DE69705119T2 - Schaltungsplatte - Google Patents

Schaltungsplatte

Info

Publication number
DE69705119T2
DE69705119T2 DE69705119T DE69705119T DE69705119T2 DE 69705119 T2 DE69705119 T2 DE 69705119T2 DE 69705119 T DE69705119 T DE 69705119T DE 69705119 T DE69705119 T DE 69705119T DE 69705119 T2 DE69705119 T2 DE 69705119T2
Authority
DE
Germany
Prior art keywords
circuit board
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69705119T
Other languages
English (en)
Other versions
DE69705119D1 (de
Inventor
Andrew Zachary Glovatsky
George Todd
Keith Mcmillan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ford Werke GmbH
Ford Motor Co Ltd
Original Assignee
Ford Werke GmbH
Ford Motor Co Ltd
Ford Motor Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ford Werke GmbH, Ford Motor Co Ltd, Ford Motor Co filed Critical Ford Werke GmbH
Application granted granted Critical
Publication of DE69705119D1 publication Critical patent/DE69705119D1/de
Publication of DE69705119T2 publication Critical patent/DE69705119T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09163—Slotted edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
DE69705119T 1996-05-10 1997-05-01 Schaltungsplatte Expired - Fee Related DE69705119T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/644,100 US5929375A (en) 1996-05-10 1996-05-10 EMI protection and CTE control of three-dimensional circuitized substrates
PCT/GB1997/001188 WO1997043882A1 (en) 1996-05-10 1997-05-01 A circuit board

Publications (2)

Publication Number Publication Date
DE69705119D1 DE69705119D1 (de) 2001-07-12
DE69705119T2 true DE69705119T2 (de) 2002-03-21

Family

ID=24583455

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69705119T Expired - Fee Related DE69705119T2 (de) 1996-05-10 1997-05-01 Schaltungsplatte

Country Status (5)

Country Link
US (1) US5929375A (de)
EP (1) EP0897653B1 (de)
CA (1) CA2253565A1 (de)
DE (1) DE69705119T2 (de)
WO (1) WO1997043882A1 (de)

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* Cited by examiner, † Cited by third party
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US6225568B1 (en) * 1998-08-31 2001-05-01 Advanced Flexible Circuits Co., Ltd. Circuit board having shielding planes with varied void opening patterns for controlling the impedance and the transmission time
US6590466B2 (en) * 1998-08-31 2003-07-08 Advanced Flexible Circuit Co., Ltd. Circuit board having shielding planes with varied void opening patterns for controlling the impedance and the transmission time of differential transmission lines
US6288344B1 (en) 1999-08-20 2001-09-11 Cardiac Pacemakers, Inc. Integrated EMI shield utilizing a hybrid edge
US6900383B2 (en) 2001-03-19 2005-05-31 Hewlett-Packard Development Company, L.P. Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces
US20050095410A1 (en) * 2001-03-19 2005-05-05 Mazurkiewicz Paul H. Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating
GB2374984B (en) * 2001-04-25 2004-10-06 Ibm A circuitised substrate for high-frequency applications
US20040119201A1 (en) * 2002-07-12 2004-06-24 Siegel-Robert, Inc. Apparatus and method for manufacturing plastic products with EMI/RFI/ESD shield
US6778398B2 (en) * 2002-10-24 2004-08-17 Koninklijke Philips Electronics N.V. Thermal-conductive substrate package
TWM244562U (en) * 2003-07-21 2004-09-21 Via Tech Inc Ground shield structure
JP4316483B2 (ja) * 2004-12-08 2009-08-19 ユーアイ電子株式会社 プリント基板の製造方法及びプリント基板
US7304859B2 (en) * 2006-03-30 2007-12-04 Stats Chippac Ltd. Chip carrier and fabrication method
DE102009060123B4 (de) * 2009-12-17 2019-01-24 Pilz Gmbh & Co. Kg Elektrische Schaltung mit mindestens einer Leiterplatte und einer Anzahl von mit Bauelementekontaktierungen versehener elektrischer Bauelemente
FR2966692B1 (fr) * 2010-10-26 2012-12-14 Sagem Defense Securite Carte electronique, dispositif electronique comportant une telle carte et procede de protection d'une carte electronique
JP5930980B2 (ja) * 2013-02-06 2016-06-08 三菱電機株式会社 半導体装置およびその製造方法
CN104981113B (zh) * 2014-04-14 2017-12-29 深南电路有限公司 电路板金手指的加工方法和金手指电路板
CN104981107B (zh) * 2014-04-14 2018-01-26 深南电路有限公司 电路板金手指的加工方法和金手指电路板
CN104981112B (zh) * 2014-04-14 2017-12-29 深南电路有限公司 金手指的加工方法和金手指电路板
CN104981110B (zh) * 2014-04-14 2018-06-26 深南电路有限公司 金手指的加工方法和金手指电路板
CN104981114B (zh) * 2014-04-14 2018-01-26 深南电路有限公司 悬空金手指的加工方法和电路板
CN104981109B (zh) * 2014-04-14 2017-10-10 深南电路有限公司 悬空结构金手指的加工方法和电路板
CN104981111B (zh) * 2014-04-14 2017-10-10 深南电路有限公司 悬空结构金手指的加工方法和电路板
US10788531B2 (en) * 2014-10-29 2020-09-29 Modus Test, Llc Reduced cost package device simulator, manufacturing method and method of use
WO2017117153A1 (en) * 2015-12-27 2017-07-06 Massachusetts Institute Of Technology Design and fabrication of three-dimensional kirigami structures with tunable properties
CN111919300A (zh) * 2018-03-23 2020-11-10 索尼半导体解决方案公司 电路板、半导体器件和电子设备
JP2020043219A (ja) * 2018-09-11 2020-03-19 ソニーセミコンダクタソリューションズ株式会社 回路基板、半導体装置、および、電子機器
TWI785621B (zh) * 2021-05-24 2022-12-01 環球聯通科技股份有限公司 電子元件載板及其佈線方法

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FR1432771A (fr) * 1965-02-11 1966-03-25 Cie Des Produits Elementaires Perfectionnements aux plaquettes isolantes porteuses de conducteurs métalliques
DE1916308A1 (de) * 1969-03-29 1970-10-08 Licentia Gmbh Traegerplatte fuer gedruckte Schaltungen
US3932932A (en) * 1974-09-16 1976-01-20 International Telephone And Telegraph Corporation Method of making multilayer printed circuit board
ZA783270B (en) * 1977-07-06 1979-06-27 Motorola Inc Molded circuit board
DE3107067A1 (de) * 1981-02-25 1982-09-09 Siemens AG, 1000 Berlin und 8000 München Steuergeraet in modulbauweise
US4596670A (en) * 1983-10-25 1986-06-24 General Electric Company EMI shielding effectiveness of thermoplastics
US4639056A (en) * 1985-05-31 1987-01-27 Trw Inc. Connector construction for a PC board or the like
US4687267A (en) * 1986-06-27 1987-08-18 Amp Incorporated Circuit board edge connector
JPS63249394A (ja) * 1987-04-06 1988-10-17 日本電気株式会社 多層回路基板
US5060113A (en) * 1987-04-09 1991-10-22 Raychem Corporation Connector assembly
US4793816A (en) * 1987-07-20 1988-12-27 Industrial Electronic Hardware Terminal protector for circuit board connector
FR2620296B1 (fr) * 1987-09-03 1990-01-19 Bendix Electronics Sa Boitier pour circuit electronique
US4935284A (en) * 1988-12-21 1990-06-19 Amp Incorporated Molded circuit board with buried circuit layer
EP0393312A1 (de) * 1989-04-21 1990-10-24 Dyconex AG Mehrlagige Leiterplatte
US5250342A (en) * 1989-05-24 1993-10-05 United Technologies Corporation Composite EMI shield having clean, highly conductive surfaces for conductive bonding
JPH0831705B2 (ja) * 1990-08-02 1996-03-27 インターナショナル・ビジネス・マシーンズ・コーポレイション Ｅｍｉ抑制回路カード
US5166772A (en) * 1991-02-22 1992-11-24 Motorola, Inc. Transfer molded semiconductor device package with integral shield
JP2705368B2 (ja) * 1991-05-31 1998-01-28 株式会社デンソー 電子装置
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US5418693A (en) * 1994-01-11 1995-05-23 Delco Electronics Corporation Electrostatic discharge protection for instrument cluster
JPH0818170A (ja) * 1994-06-28 1996-01-19 Honda Motor Co Ltd 配線基板
US5609491A (en) * 1995-03-10 1997-03-11 The Whitaker Corporation Electrical connector for printed circuit board assembly
US5574630A (en) * 1995-05-11 1996-11-12 International Business Machines Corporation Laminated electronic package including a power/ground assembly

Also Published As

Publication number Publication date
EP0897653B1 (de) 2001-06-06
EP0897653A1 (de) 1999-02-24
DE69705119D1 (de) 2001-07-12
CA2253565A1 (en) 1997-11-20
WO1997043882A1 (en) 1997-11-20
US5929375A (en) 1999-07-27

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication related to discontinuation of the patent is to be deleted
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: DR. HEYNER & DR. SPERLING PATENTANWAELTE, 01217 DRE

8327 Change in the person/name/address of the patent owner

Owner name: FORD-WERKE GMBH, 50735 KOELN, DE

Owner name: FORD MOTOR CO. LTD., BRENTWOOD, ESSEX, GB

8339 Ceased/non-payment of the annual fee