |
US5773500A (en) * | 1996-05-14 | 1998-06-30 | Amoco Corporation | Flame retardant high temperature polyphthalamides having improved thermal stability |
US5863974A (en) * | 1997-01-28 | 1999-01-26 | General Electric Company | Flame retardant polyamide composition |
-
1998
- 1998-03-02 NL NL1008443A patent/NL1008443C2/nl not_active IP Right Cessation
-
1999
- 1999-03-02 TW TW088103345A patent/TW574316B/zh not_active IP Right Cessation
- 1999-03-02 AU AU28603/99A patent/AU2860399A/en not_active Abandoned
- 1999-03-02 JP JP2000534608A patent/JP4335443B2/ja not_active Expired - Fee Related
- 1999-03-02 KR KR1020007009628A patent/KR100572799B1/ko not_active IP Right Cessation
- 1999-03-02 EP EP99909397A patent/EP1060215B1/de not_active Expired - Lifetime
- 1999-03-02 CN CNB998054828A patent/CN1134508C/zh not_active Expired - Fee Related
- 1999-03-02 DE DE69900783T patent/DE69900783T2/de not_active Expired - Lifetime
- 1999-03-02 WO PCT/NL1999/000109 patent/WO1999045070A1/en active IP Right Grant
-
2000
- 2000-09-01 US US09/654,472 patent/US6441072B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1060215B1 (de) | 2002-01-09 |
TW574316B (en) | 2004-02-01 |
JP2002505365A (ja) | 2002-02-19 |
JP4335443B2 (ja) | 2009-09-30 |
KR20010041472A (ko) | 2001-05-25 |
AU2860399A (en) | 1999-09-20 |
CN1298428A (zh) | 2001-06-06 |
US6441072B1 (en) | 2002-08-27 |
CN1134508C (zh) | 2004-01-14 |
DE69900783D1 (de) | 2002-02-28 |
KR100572799B1 (ko) | 2006-04-19 |
NL1008443C2 (nl) | 1999-09-03 |
WO1999045070A1 (en) | 1999-09-10 |
EP1060215A1 (de) | 2000-12-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: DSM IP ASSETS B.V., HEERLEN, NL |