KR20010012293A - 3차원 검사 시스템 - Google Patents

3차원 검사 시스템 Download PDF

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Publication number
KR20010012293A
KR20010012293A KR1019997010245A KR19997010245A KR20010012293A KR 20010012293 A KR20010012293 A KR 20010012293A KR 1019997010245 A KR1019997010245 A KR 1019997010245A KR 19997010245 A KR19997010245 A KR 19997010245A KR 20010012293 A KR20010012293 A KR 20010012293A
Authority
KR
South Korea
Prior art keywords
image
reticle
camera
component
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019997010245A
Other languages
English (en)
Korean (ko)
Inventor
엘윈 엠. 배티
모크데이비드피
Original Assignee
엘윈 엠. 배티
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘윈 엠. 배티 filed Critical 엘윈 엠. 배티
Publication of KR20010012293A publication Critical patent/KR20010012293A/ko
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/60—Analysis of geometric attributes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0818—Setup of monitoring devices prior to starting mounting operations; Teaching of monitoring devices for specific products; Compensation of drifts during operation, e.g. due to temperature shifts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Chemical & Material Sciences (AREA)
  • Quality & Reliability (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Geometry (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
KR1019997010245A 1997-05-05 1998-05-04 3차원 검사 시스템 Withdrawn KR20010012293A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/850,473 US6055054A (en) 1997-05-05 1997-05-05 Three dimensional inspection system
US8/850,473 1997-05-05

Publications (1)

Publication Number Publication Date
KR20010012293A true KR20010012293A (ko) 2001-02-15

Family

ID=25308209

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019997010245A Withdrawn KR20010012293A (ko) 1997-05-05 1998-05-04 3차원 검사 시스템

Country Status (6)

Country Link
US (1) US6055054A (enExample)
EP (1) EP1017962B1 (enExample)
JP (2) JP2002515124A (enExample)
KR (1) KR20010012293A (enExample)
DE (1) DE69819027T2 (enExample)
WO (1) WO1998050757A2 (enExample)

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US6445518B1 (en) * 2000-11-28 2002-09-03 Semiconductor Technologies & Instruments, Inc. Three dimensional lead inspection system
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US6547409B2 (en) * 2001-01-12 2003-04-15 Electroglas, Inc. Method and apparatus for illuminating projecting features on the surface of a semiconductor wafer
US7206080B2 (en) * 2001-07-30 2007-04-17 Topcon Corporation Surface shape measurement apparatus, surface shape measurement method, surface state graphic apparatus
AU2002356548A1 (en) * 2001-10-09 2003-04-22 Dimensional Photonics, Inc. Device for imaging a three-dimensional object
WO2004049267A1 (de) * 2002-11-23 2004-06-10 Odas Gmbh Verfahren zur fotografischen aufnahme eines zylinderförmigen, insbesondere plattenförmigen gegenstandes
US7340085B2 (en) * 2003-09-03 2008-03-04 Microview Technologies Pte Ltd. Rotating prism component inspection system
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KR101380653B1 (ko) * 2008-06-12 2014-04-04 한미반도체 주식회사 비전검사장비의 비전검사방법
CN102012607B (zh) * 2010-09-29 2011-12-28 卓盈微电子（昆山）有限公司 对柔性线路板成像的装置
JP5854680B2 (ja) * 2011-07-25 2016-02-09 キヤノン株式会社 撮像装置
FR3004571B1 (fr) * 2013-04-11 2015-04-10 Vit Procede de correction d'une image tridimensionnelle d'un circuit electronique
JP2018516371A (ja) * 2015-06-05 2018-06-21 ケーエルエー−テンカー コーポレイション 半導体デバイスの少なくとも側面の検査装置、方法及びコンピュータプログラム製品
EP3341712B1 (en) 2015-08-26 2024-04-03 ABB Schweiz AG Object multi-perspective inspection apparatus and method therefor
CN105588841A (zh) * 2016-01-28 2016-05-18 浙江工业大学 基于机器视觉的针脚倾斜缺陷检测装置
JP7194055B2 (ja) * 2019-03-22 2022-12-21 日立Astemo株式会社 接合部の検査方法及び接合部の検査装置
CN112985275B (zh) * 2021-05-14 2021-08-20 苏州鼎纳自动化技术有限公司 一种产品内壁尺寸检测机构

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Also Published As

Publication number Publication date
US6055054A (en) 2000-04-25
JP4901903B2 (ja) 2012-03-21
JP2002515124A (ja) 2002-05-21
EP1017962A2 (en) 2000-07-12
DE69819027T2 (de) 2004-05-19
EP1017962B1 (en) 2003-10-15
JP2009156877A (ja) 2009-07-16
WO1998050757A3 (en) 2002-01-03
WO1998050757A2 (en) 1998-11-12
EP1017962A4 (en) 2000-07-26
DE69819027D1 (de) 2003-11-20

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 19991105

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid