DE69801453T2 - Modul mit Peltierkühler für optoelektronische Vorrichtung - Google Patents

Modul mit Peltierkühler für optoelektronische Vorrichtung

Info

Publication number
DE69801453T2
DE69801453T2 DE69801453T DE69801453T DE69801453T2 DE 69801453 T2 DE69801453 T2 DE 69801453T2 DE 69801453 T DE69801453 T DE 69801453T DE 69801453 T DE69801453 T DE 69801453T DE 69801453 T2 DE69801453 T2 DE 69801453T2
Authority
DE
Germany
Prior art keywords
module
optoelectronic device
peltier cooler
peltier
cooler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69801453T
Other languages
English (en)
Other versions
DE69801453D1 (de
Inventor
Takashi Yoshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Compound Semiconductor Devices Ltd
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE69801453D1 publication Critical patent/DE69801453D1/de
Publication of DE69801453T2 publication Critical patent/DE69801453T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/645Heat extraction or cooling elements the elements being electrically controlled, e.g. Peltier elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4207Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
    • G02B6/4208Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback using non-reciprocal elements or birefringent plates, i.e. quasi-isolators
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4266Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268Cooling
    • G02B6/4271Cooling with thermo electric cooling
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4266Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268Cooling
    • G02B6/4272Cooling with mounting substrates of high thermal conductivity
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38Cooling arrangements using the Peltier effect
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/024Arrangements for thermal management
    • H01S5/02407Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4266Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268Cooling
    • G02B6/4269Cooling with heat sinks or radiation fins
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4285Optical modules characterised by a connectorised pigtail
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4286Optical modules with optical power monitoring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0225Out-coupling of light
    • H01S5/02251Out-coupling of light using optical fibres
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/024Arrangements for thermal management
    • H01S5/02438Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69801453T 1997-02-07 1998-02-06 Modul mit Peltierkühler für optoelektronische Vorrichtung Expired - Fee Related DE69801453T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP02498897A JP3180701B2 (ja) 1997-02-07 1997-02-07 半導体レーザ装置

Publications (2)

Publication Number Publication Date
DE69801453D1 DE69801453D1 (de) 2001-10-04
DE69801453T2 true DE69801453T2 (de) 2002-05-02

Family

ID=12153372

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69801453T Expired - Fee Related DE69801453T2 (de) 1997-02-07 1998-02-06 Modul mit Peltierkühler für optoelektronische Vorrichtung

Country Status (5)

Country Link
US (1) US5924290A (de)
EP (1) EP0858106B1 (de)
JP (1) JP3180701B2 (de)
CN (1) CN1107365C (de)
DE (1) DE69801453T2 (de)

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CN1207595C (zh) * 2000-05-31 2005-06-22 古河电气工业株式会社 半导体激光器模块
CA2349430A1 (en) * 2000-05-31 2001-11-30 The Furukawa Electric Co., Ltd. Semiconductor laser diode module
JP2002111083A (ja) * 2000-09-29 2002-04-12 Aisin Seiki Co Ltd 熱電モジュール及びその製造方法
KR100369811B1 (ko) * 2001-01-30 2003-01-29 삼성전자 주식회사 상변화를 이용한 열 전달 매체를 구비한 광소자 모듈
DE10110369A1 (de) * 2001-03-03 2002-09-12 Daimler Chrysler Ag Anordnung zur Kühlung eines Sensorsystems
US6556752B2 (en) * 2001-08-15 2003-04-29 Agility Communications, Inc. Dual thermoelectric cooler optoelectronic package and manufacture process
SE0103121D0 (sv) * 2001-09-19 2001-09-19 Optillion Ab Cooling of optical modules
US6563696B1 (en) * 2001-10-17 2003-05-13 Ciena Corporation Solderless laser assembly
US7090412B2 (en) * 2002-08-02 2006-08-15 Sumitomo Electric Industries, Ltd. Optical module
US6964501B2 (en) 2002-12-24 2005-11-15 Altman Stage Lighting Co., Ltd. Peltier-cooled LED lighting assembly
US6747819B1 (en) * 2003-02-25 2004-06-08 Intel Corporation Optoelectronic assembly
JP2006072171A (ja) * 2004-09-06 2006-03-16 Hitachi Ltd 光モジュール
US7217042B2 (en) * 2004-09-15 2007-05-15 Sumitomo Electric Industries, Ltd. Optoelectronic module
US7118292B2 (en) * 2005-01-24 2006-10-10 Emcore Corporation Coaxial cooled laser modules with integrated thermal electric cooler and optical components
US7329008B2 (en) * 2005-05-20 2008-02-12 Symbol Technologies, Inc. Shock-resistant arrangement for, and method of, protecting a heat source from damage
JP2008145807A (ja) * 2006-12-12 2008-06-26 Oki Electric Ind Co Ltd ファイバブラッググレーティング装置
US8240885B2 (en) * 2008-11-18 2012-08-14 Abl Ip Holding Llc Thermal management of LED lighting systems
US8094388B1 (en) 2009-01-12 2012-01-10 Vortran Laser Technology, Inc. Removable and replaceable modular optic package with controlled microenvironment
DE202009011697U1 (de) * 2009-06-12 2010-05-12 Schäfter + Kirchhoff GmbH Laserdiodenstrahlquelle
CN101867008B (zh) * 2010-05-17 2012-11-21 中山大学佛山研究院 一种可自释放应力的led封装模块
US20130051024A1 (en) * 2011-08-31 2013-02-28 Moshe Amit Optical Transmitter Assembly, Optical Transceivers Including the Same, and Methods of Making and Using Such Optical Transmitter Assemblies and Optical Transceivers
JP2014035474A (ja) * 2012-08-09 2014-02-24 Furukawa Electric Co Ltd:The アレイ導波路回折格子型光合分波器
JP6064530B2 (ja) * 2012-11-08 2017-01-25 住友電気工業株式会社 発光モジュール及び光トランシーバ
CN104661487B (zh) * 2013-11-20 2017-06-20 华为技术有限公司 光模块散热结构及电子产品
CN107430061B (zh) 2015-02-17 2020-11-06 埃克斯雷姆Ip英国有限责任公司 用于温度控制旋光仪样品室的技术
DE102015207857A1 (de) * 2015-04-29 2016-11-03 Robert Bosch Gmbh Thermoelektrische Vorrichtung sowie Herstellungsverfahren derselben
EP3298706A4 (de) * 2015-05-22 2019-01-23 Applied Optoelectronics, Inc. Optische koaxialsenderbaugruppe (tosa) mit quaderartigem to-lasermodul und optischer sendeempfänger damit
US9883612B2 (en) 2015-06-02 2018-01-30 International Business Machines Corporation Heat sink attachment on existing heat sinks
CN107065084B (zh) * 2017-05-17 2019-04-23 中国兵器装备研究院 一种带有自检功能的光纤连接器
US11862930B2 (en) * 2018-02-09 2024-01-02 Mitsubishi Electric Corporation Optical module having restriction body fixed to stem and having a linear thermal expansion coefficient smaller than that of the stem
CN110320617B (zh) * 2019-07-04 2020-08-18 武汉光迅科技股份有限公司 一种基于光路位移补偿的发射光功率稳定组件

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EP0214464A1 (de) * 1985-09-05 1987-03-18 Siemens Aktiengesellschaft Gehäuse für ein optoelektronisches Schaltungsmodul
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US5704212A (en) * 1996-09-13 1998-01-06 Itronix Corporation Active cooling system for cradle of portable electronic devices

Also Published As

Publication number Publication date
JPH10223986A (ja) 1998-08-21
CN1190810A (zh) 1998-08-19
EP0858106A1 (de) 1998-08-12
EP0858106B1 (de) 2001-08-29
JP3180701B2 (ja) 2001-06-25
CN1107365C (zh) 2003-04-30
US5924290A (en) 1999-07-20
DE69801453D1 (de) 2001-10-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD., KAWASAKI

8339 Ceased/non-payment of the annual fee