DE69736043D1 - Geerdete flexible Schaltung mit verbesserten Impedanzeigenschaften - Google Patents

Geerdete flexible Schaltung mit verbesserten Impedanzeigenschaften

Info

Publication number
DE69736043D1
DE69736043D1 DE69736043T DE69736043T DE69736043D1 DE 69736043 D1 DE69736043 D1 DE 69736043D1 DE 69736043 T DE69736043 T DE 69736043T DE 69736043 T DE69736043 T DE 69736043T DE 69736043 D1 DE69736043 D1 DE 69736043D1
Authority
DE
Germany
Prior art keywords
flexible circuit
impedance characteristics
improved impedance
grounded flexible
grounded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69736043T
Other languages
English (en)
Other versions
DE69736043T2 (de
Inventor
Noda Atsuhito
Hoshikawa Shigeyuki
Shigeru Ando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Molex LLC
Original Assignee
Molex LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex LLC filed Critical Molex LLC
Publication of DE69736043D1 publication Critical patent/DE69736043D1/de
Application granted granted Critical
Publication of DE69736043T2 publication Critical patent/DE69736043T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/08—Flat or ribbon cables
    • H01B7/0861—Flat or ribbon cables comprising one or more screens
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Conductors (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Communication Cables (AREA)
DE69736043T 1996-10-04 1997-10-02 Geerdete flexible Schaltung mit verbesserten Impedanzeigenschaften Expired - Fee Related DE69736043T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP28326296 1996-10-04
JP28326296A JP3185048B2 (ja) 1996-10-04 1996-10-04 平型柔軟ケーブル

Publications (2)

Publication Number Publication Date
DE69736043D1 true DE69736043D1 (de) 2006-07-20
DE69736043T2 DE69736043T2 (de) 2008-02-14

Family

ID=17663184

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69736043T Expired - Fee Related DE69736043T2 (de) 1996-10-04 1997-10-02 Geerdete flexible Schaltung mit verbesserten Impedanzeigenschaften

Country Status (7)

Country Link
US (1) US6559377B1 (de)
EP (1) EP0835045B1 (de)
JP (1) JP3185048B2 (de)
KR (1) KR100282628B1 (de)
DE (1) DE69736043T2 (de)
SG (1) SG54567A1 (de)
TW (1) TW427584U (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100521260B1 (ko) * 1998-06-22 2005-12-29 삼성전자주식회사 회로 연결 장치 및 이를 포함하는 유연성 인쇄 회로 기판
US6225687B1 (en) * 1999-09-02 2001-05-01 Intel Corporation Chip package with degassing holes
US20020157865A1 (en) * 2001-04-26 2002-10-31 Atsuhito Noda Flexible flat circuitry with improved shielding
US6809608B2 (en) * 2001-06-15 2004-10-26 Silicon Pipe, Inc. Transmission line structure with an air dielectric
JP2003069170A (ja) * 2001-08-28 2003-03-07 Murata Mach Ltd プリント基板
JP2005244029A (ja) * 2004-02-27 2005-09-08 Molex Inc 信号伝達基板及び信号伝達基板とコネクタの接続構造
TW200638811A (en) * 2004-09-21 2006-11-01 Ibiden Co Ltd Flexible printed wiring board
US7271985B1 (en) * 2004-09-24 2007-09-18 Storage Technology Corporation System and method for crosstalk reduction in a flexible trace interconnect array
JP2006147837A (ja) * 2004-11-19 2006-06-08 Sony Chem Corp 配線基板、配線パターンの配置方法
JP4596955B2 (ja) * 2005-03-31 2010-12-15 ソニーケミカル＆インフォメーションデバイス株式会社 配線基板
JP2006286739A (ja) * 2005-03-31 2006-10-19 Sony Chemical & Information Device Corp 配線基板
JP4634883B2 (ja) * 2005-07-25 2011-02-16 ソニーケミカル＆インフォメーションデバイス株式会社 シールド付き配線基板とその製造方法
JP2007179995A (ja) * 2005-12-28 2007-07-12 Adorinkusu:Kk 可撓性平面ケーブル
US7504904B1 (en) * 2006-04-04 2009-03-17 Unisys Corporation Printed-circuit impedance control using skewed reference mesh
JP2008124317A (ja) * 2006-11-14 2008-05-29 Toshiba Matsushita Display Technology Co Ltd フレキシブルプリント基板
KR20090078287A (ko) * 2008-01-14 2009-07-17 삼성전자주식회사 전기기기
US8011950B2 (en) * 2009-02-18 2011-09-06 Cinch Connectors, Inc. Electrical connector
AU2011320072B2 (en) 2010-10-29 2016-05-19 Orpyx Medical Technologies Inc. Peripheral sensory and supersensory replacement system
TWI457055B (zh) * 2013-02-20 2014-10-11 Novatek Microelectronics Corp 軟性電路板及其接地線結構
BR112015028905A2 (pt) 2013-05-21 2017-07-25 Orpyx Medical Tech Inc conjunto de aquisição de dados de pressão, e, método de adquirir dados de pressão
CN104582233B (zh) * 2013-10-10 2018-06-05 富士康(昆山)电脑接插件有限公司 扁平线缆组件及其组装方法
US20150373830A1 (en) * 2014-06-19 2015-12-24 Kabushiki Kaisha Toshiba Composite substrate including foldable portion
GB201414963D0 (en) * 2014-08-22 2014-10-08 Rolls Royce Plc Earthing arrangement for electrical panel
JP6513134B2 (ja) * 2017-05-26 2019-05-15 レノボ・シンガポール・プライベート・リミテッド ケーブル接続構造及びケーブル接続方法
US11765822B1 (en) * 2020-09-03 2023-09-19 Marvell Asia Pte Ltd Printed circuit boards with meshed conductive structures

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2154814A1 (de) 1971-11-04 1973-05-10 Telefonbau & Normalzeit Gmbh Leiteranordnung zur verbindung von baugruppen
US4644092A (en) 1985-07-18 1987-02-17 Amp Incorporated Shielded flexible cable
FR2613539A1 (fr) 1987-04-03 1988-10-07 Bull Sa Connecteur de bus adapte en impedance et procede de fabrication d'un tel connecteur
US4798918A (en) 1987-09-21 1989-01-17 Intel Corporation High density flexible circuit
CA2036868A1 (en) 1990-03-06 1991-09-07 Ellice Y. Luh Non-moire shielded window
JPH08506696A (ja) 1993-02-02 1996-07-16 エイ・エス・ティー・リサーチ・インコーポレイテッド 遮蔽グリッドを含む回路基板配列およびその構成
US5300899A (en) 1993-02-02 1994-04-05 Ast Research, Inc. Thin, flexible, stripline flex cable having two shielding ground planes formed as grids having mutually offset grid patterns
US5675299A (en) 1996-03-25 1997-10-07 Ast Research, Inc. Bidirectional non-solid impedance controlled reference plane requiring no conductor to grid alignment

Also Published As

Publication number Publication date
TW427584U (en) 2001-03-21
US6559377B1 (en) 2003-05-06
JP3185048B2 (ja) 2001-07-09
EP0835045A3 (de) 1999-03-10
SG54567A1 (en) 1998-11-16
JPH10112224A (ja) 1998-04-28
EP0835045A2 (de) 1998-04-08
KR19980032554A (ko) 1998-07-25
EP0835045B1 (de) 2006-06-07
DE69736043T2 (de) 2008-02-14
KR100282628B1 (ko) 2001-02-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee