DE69731707D1 - Verfahren zum Korrigieren von der ungleichen Position einer Informationsscheibe - Google Patents

Verfahren zum Korrigieren von der ungleichen Position einer Informationsscheibe

Info

Publication number
DE69731707D1
DE69731707D1 DE69731707T DE69731707T DE69731707D1 DE 69731707 D1 DE69731707 D1 DE 69731707D1 DE 69731707 T DE69731707 T DE 69731707T DE 69731707 T DE69731707 T DE 69731707T DE 69731707 D1 DE69731707 D1 DE 69731707D1
Authority
DE
Germany
Prior art keywords
correcting
procedure
information disc
unequal position
unequal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69731707T
Other languages
English (en)
Other versions
DE69731707T2 (de
Inventor
C O Kitano Eng Co Amo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KITANO CO.,LTD., KOMATSUSHIMA, TOKUSHIMA, JP
Original Assignee
Kitano Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kitano Engineering Co Ltd filed Critical Kitano Engineering Co Ltd
Publication of DE69731707D1 publication Critical patent/DE69731707D1/de
Application granted granted Critical
Publication of DE69731707T2 publication Critical patent/DE69731707T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406—Ultraviolet [UV] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1435—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1477—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier
    • B29C65/1483—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier coated on the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B29C65/521—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by spin coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/76—Making non-permanent or releasable joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B29C65/7805—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features
    • B29C65/7808—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of holes or slots
    • B29C65/7811—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of holes or slots for centring purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B29C66/452—Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003—Records or discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003—Records or discs
    • B29L2017/005—CD''s, DVD''s
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/81—Sound record

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing Optical Record Carriers (AREA)
DE69731707T 1996-07-31 1997-07-30 Verfahren zum Korrigieren von der ungleichen Position einer Informationsscheibe Expired - Fee Related DE69731707T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP21946796 1996-07-31
JP21946796 1996-07-31

Publications (2)

Publication Number Publication Date
DE69731707D1 true DE69731707D1 (de) 2004-12-30
DE69731707T2 DE69731707T2 (de) 2006-03-02

Family

ID=16735897

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69731707T Expired - Fee Related DE69731707T2 (de) 1996-07-31 1997-07-30 Verfahren zum Korrigieren von der ungleichen Position einer Informationsscheibe

Country Status (3)

Country Link
US (1) US5888433A (de)
EP (1) EP0833315B1 (de)
DE (1) DE69731707T2 (de)

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CN100528559C (zh) * 1996-04-19 2009-08-19 松下电器产业株式会社 叠层式光盘制造方法及其装置
KR100528112B1 (ko) * 1997-08-20 2006-03-17 소니 가부시끼 가이샤 원반형 기록 매체의 제조 장치 및 방법
US6254809B1 (en) * 1998-05-19 2001-07-03 Steag Hamatech, Inc. System and method for curing a resin disposed between a top and bottom substrate with thermal management
US6337842B1 (en) 1998-06-01 2002-01-08 Microboards Technology, L.L.C. Disk handling system having a telescoping elevator pin
US7032232B2 (en) * 1998-06-01 2006-04-18 Microboards Technology, Llc Memory storage disk handling system
JP3280313B2 (ja) * 1998-06-01 2002-05-13 北野エンジニアリング株式会社 光ディスクの製造方法
SE512007C2 (sv) * 1999-02-22 2000-01-10 M2 Engineering Ab Förfaringssätt för sammanfogning av ett undre substrat med ett övre substrat medelst lim
DE19927514C2 (de) 1999-06-16 2002-07-18 Steag Hamatech Ag Vorrichtung zum zentrischen Zusammenfügen von Substraten
TW527590B (en) * 2000-04-25 2003-04-11 Matsushita Electric Ind Co Ltd Compact disk, and the manufacturing method of the same, and the manufacturing device of compact disk
DE10063666C1 (de) * 2000-12-20 2002-04-11 Steag Hamatech Ag Verfahren und Vorrichtung zum Zusammenfügen von Substraten
DE10113833A1 (de) 2001-03-21 2002-10-24 Steag Hamatech Ag Vorrichtung zum Zusammenfügen von Substraten
JP2003067991A (ja) * 2001-06-07 2003-03-07 Fuji Photo Film Co Ltd 光ディスクの製造方法及びディスク積層体の搬送方法
KR100438700B1 (ko) * 2001-08-14 2004-07-05 삼성전자주식회사 투과층 형성방법, 장치 및 디스크 기판
DE10213273B4 (de) * 2002-03-25 2005-12-29 Steag Hamatech Ag Herstellung von DVD-Cards und anderen Disks mit nicht runden Formen
MXPA03005877A (es) * 2002-07-04 2006-04-24 Matsushita Electric Ind Co Ltd Medio de grabacion de datos opticos y metodo de fabricacion del mismo.
US20040209123A1 (en) * 2003-04-17 2004-10-21 Bajorek Christopher H. Method of fabricating a discrete track recording disk using a bilayer resist for metal lift-off
EP1658171B1 (de) * 2003-08-22 2008-04-30 Oerlikon Trading AG, Trübbach Verfahren zum verkleben von scheibenförmigen substraten und vorrichtung zur durchführung des verfahrens
JP2005085411A (ja) * 2003-09-10 2005-03-31 Tdk Corp 多層記録タイプの光記録媒体の製造方法及び製造工程における中間体
US20050151282A1 (en) * 2004-01-13 2005-07-14 Harper Bruce M. Workpiece handler and alignment assembly
US7686606B2 (en) 2004-01-20 2010-03-30 Wd Media, Inc. Imprint embossing alignment system
US7329114B2 (en) * 2004-01-20 2008-02-12 Komag, Inc. Isothermal imprint embossing system
BRPI0706783A2 (pt) * 2006-01-30 2011-04-05 Singulus Technologies Ag conjunto de pino centrador para centrar e reter substratos com um orifìcio central
DE102006022608A1 (de) 2006-05-15 2007-11-22 Steag Hamatech Ag Verwendung eines Vakuums, um den Kleber zum Mittelloch zu ziehen
JP4577522B2 (ja) 2006-08-21 2010-11-10 株式会社日立ハイテクノロジーズ パターン転写装置及びパターン転写方法
US8496466B1 (en) 2009-11-06 2013-07-30 WD Media, LLC Press system with interleaved embossing foil holders for nano-imprinting of recording media
US8402638B1 (en) 2009-11-06 2013-03-26 Wd Media, Inc. Press system with embossing foil free to expand for nano-imprinting of recording media
US9330685B1 (en) 2009-11-06 2016-05-03 WD Media, LLC Press system for nano-imprinting of recording media with a two step pressing method

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JPS61126648A (ja) * 1984-11-26 1986-06-14 Nippon Telegr & Teleph Corp <Ntt> デイスク張り合せ装置及びその方法
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JPH0626823B2 (ja) * 1987-10-15 1994-04-13 パイオニア株式会社 光ディスク製造装置
JPH063678B2 (ja) * 1988-06-28 1994-01-12 ティーディーケイ株式会社 ハブ付きディスクの製造装置
DE69030845T2 (de) * 1989-01-11 1997-11-20 Seiko Epson Corp Optische platte und verfahren zur herstellung
JP3017006B2 (ja) * 1993-12-18 2000-03-06 日野自動車株式会社 ホィールバランス測定装置用ホィール取付け装置
JPH0836786A (ja) * 1994-07-21 1996-02-06 Nikon Corp 光記録媒体の製造方法
US5744193A (en) * 1995-05-20 1998-04-28 Kitano Engineering Co., Ltd. Method of manufacturing an optical disc and a placing platform to be used by the same
US5938891A (en) * 1996-02-27 1999-08-17 Origin Electric Company, Limited Disk bonding system
JP3589521B2 (ja) * 1996-03-07 2004-11-17 日本政策投資銀行 記憶ディスクにおける接着剤の延展方法

Also Published As

Publication number Publication date
EP0833315A3 (de) 2000-02-16
EP0833315B1 (de) 2004-11-24
EP0833315A2 (de) 1998-04-01
US5888433A (en) 1999-03-30
DE69731707T2 (de) 2006-03-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: KITANO CO.,LTD., KOMATSUSHIMA, TOKUSHIMA, JP

8339 Ceased/non-payment of the annual fee