DE69900783D1 - Hochschmelzende polyamidzusammensetzungen für den elektronikbereich - Google Patents

Hochschmelzende polyamidzusammensetzungen für den elektronikbereich

Info

Publication number
DE69900783D1
DE69900783D1 DE69900783T DE69900783T DE69900783D1 DE 69900783 D1 DE69900783 D1 DE 69900783D1 DE 69900783 T DE69900783 T DE 69900783T DE 69900783 T DE69900783 T DE 69900783T DE 69900783 D1 DE69900783 D1 DE 69900783D1
Authority
DE
Germany
Prior art keywords
polyamide compositions
electronics area
melting polyamide
melting
electronics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69900783T
Other languages
English (en)
Other versions
DE69900783T2 (de
Inventor
Gerardus Havenith
Josephus Sour
Johannes Tijssen
Maarten Leeuwendal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DSM IP Assets BV
Original Assignee
DSM NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DSM NV filed Critical DSM NV
Publication of DE69900783D1 publication Critical patent/DE69900783D1/de
Application granted granted Critical
Publication of DE69900783T2 publication Critical patent/DE69900783T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/02—Halogenated hydrocarbons
    • C08K5/03—Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE69900783T 1998-03-02 1999-03-02 Hochschmelzende polyamidzusammensetzungen für den elektronikbereich Expired - Lifetime DE69900783T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1008443A NL1008443C2 (nl) 1998-03-02 1998-03-02 Hoogsmeltende polyamidesamenstelling voor electronicatoepassingen.
PCT/NL1999/000109 WO1999045070A1 (en) 1998-03-02 1999-03-02 High-melting polyamide composition for electronic applications

Publications (2)

Publication Number Publication Date
DE69900783D1 true DE69900783D1 (de) 2002-02-28
DE69900783T2 DE69900783T2 (de) 2002-09-12

Family

ID=19766628

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69900783T Expired - Lifetime DE69900783T2 (de) 1998-03-02 1999-03-02 Hochschmelzende polyamidzusammensetzungen für den elektronikbereich

Country Status (10)

Country Link
US (1) US6441072B1 (de)
EP (1) EP1060215B1 (de)
JP (1) JP4335443B2 (de)
KR (1) KR100572799B1 (de)
CN (1) CN1134508C (de)
AU (1) AU2860399A (de)
DE (1) DE69900783T2 (de)
NL (1) NL1008443C2 (de)
TW (1) TW574316B (de)
WO (1) WO1999045070A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL136965A0 (en) * 2000-06-22 2001-06-14 Bromine Compounds Ltd Flame-retarded polyamides
US6956099B2 (en) * 2003-03-20 2005-10-18 Arizona Chemical Company Polyamide-polyether block copolymer
EP1479728A1 (de) * 2003-05-22 2004-11-24 DSM IP Assets B.V. Flammhemmende Polyamid-Zusammensetzung
DE102004054389A1 (de) * 2004-11-11 2006-05-18 Rehau Ag + Co. Polymere Werkstoffzusammensetzung
EP1683830A1 (de) * 2005-01-12 2006-07-26 DSM IP Assets B.V. Thermostabilisierte Formmassen
EP1681313A1 (de) 2005-01-17 2006-07-19 DSM IP Assets B.V. Hitzestabilisierte Formmasse
EP2123716B1 (de) 2006-12-20 2016-08-24 Toyobo Co., Ltd. Auf kristallinem polyamid basierende harzzusammensetzung
JP5634155B2 (ja) * 2009-07-29 2014-12-03 旭化成ケミカルズ株式会社 ポリアミド組成物
US9902843B2 (en) 2013-09-27 2018-02-27 Asahi Kasei Chemicals Corporation Polyamide resin composition and molded product
PL2878630T3 (pl) * 2013-11-28 2020-06-01 Lanxess Deutschland Gmbh Kompozycje poliamidowe
KR101685771B1 (ko) 2013-12-10 2016-12-13 주식회사 엘지화학 할로겐계 난연 유리섬유 강화 폴리아미드 수지 조성물, 및 제조방법
US10450491B2 (en) 2016-08-08 2019-10-22 Ticona Llc Thermally conductive polymer composition for a heat sink
EP3559104A1 (de) * 2016-12-22 2019-10-30 DSM IP Assets B.V. Verbesserte wärme- und elektrisch resistive thermoplastische harzzusammensetzungen
CA3086274A1 (en) * 2017-12-20 2019-06-27 Performance Polyamides, Sas High heat resistance polyamide molding compound
CN111875957A (zh) * 2020-06-29 2020-11-03 金发科技股份有限公司 一种聚酰胺组合物及其制备方法和应用

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59191759A (ja) * 1983-04-13 1984-10-30 Mitsubishi Gas Chem Co Inc 難燃性ポリアミド組成物
US5256718A (en) * 1990-02-14 1993-10-26 Mitsui Petrochemical Industries, Ltd. Flame retardant polyamide thermoplastic resin composition
NL9101624A (nl) * 1990-10-15 1992-05-06 Dsm Nv Polyamide/aromatische polyester samenstelling.
JPH04202459A (ja) * 1990-11-30 1992-07-23 Polyplastics Co 難燃性ポリエステル樹脂組成物
US5852165A (en) * 1994-05-31 1998-12-22 Ube Industries, Ltd. Terpolymer polyamide, polyamide resin composition containing the same, and automotive parts obtaining from these
JPH083327A (ja) * 1994-06-21 1996-01-09 Japan Synthetic Rubber Co Ltd コネクター
BE1009118A3 (nl) * 1995-02-16 1996-11-05 Dsm Nv Polyamide 4.6 samenstelling.
US5773500A (en) * 1996-05-14 1998-06-30 Amoco Corporation Flame retardant high temperature polyphthalamides having improved thermal stability
US5863974A (en) * 1997-01-28 1999-01-26 General Electric Company Flame retardant polyamide composition

Also Published As

Publication number Publication date
KR20010041472A (ko) 2001-05-25
WO1999045070A1 (en) 1999-09-10
US6441072B1 (en) 2002-08-27
DE69900783T2 (de) 2002-09-12
EP1060215A1 (de) 2000-12-20
KR100572799B1 (ko) 2006-04-19
CN1134508C (zh) 2004-01-14
EP1060215B1 (de) 2002-01-09
JP4335443B2 (ja) 2009-09-30
AU2860399A (en) 1999-09-20
TW574316B (en) 2004-02-01
JP2002505365A (ja) 2002-02-19
NL1008443C2 (nl) 1999-09-03
CN1298428A (zh) 2001-06-06

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: DSM IP ASSETS B.V., HEERLEN, NL