DE69830776D1 - Gas zum Wegnehmen von Ablagerungen und ihre Verwendung - Google Patents

Gas zum Wegnehmen von Ablagerungen und ihre Verwendung

Info

Publication number
DE69830776D1
DE69830776D1 DE69830776T DE69830776T DE69830776D1 DE 69830776 D1 DE69830776 D1 DE 69830776D1 DE 69830776 T DE69830776 T DE 69830776T DE 69830776 T DE69830776 T DE 69830776T DE 69830776 D1 DE69830776 D1 DE 69830776D1
Authority
DE
Germany
Prior art keywords
gas
removing deposits
deposits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69830776T
Other languages
English (en)
Other versions
DE69830776T2 (de
Inventor
Isamu Mori
Tetsuya Tamura
Mitsuya Ohashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Central Glass Co Ltd
Original Assignee
Central Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP23933998A external-priority patent/JP3611729B2/ja
Priority claimed from JP10239338A external-priority patent/JP3014368B2/ja
Application filed by Central Glass Co Ltd filed Critical Central Glass Co Ltd
Application granted granted Critical
Publication of DE69830776D1 publication Critical patent/DE69830776D1/de
Publication of DE69830776T2 publication Critical patent/DE69830776T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
    • H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00—Methods for coating glass
    • C03C2218/30—Aspects of methods for coating glass not covered above
    • C03C2218/32—After-treatment
    • C03C2218/328—Partly or completely removing a coating
    • C03C2218/33—Partly or completely removing a coating by etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/905—Cleaning of reaction chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/906—Cleaning of wafer as interim step
DE69830776T 1997-12-18 1998-12-14 Gas zum Wegnehmen von Ablagerungen und ihre Verwendung Expired - Fee Related DE69830776T2 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP34953697 1997-12-18
JP34953697 1997-12-18
JP23933998 1998-08-26
JP23933998A JP3611729B2 (ja) 1998-08-26 1998-08-26 エッチングガス
JP23933898 1998-08-26
JP10239338A JP3014368B2 (ja) 1997-12-18 1998-08-26 クリーニングガス

Publications (2)

Publication Number Publication Date
DE69830776D1 true DE69830776D1 (de) 2005-08-11
DE69830776T2 DE69830776T2 (de) 2005-12-01

Family

ID=27332679

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69830776T Expired - Fee Related DE69830776T2 (de) 1997-12-18 1998-12-14 Gas zum Wegnehmen von Ablagerungen und ihre Verwendung

Country Status (7)

Country Link
US (3) US6673262B1 (de)
EP (1) EP0924282B1 (de)
KR (1) KR100299488B1 (de)
CN (1) CN1119385C (de)
DE (1) DE69830776T2 (de)
SG (1) SG72905A1 (de)
TW (1) TW466266B (de)

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US6537461B1 (en) * 2000-04-24 2003-03-25 Hitachi, Ltd. Process for treating solid surface and substrate surface
TW490714B (en) 1999-12-27 2002-06-11 Semiconductor Energy Lab Film formation apparatus and method for forming a film
US20020011205A1 (en) 2000-05-02 2002-01-31 Shunpei Yamazaki Film-forming apparatus, method of cleaning the same, and method of manufacturing a light-emitting device
JP4112198B2 (ja) * 2000-09-11 2008-07-02 財団法人地球環境産業技術研究機構 クリーニングガス及びエッチングガス、並びにチャンバークリーニング方法及びエッチング方法
JP2002129334A (ja) * 2000-10-26 2002-05-09 Applied Materials Inc 気相堆積装置のクリーニング方法及び気相堆積装置
US20050014383A1 (en) * 2003-07-15 2005-01-20 Bing Ji Use of hypofluorites, fluoroperoxides, and/or fluorotrioxides as oxidizing agent in fluorocarbon etch plasmas
JP2005142198A (ja) * 2003-11-04 2005-06-02 Taiyo Nippon Sanso Corp クリーニングガス及びクリーニング方法
US7581549B2 (en) * 2004-07-23 2009-09-01 Air Products And Chemicals, Inc. Method for removing carbon-containing residues from a substrate
US7819981B2 (en) 2004-10-26 2010-10-26 Advanced Technology Materials, Inc. Methods for cleaning ion implanter components
US7344975B2 (en) * 2005-08-26 2008-03-18 Micron Technology, Inc. Method to reduce charge buildup during high aspect ratio contact etch
JP2010503977A (ja) * 2006-04-26 2010-02-04 アドバンスト テクノロジー マテリアルズ，インコーポレイテッド 半導体処理システムの洗浄方法
US7682979B2 (en) * 2006-06-29 2010-03-23 Lam Research Corporation Phase change alloy etch
US20080142039A1 (en) * 2006-12-13 2008-06-19 Advanced Technology Materials, Inc. Removal of nitride deposits
CN101981661A (zh) 2008-02-11 2011-02-23 高级技术材料公司 在半导体处理系统中离子源的清洗
JP5691163B2 (ja) * 2009-12-01 2015-04-01 セントラル硝子株式会社 クリーニングガス
WO2011093263A1 (ja) * 2010-02-01 2011-08-04 セントラル硝子株式会社 ドライエッチング剤及びそれを用いたドライエッチング方法
JP5953681B2 (ja) * 2011-09-09 2016-07-20 イビデン株式会社 プリント配線板の製造方法
US20150380526A1 (en) * 2014-06-27 2015-12-31 Applied Materials, Inc. Methods for forming fin structures with desired dimensions for 3d structure semiconductor applications
DE102015112036B4 (de) * 2015-07-23 2017-05-11 Schott Ag Monolithische Unterlage zur vollflächigen Unterstützung eines Werkstücks
KR102504833B1 (ko) * 2017-11-16 2023-03-02 삼성전자 주식회사 식각 가스 혼합물과 이를 이용한 패턴 형성 방법과 집적회로 소자의 제조 방법
US20220220612A1 (en) * 2019-11-19 2022-07-14 Showa Denko K.K. Method for removing adhering material and film forming method
CN113680767A (zh) * 2021-07-14 2021-11-23 深圳市拉普拉斯能源技术有限公司 一种lpcvd炉管在线清洗方法

