CN104582233B - 扁平线缆组件及其组装方法 - Google Patents

扁平线缆组件及其组装方法 Download PDF

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CN104582233B
CN104582233B CN201310469067.5A CN201310469067A CN104582233B CN 104582233 B CN104582233 B CN 104582233B CN 201310469067 A CN201310469067 A CN 201310469067A CN 104582233 B CN104582233 B CN 104582233B
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flat cable
circuit board
assemble method
pcb
printed circuit
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CN104582233A (zh
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吴荣发
陈钧
孟凡波
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Foxconn Kunshan Computer Connector Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10356—Cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49179—Assembling terminal to elongated conductor by metal fusion bonding

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Conductors (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

本发明公开了一种扁平线缆组件（100），包括扁平线缆（1），与扁平线缆电性连接的印刷电路板（2），及覆盖于扁平线缆及印刷电路板连接处的固持体（3），所述扁平线缆设有金属屏蔽层（12），所述金属屏蔽层两侧延伸有延伸部（120），所述电路板设有与延伸部电性连接的接地片（21）。

Description

扁平线缆组件及其组装方法
【技术领域】
本发明涉及一种扁平线缆组件，尤指一种包括扁平线缆及与其焊接的印刷电路板的扁平线缆组件。
【背景技术】
于2012年1月11日公告的中国专利第CN202111933U号揭示了一种软性排线组件，包括软性排线，印刷电路板及胶体，软性排线焊接于印刷电路板上，胶体粘覆于软性排在线并与印刷电路板结合在一起，印刷电路板上设置有若干收容孔，胶体的一部分渗入收容孔中而使软性排线进一步定位于印刷电路板。然而，软性排线组件存在电磁干扰，影响信号质量，同时焊接软性排线时，金手指容易折断。
是以，需要一种改进的扁平线缆组件来克服现有技术的不足。
【发明内容】
本发明的目的在于提供一种可改善电磁干扰（EMI，Electromagneticinterference）的扁平线缆组件及其组装方法。
为了实现上述目的，本发明采用如下技术方案：一种扁平线缆组件，包括扁平线缆，与扁平线缆电性连接的印刷电路板，及覆盖于扁平线缆及印刷电路板连接处的固持体，所述扁平线缆设有金属屏蔽层，所述金属屏蔽层两侧延伸有延伸部，所述电路板设有与延伸部电性连接的接地片。
为了实现上述目的，本发明还可采用如下技术方案：一种扁平线缆组件的组装方法，其包括如下步骤：
第一步，将金属屏蔽层的延伸部焊接于电路板的接地片;
第二步，将扁平线缆的若干导体焊接于电路板；
第三步，将热熔胶体覆盖于导体与电路板焊接处及延伸部与电路板接地片焊接处。
与现有技术相比，本发明柔性扁平线缆组件的优点在于：通过扁平线缆的金属屏蔽层设置延伸部，延伸部与电路板的接地片电性连接后，从而可降低整个扁平线缆组件的抗电磁干扰能力EMI（Electromagnetic interference）。同时，在扁平线缆焊接于电路板之前先完成延伸部和接地片的焊接，从而可防止热熔塑胶层保护前或未充分保护时，扁平线缆弯折造成导体折断现象。
【附图说明】
图1是本发明扁平线缆组件的立体组合图。
图2是图1所示的扁平线缆组件的部分立体分解图。
图3是图1的部分立体组合图。
图4是本发明扁平线缆组件中金属层上的延伸部焊接于印刷电路板的接地片示意图。
图5是本发明扁平线缆组件中扁平线缆的分解图。
【具体实施方式】
请参阅图1，本发明扁平线缆组件100，包括扁平线缆1，与扁平线缆1电性连接的印刷电路板2，及覆盖扁平线缆1与电路板2连接处的固持体3，该固持体3为热熔胶体并将扁平线缆1与印刷电路板2固定在一起。
请参阅图2至图5，在本发明的优选实施方式中，扁平线缆1为柔性扁平线缆，其包括横向间隔排列的导体10，包覆若干导体10的绝缘体11，覆盖绝缘体11的金属屏蔽层12。绝缘体11包括包覆导体10的第一绝缘层110及位于第一绝缘层110及金属屏蔽层12之间的第二绝缘层111。第二绝缘层111用于增加导体10与金属屏蔽层12之间的距离从而调节特性阻抗，以达到阻抗匹配。若干导体10的一端露出于绝缘体11并与印刷电路板2焊接在一起。金属屏蔽层12的左右两边设有向外延伸的延伸部120。
印刷电路板2底面设有若干与导体10焊接的连接点20及分别设于印刷电路板2底面两侧的接地片21。当扁平线缆1焊接于电路板2时，先用焊锡4将金属屏蔽层12两侧的延伸部120分别焊接于电路板2底面两侧的接地片21，再将若干导体10焊接于印刷电路板2的焊接点20。最后用热熔胶体覆盖于导体10与印刷电路板2的焊接处以固定扁平线缆1与电路板2。
在本发明优选实施方式中，扁平线缆组件100通过在金属屏蔽层12设置延伸部120，同时电路板2增加与延伸部120焊接的接地片21，从而可提高整个扁平线缆组件100的抗电磁干扰能力。而且，在导体10焊接于电路板2之前，先焊接延伸部120和电路板的接地片21，从而起到预定位的目的，可防止热熔塑胶层3保护前或未充分保护时，扁平线缆1弯折时造成导体10折断现象。在其他实施方式中，扁平线缆可为内部具有圆导体的高频扁平线缆结构及其他类型的扁平线缆结构，在此不再赘述。

Claims (8)

1.一种扁平线缆组件的组装方法，所述扁平线缆组件包括：扁平线缆、与扁平线缆电性连接的印刷电路板及覆盖于扁平线缆及印刷电路板连接处的固持体，所述扁平线缆设有金属屏蔽层，所述金属屏蔽层两侧设有延伸部，所述电路板设有与延伸部电性连接的接地片，其特征在于：所述扁平线缆组件的组装方法包括如下步骤：
第一步，将金属屏蔽层的延伸部焊接于电路板的接地片；
第二步，将扁平线缆的若干导体焊接于电路板；
第三步，将热熔胶体覆盖于导体与电路板焊接处及延伸部与电路板接地片焊接处。
2.如权利要求1所述的扁平线缆组件的组装方法，其特征在于：所述扁平线缆为柔性扁平线缆。
3.如权利要求2所述的扁平线缆组件的组装方法，其特征在于：所述柔性扁平线缆还包括若干间隔排列的导体及包覆于若干导体外的绝缘体，所述金属屏蔽层覆盖所述绝缘体。
4.如权利要求3所述的扁平线缆组件的组装方法，其特征在于：所述若干导体的一端露出于绝缘体并与印刷电路板焊接在一起。
5.如权利要求1所述的扁平线缆组件的组装方法，其特征在于：所述固持体为热熔胶体。
6.如权利要求3所述的扁平线缆组件的组装方法，其特征在于：所述绝缘体包括包覆导体的第一绝缘层及位于第一绝缘层和金属屏蔽层之间的第二绝缘层。
7.如权利要求1所述的扁平线缆组件的组装方法，其特征在于：所述扁平线缆的一端承接于所述印刷电路板，所述扁平线缆的一端与印刷电路板焊接并被所述固持体覆盖。
8.如权利要求1所述的扁平线缆组件的组装方法，其特征在于：所述扁平线缆为包括圆导体的扁平线缆。
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