DE69735350D1 - Lückenüberbrückungs-bussystem - Google Patents

Lückenüberbrückungs-bussystem

Info

Publication number
DE69735350D1
DE69735350D1 DE69735350T DE69735350T DE69735350D1 DE 69735350 D1 DE69735350 D1 DE 69735350D1 DE 69735350 T DE69735350 T DE 69735350T DE 69735350 T DE69735350 T DE 69735350T DE 69735350 D1 DE69735350 D1 DE 69735350D1
Authority
DE
Germany
Prior art keywords
bus system
bypass bus
gap
gap bypass
bypass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69735350T
Other languages
English (en)
Other versions
DE69735350T2 (de
Inventor
Masaya Umemura
Hideki Osaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE69735350D1 publication Critical patent/DE69735350D1/de
Application granted granted Critical
Publication of DE69735350T2 publication Critical patent/DE69735350T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38Information transfer, e.g. on bus
    • G06F13/40Bus structure
    • G06F13/4063Device-to-bus coupling
    • G06F13/4068Electrical coupling
    • G06F13/4072Drivers or receivers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • H05K1/0245Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09263Meander
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/097Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10022Non-printed resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dc Digital Transmission (AREA)
  • Small-Scale Networks (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
DE69735350T 1996-10-30 1997-10-29 Lückenüberbrückungs-bussystem Expired - Fee Related DE69735350T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP28836696 1996-10-30
JP28836696A JP3442237B2 (ja) 1996-10-30 1996-10-30 間隙結合式バスシステム
PCT/JP1997/003922 WO1998019225A1 (fr) 1996-10-30 1997-10-29 Systeme a bus de couplage a discontinuite

Publications (2)

Publication Number Publication Date
DE69735350D1 true DE69735350D1 (de) 2006-04-27
DE69735350T2 DE69735350T2 (de) 2006-08-03

Family

ID=17729281

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69735350T Expired - Fee Related DE69735350T2 (de) 1996-10-30 1997-10-29 Lückenüberbrückungs-bussystem

Country Status (5)

Country Link
US (1) US6600790B1 (de)
EP (1) EP1011039B1 (de)
JP (1) JP3442237B2 (de)
DE (1) DE69735350T2 (de)
WO (1) WO1998019225A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3757757B2 (ja) 2000-05-18 2006-03-22 株式会社日立製作所 リード優先メモリシステム
JP3859943B2 (ja) 2000-07-25 2006-12-20 エルピーダメモリ株式会社 データ送信装置、データ転送システムおよび方法
TW530248B (en) * 2000-08-09 2003-05-01 Hitachi Ltd Data transmission system of directional coupling type using forward wave and reflective wave
JP4136495B2 (ja) 2001-08-08 2008-08-20 株式会社日立製作所 方向性結合器を含む回路の設計支援装置、その設計支援プログラム、及び回路の設計方法
JP2003050256A (ja) 2001-08-08 2003-02-21 Hitachi Ltd プリント基板検査装置
US20030117183A1 (en) * 2001-12-20 2003-06-26 Claude Thibeault Methods, apparatus, and systems for reducing interference on nearby conductors
US6909052B1 (en) 2002-08-23 2005-06-21 Emc Corporation Techniques for making a circuit board with improved impedance characteristics
JP4741226B2 (ja) 2003-12-25 2011-08-03 株式会社日立製作所 半導体メモリモジュール、およびメモリシステム
ITUD20040181A1 (it) * 2004-09-21 2004-12-21 Eurotech Spa Scheda elettronica modulare per una rete di comunicazione
US7450396B2 (en) * 2006-09-28 2008-11-11 Intel Corporation Skew compensation by changing ground parasitic for traces
US8131903B2 (en) * 2007-04-30 2012-03-06 Hewlett-Packard Development Company, L.P. Multi-channel memory connection system and method
JP4630885B2 (ja) * 2007-05-01 2011-02-09 富士通株式会社 情報処理装置
DE102011113656A1 (de) * 2011-09-19 2013-03-21 Erni Electronics Gmbh Mehrlagige elektrische Leiterplatte
US9043623B2 (en) 2012-05-07 2015-05-26 Tesla Motors, Inc. Host initiated state control of remote client in communications system
FR3002639A1 (fr) * 2013-02-25 2014-08-29 Bigot Jerome Le Detecteur de gaz avec cheminements de longueur cumulee constante
KR20170023095A (ko) * 2014-06-23 2017-03-02 블루 다뉴브 시스템스, 인크. 다층 기판들 상에서의 신호들의 결합
CN106535472B (zh) * 2017-01-12 2019-08-02 郑州云海信息技术有限公司 一种pcb及信号传输系统

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1548848A (de) 1967-01-13 1968-12-06
FR2631169B1 (fr) 1988-05-04 1990-07-13 Cit Alcatel Dispositif de distribution de signaux numeriques a tres hauts debits
JPH0371798A (ja) 1989-08-11 1991-03-27 Hitachi Ltd 車載用再生装置
JP3071798B2 (ja) * 1990-01-30 2000-07-31 日産自動車株式会社 自動車用燃料タンク
JPH0619692B2 (ja) 1990-10-19 1994-03-16 株式会社グラフィコ ラジアル・バス
JPH0619693B2 (ja) 1990-11-16 1994-03-16 株式会社グラフィコ ラジアル・バス
JPH05299908A (ja) * 1992-04-17 1993-11-12 Fujitsu Ltd バックワイヤリングボードの高周波クロック分岐バス
JPH06161972A (ja) 1992-11-25 1994-06-10 Mitsubishi Precision Co Ltd マルチプロセッサシステム
JP3060269B2 (ja) 1993-02-22 2000-07-10 沖電気工業株式会社 可変配線バックボード
JP2912131B2 (ja) 1993-08-23 1999-06-28 日本電気株式会社 Lsi配線構造
JP3399630B2 (ja) * 1993-09-27 2003-04-21 株式会社日立製作所 バスシステム
US5555540A (en) 1995-02-17 1996-09-10 Sun Microsystems, Inc. ASIC bus structure
US6125419A (en) * 1996-06-13 2000-09-26 Hitachi, Ltd. Bus system, printed circuit board, signal transmission line, series circuit and memory module
US6160423A (en) * 1998-03-16 2000-12-12 Jazio, Inc. High speed source synchronous signaling for interfacing VLSI CMOS circuits to transmission lines
JP2000122761A (ja) * 1998-10-14 2000-04-28 Hitachi Ltd バスシステム及びそれを用いたメモリシステム

Also Published As

Publication number Publication date
EP1011039A4 (de) 2001-08-22
DE69735350T2 (de) 2006-08-03
EP1011039B1 (de) 2006-03-01
JPH10133794A (ja) 1998-05-22
US6600790B1 (en) 2003-07-29
EP1011039A1 (de) 2000-06-21
WO1998019225A1 (fr) 1998-05-07
JP3442237B2 (ja) 2003-09-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee