DE69831390D1 - Vorrichtung und Verfahren zur Verbindung zwischen zwei elektronischen Anordnungen - Google Patents
Vorrichtung und Verfahren zur Verbindung zwischen zwei elektronischen AnordnungenInfo
- Publication number
- DE69831390D1 DE69831390D1 DE69831390T DE69831390T DE69831390D1 DE 69831390 D1 DE69831390 D1 DE 69831390D1 DE 69831390 T DE69831390 T DE 69831390T DE 69831390 T DE69831390 T DE 69831390T DE 69831390 D1 DE69831390 D1 DE 69831390D1
- Authority
- DE
- Germany
- Prior art keywords
- connection
- electronic devices
- electronic
- devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09154—Bevelled, chamferred or tapered edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9716300A FR2772998B1 (fr) | 1997-12-23 | 1997-12-23 | Dispositif et procede d'interconnexion entre deux dispositifs electroniques |
FR9716300 | 1997-12-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69831390D1 true DE69831390D1 (de) | 2005-10-06 |
DE69831390T2 DE69831390T2 (de) | 2006-06-08 |
Family
ID=9514955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69831390T Expired - Lifetime DE69831390T2 (de) | 1997-12-23 | 1998-12-18 | Vorrichtung und Verfahren zur Verbindung zwischen zwei elektronischen Anordnungen |
Country Status (4)
Country | Link |
---|---|
US (1) | US6031728A (de) |
EP (1) | EP0926935B1 (de) |
DE (1) | DE69831390T2 (de) |
FR (1) | FR2772998B1 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2905869A1 (de) * | 1979-02-16 | 1980-08-28 | Rau Swf Autozubehoer | Elektrisches antriebsaggregat |
US6675472B1 (en) * | 1999-04-29 | 2004-01-13 | Unicap Electronics Industrial Corporation | Process and structure for manufacturing plastic chip carrier |
JP3664001B2 (ja) * | 1999-10-25 | 2005-06-22 | 株式会社村田製作所 | モジュール基板の製造方法 |
US6670558B2 (en) * | 1999-12-29 | 2003-12-30 | Intel Corporation | Inline and “Y” input-output bus topology |
US6414850B1 (en) | 2000-01-11 | 2002-07-02 | Cisco Technology, Inc. | Method and apparatus for decoupling ball grid array devices |
US6657136B1 (en) * | 2000-06-30 | 2003-12-02 | Cisco Technology, Inc. | Termination board for mounting on circuit board |
EP1369002A2 (de) * | 2001-01-17 | 2003-12-10 | Honeywell International Inc. | Adapter für kunststoff-chipträger mit anschlussdrähten und andere oberflächenmontierungstechnik-chipträger |
US6566610B1 (en) * | 2001-11-01 | 2003-05-20 | Virtium Technology, Inc. | Stacking multiple devices using direct soldering |
JP2004253759A (ja) * | 2002-12-24 | 2004-09-09 | Auto Network Gijutsu Kenkyusho:Kk | 制御回路基板及び回路構成体 |
US7338299B1 (en) * | 2003-08-06 | 2008-03-04 | Foxconn Advanced Technology Inc. | Surface mounted electronic component |
US7258549B2 (en) * | 2004-02-20 | 2007-08-21 | Matsushita Electric Industrial Co., Ltd. | Connection member and mount assembly and production method of the same |
CN102510681B (zh) * | 2011-11-10 | 2015-05-20 | 深南电路有限公司 | 金手指制作方法和具有金手指的电路板 |
JP2015188004A (ja) * | 2014-03-26 | 2015-10-29 | キヤノン株式会社 | パッケージ、半導体装置及び半導体モジュール |
CN110958788A (zh) * | 2018-09-27 | 2020-04-03 | 宏启胜精密电子(秦皇岛)有限公司 | 电路板及其制作方法 |
CN113015324B (zh) * | 2019-12-19 | 2023-05-09 | 华为技术有限公司 | 电路板组件、电子设备、加工电路板组件的方法 |
FR3114937B1 (fr) * | 2020-10-01 | 2023-04-21 | Alstom Transp Tech | Carte électronique comprenant un circuit intercalaire |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2338647A1 (de) * | 1973-07-30 | 1975-02-20 | Siemens Ag | Leiterplatte mit zwei leiteraussenlagen |
DE3705828A1 (de) * | 1986-04-25 | 1987-10-29 | Eckhard Dr Ing Wolf | Vorrichtung zum anschliessen eines anschlussinkompatiblen integrierten schaltkreises an eine leiterplatte |
JPH0752783B2 (ja) * | 1987-05-25 | 1995-06-05 | イビデン株式会社 | 電子部品搭載用基板 |
JP2675135B2 (ja) * | 1989-04-22 | 1997-11-12 | ティーディーケイ株式会社 | 混成集積回路部品の構造 |
US5138115A (en) * | 1990-10-12 | 1992-08-11 | Atmel Corporation | Carrierles surface mounted integrated circuit die |
JPH05206314A (ja) * | 1991-11-12 | 1993-08-13 | Nec Corp | 半導体装置 |
US5313366A (en) * | 1992-08-12 | 1994-05-17 | International Business Machines Corporation | Direct chip attach module (DCAM) |
JPH0685465A (ja) * | 1992-09-01 | 1994-03-25 | Tdk Corp | Smdモジュール用基板及びその製造方法 |
JPH06224537A (ja) * | 1993-01-25 | 1994-08-12 | Kaijo Corp | 表面実装用リードピッチ変換基板 |
US5703405A (en) * | 1993-03-15 | 1997-12-30 | Motorola, Inc. | Integrated circuit chip formed from processing two opposing surfaces of a wafer |
EP0641046B1 (de) * | 1993-08-31 | 1998-04-08 | Advanced Micro Devices, Inc. | Gerät zur Veränderung eines elektrischen Signals |
US5369551A (en) * | 1993-11-08 | 1994-11-29 | Sawtek, Inc. | Surface mount stress relief interface system and method |
GB2283863A (en) * | 1993-11-16 | 1995-05-17 | Ibm | Direct chip attach module |
FR2722334B1 (fr) * | 1994-07-06 | 1997-01-17 | Barbin Jean Philippe | Support actif pour circuit integre, notamment pour un processeur |
US5477933A (en) * | 1994-10-24 | 1995-12-26 | At&T Corp. | Electronic device interconnection techniques |
JP3441544B2 (ja) * | 1994-12-13 | 2003-09-02 | 三共化成株式会社 | 回路基板と母回路基板の接続方法 |
-
1997
- 1997-12-23 FR FR9716300A patent/FR2772998B1/fr not_active Expired - Fee Related
-
1998
- 1998-12-04 US US09/204,502 patent/US6031728A/en not_active Expired - Lifetime
- 1998-12-18 DE DE69831390T patent/DE69831390T2/de not_active Expired - Lifetime
- 1998-12-18 EP EP98403209A patent/EP0926935B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2772998A1 (fr) | 1999-06-25 |
EP0926935B1 (de) | 2005-08-31 |
US6031728A (en) | 2000-02-29 |
FR2772998B1 (fr) | 2000-02-11 |
EP0926935A1 (de) | 1999-06-30 |
DE69831390T2 (de) | 2006-06-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
R082 | Change of representative |
Ref document number: 926935 Country of ref document: EP Representative=s name: MEISSNER & MEISSNER, 14199 BERLIN, DE |