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Publication number Priority date Publication date Assignee Title
US3415865A (en) * 1965-01-21 1968-12-10 Minnesota Mining & Mfg Perfluoroalkyl polyfluoroxy compounds
GB1437074A (en) 1972-06-27 1976-05-26 Res Inst For Medicine Chemistr Preparation of n-fluorinated organic nitrogen compounds
GB1513135A (en) * 1974-06-04 1978-06-07 Res Inst For Med & Chem Inc Fluorination process and fluoro steroids
JPS5749234A (en) * 1980-09-08 1982-03-23 Semiconductor Energy Lab Co Ltd Plasma etching method
US4568478A (en) * 1984-04-18 1986-02-04 E. I. Dupont De Nemours And Company Fluoroxy compound solutions
EP0227839B1 (de) 1985-07-02 1991-05-15 Semiconductor Energy Laboratory Co., Ltd. Verfahren zur bildung eines dünnschichtfilms
FR2631258B1 (fr) 1988-05-10 1991-04-05 Prestations Services Sps Procede de nettoyage en surface par plasma differe
IT1219736B (it) 1988-06-30 1990-05-24 Ausimont Spa Telomeri dell'1,2 dicloro 1,2 difluoroetilene e processo per la loro preparazione
US5176790A (en) 1991-09-25 1993-01-05 Applied Materials, Inc. Process for forming a via in an integrated circuit structure by etching through an insulation layer while inhibiting sputtering of underlying metal
KR100293830B1 (ko) * 1992-06-22 2001-09-17 리차드 에이치. 로브그렌 플라즈마 처리 쳄버내의 잔류물 제거를 위한 플라즈마 정결방법
US5318666A (en) * 1993-04-19 1994-06-07 Texas Instruments Incorporated Method for via formation and type conversion in group II and group VI materials
JP2674488B2 (ja) * 1993-12-01 1997-11-12 日本電気株式会社 ドライエッチング室のクリーニング方法
JPH07169756A (ja) * 1994-11-07 1995-07-04 Semiconductor Energy Lab Co Ltd プラズマエッチング方法
JP2904723B2 (ja) * 1995-04-21 1999-06-14 セントラル硝子株式会社 クリーニングガス
JPH08319586A (ja) * 1995-05-24 1996-12-03 Nec Yamagata Ltd 真空処理装置のクリーニング方法
US5824604A (en) * 1996-01-23 1998-10-20 Mattson Technology, Inc. Hydrocarbon-enhanced dry stripping of photoresist
WO1999008805A1 (en) * 1997-08-20 1999-02-25 Air Liquide Electronics Chemicals & Services, Inc. Plasma cleaning and etching methods using non-global-warming compounds

Also Published As

Publication number Publication date
US7168436B2 (en) 2007-01-30
US7744769B2 (en) 2010-06-29
DE69830776T2 (de) 2005-12-01
TW466266B (en) 2001-12-01
CN1119385C (zh) 2003-08-27
US20040097091A1 (en) 2004-05-20
CN1225938A (zh) 1999-08-18
EP0924282B1 (de) 2005-07-06
SG72905A1 (en) 2000-05-23
US20070029281A1 (en) 2007-02-08
US6673262B1 (en) 2004-01-06
KR19990063205A (ko) 1999-07-26
KR100299488B1 (ko) 2001-10-29
EP0924282A1 (de) 1999-06-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee