DE69831202D1 - Realisierung eines intermetallischen Kondensators - Google Patents

Realisierung eines intermetallischen Kondensators

Info

Publication number
DE69831202D1
DE69831202D1 DE69831202T DE69831202T DE69831202D1 DE 69831202 D1 DE69831202 D1 DE 69831202D1 DE 69831202 T DE69831202 T DE 69831202T DE 69831202 T DE69831202 T DE 69831202T DE 69831202 D1 DE69831202 D1 DE 69831202D1
Authority
DE
Germany
Prior art keywords
realization
intermetallic
capacitor
intermetallic capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69831202T
Other languages
English (en)
Other versions
DE69831202T2 (de
Inventor
Bruno Bonhoure
Veronique Tournier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Application granted granted Critical
Publication of DE69831202D1 publication Critical patent/DE69831202D1/de
Publication of DE69831202T2 publication Critical patent/DE69831202T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5223—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
DE69831202T 1997-09-22 1998-09-18 Realisierung eines intermetallischen Kondensators Expired - Lifetime DE69831202T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9711966 1997-09-22
FR9711966A FR2768852B1 (fr) 1997-09-22 1997-09-22 Realisation d'un condensateur intermetallique

Publications (2)

Publication Number Publication Date
DE69831202D1 true DE69831202D1 (de) 2005-09-22
DE69831202T2 DE69831202T2 (de) 2006-06-22

Family

ID=9511492

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69831202T Expired - Lifetime DE69831202T2 (de) 1997-09-22 1998-09-18 Realisierung eines intermetallischen Kondensators

Country Status (5)

Country Link
US (1) US6111742A (de)
EP (1) EP0903783B1 (de)
JP (1) JP3518798B2 (de)
DE (1) DE69831202T2 (de)
FR (1) FR2768852B1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030049920A (ko) * 2001-12-17 2003-06-25 엘지전자 주식회사 전원 노이즈제거 회로
TW200403872A (en) * 2002-08-30 2004-03-01 Matsushita Electric Ind Co Ltd MIM capacitor
US7741696B2 (en) * 2004-05-13 2010-06-22 St-Ericsson Sa Semiconductor integrated circuit including metal mesh structure
US7330081B1 (en) * 2005-01-24 2008-02-12 Marvell Semiconductor Israel Ltd. Digitally controlled oscillator and associated method
FR2886458B1 (fr) 2005-05-25 2007-09-07 St Microelectronics Sa Reseau capacitif
US11329732B1 (en) 2019-10-23 2022-05-10 Vayyar Imaging Ltd. Systems and methods for improving radio frequency integrated circuits
KR20220011828A (ko) 2020-07-21 2022-02-03 삼성전자주식회사 반도체 소자 및 그의 제조 방법

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5771165A (en) * 1980-10-22 1982-05-01 Toshiba Corp Semiconductor device
JPH01120858A (ja) * 1987-11-04 1989-05-12 Mitsubishi Electric Corp 集積回路装置
JPH01297839A (ja) * 1988-05-26 1989-11-30 Toshiba Corp 半導体装置
US5439840A (en) * 1993-08-02 1995-08-08 Motorola, Inc. Method of forming a nonvolatile random access memory capacitor cell having a metal-oxide dielectric
JPH0758294A (ja) * 1993-08-19 1995-03-03 Kawasaki Steel Corp 半導体集積回路チップ
US5494841A (en) * 1993-10-15 1996-02-27 Micron Semiconductor, Inc. Split-polysilicon CMOS process for multi-megabit dynamic memories incorporating stacked container capacitor cells
JPH07130953A (ja) * 1993-11-05 1995-05-19 Nippon Telegr & Teleph Corp <Ntt> 半導体集積回路
FR2720570B1 (fr) * 1994-05-24 1996-08-02 Thomson Consumer Electronics Convertisseur A/N de deux signaux analogiques utilisant un seul module convertisseur.
FR2722625B1 (fr) * 1994-07-18 1996-10-04 Thomson Consumer Electronics Convertisseur a/n a comparaison multiple utilisant le principe d'interpolation
US5622882A (en) * 1994-12-30 1997-04-22 Lsi Logic Corporation Method of making a CMOS dynamic random-access memory (DRAM)
JP3369827B2 (ja) * 1995-01-30 2003-01-20 株式会社東芝 半導体装置及びその製造方法
FR2731854B1 (fr) * 1995-03-14 1997-04-25 Thomson Consumer Electronics Dispositif de filtrage digital
FR2733098B1 (fr) * 1995-04-11 1997-07-04 Sgs Thomson Microelectronics Amplificateur de courant
FR2733650B1 (fr) * 1995-04-28 1997-07-18 Sgs Thomson Microelectronics Convertisseur numerique/analogique de precision
JPH08316766A (ja) * 1995-05-16 1996-11-29 Murata Mfg Co Ltd Ｌｃフィルタ
JP3535615B2 (ja) * 1995-07-18 2004-06-07 株式会社ルネサステクノロジ 半導体集積回路装置
US5623160A (en) * 1995-09-14 1997-04-22 Liberkowski; Janusz B. Signal-routing or interconnect substrate, structure and apparatus
US5926359A (en) * 1996-04-01 1999-07-20 International Business Machines Corporation Metal-insulator-metal capacitor
US5712813A (en) * 1996-10-17 1998-01-27 Zhang; Guobiao Multi-level storage capacitor structure with improved memory density

Also Published As

Publication number Publication date
FR2768852B1 (fr) 1999-11-26
FR2768852A1 (fr) 1999-03-26
DE69831202T2 (de) 2006-06-22
US6111742A (en) 2000-08-29
JPH11154731A (ja) 1999-06-08
EP0903783B1 (de) 2005-08-17
JP3518798B2 (ja) 2004-04-12
EP0903783A1 (de) 1999-03-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition