DE69819027T2 - 3D Inspektion elektronischer Pins mit einem optischen Element, welches auf der Oberseite einer transparenten Markenplatte angeordnet ist - Google Patents

3D Inspektion elektronischer Pins mit einem optischen Element, welches auf der Oberseite einer transparenten Markenplatte angeordnet ist Download PDF

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Publication number
DE69819027T2
DE69819027T2 DE69819027T DE69819027T DE69819027T2 DE 69819027 T2 DE69819027 T2 DE 69819027T2 DE 69819027 T DE69819027 T DE 69819027T DE 69819027 T DE69819027 T DE 69819027T DE 69819027 T2 DE69819027 T2 DE 69819027T2
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view
values
image
camera
transparent reticle
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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DE69819027T
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German (de)
English (en)
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DE69819027D1 (de
Inventor
M. Elwin BEATY
P. David MORK
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Beaty Elwin M Minnetonka
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Beaty Elwin M Minnetonka
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Publication of DE69819027D1 publication Critical patent/DE69819027D1/de
Publication of DE69819027T2 publication Critical patent/DE69819027T2/de
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Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/60—Analysis of geometric attributes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0818—Setup of monitoring devices prior to starting mounting operations; Teaching of monitoring devices for specific products; Compensation of drifts during operation, e.g. due to temperature shifts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Chemical & Material Sciences (AREA)
  • Quality & Reliability (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Geometry (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
DE69819027T 1997-05-05 1998-05-04 3D Inspektion elektronischer Pins mit einem optischen Element, welches auf der Oberseite einer transparenten Markenplatte angeordnet ist Expired - Fee Related DE69819027T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US850473 1997-05-05
US08/850,473 US6055054A (en) 1997-05-05 1997-05-05 Three dimensional inspection system
PCT/US1998/008950 WO1998050757A2 (en) 1997-05-05 1998-05-04 Three dimensional inspection system

Publications (2)

Publication Number Publication Date
DE69819027D1 DE69819027D1 (de) 2003-11-20
DE69819027T2 true DE69819027T2 (de) 2004-05-19

Family

ID=25308209

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69819027T Expired - Fee Related DE69819027T2 (de) 1997-05-05 1998-05-04 3D Inspektion elektronischer Pins mit einem optischen Element, welches auf der Oberseite einer transparenten Markenplatte angeordnet ist

Country Status (6)

Country Link
US (1) US6055054A (enExample)
EP (1) EP1017962B1 (enExample)
JP (2) JP2002515124A (enExample)
KR (1) KR20010012293A (enExample)
DE (1) DE69819027T2 (enExample)
WO (1) WO1998050757A2 (enExample)

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WO2004049267A1 (de) * 2002-11-23 2004-06-10 Odas Gmbh Verfahren zur fotografischen aufnahme eines zylinderförmigen, insbesondere plattenförmigen gegenstandes
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CN102012607B (zh) * 2010-09-29 2011-12-28 卓盈微电子（昆山）有限公司 对柔性线路板成像的装置
JP5854680B2 (ja) * 2011-07-25 2016-02-09 キヤノン株式会社 撮像装置
FR3004571B1 (fr) * 2013-04-11 2015-04-10 Vit Procede de correction d'une image tridimensionnelle d'un circuit electronique
JP2018516371A (ja) * 2015-06-05 2018-06-21 ケーエルエー−テンカー コーポレイション 半導体デバイスの少なくとも側面の検査装置、方法及びコンピュータプログラム製品
EP3341712B1 (en) 2015-08-26 2024-04-03 ABB Schweiz AG Object multi-perspective inspection apparatus and method therefor
CN105588841A (zh) * 2016-01-28 2016-05-18 浙江工业大学 基于机器视觉的针脚倾斜缺陷检测装置
JP7194055B2 (ja) * 2019-03-22 2022-12-21 日立Astemo株式会社 接合部の検査方法及び接合部の検査装置
CN112985275B (zh) * 2021-05-14 2021-08-20 苏州鼎纳自动化技术有限公司 一种产品内壁尺寸检测机构

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Also Published As

Publication number Publication date
KR20010012293A (ko) 2001-02-15
US6055054A (en) 2000-04-25
JP4901903B2 (ja) 2012-03-21
JP2002515124A (ja) 2002-05-21
EP1017962A2 (en) 2000-07-12
EP1017962B1 (en) 2003-10-15
JP2009156877A (ja) 2009-07-16
WO1998050757A3 (en) 2002-01-03
WO1998050757A2 (en) 1998-11-12
EP1017962A4 (en) 2000-07-26
DE69819027D1 (de) 2003-11-20

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8339 Ceased/non-payment of the annual fee