DE69731245D1 - Herstellungsvorrichtung einer Hohlpackung - Google Patents

Herstellungsvorrichtung einer Hohlpackung

Info

Publication number
DE69731245D1
DE69731245D1 DE69731245T DE69731245T DE69731245D1 DE 69731245 D1 DE69731245 D1 DE 69731245D1 DE 69731245 T DE69731245 T DE 69731245T DE 69731245 T DE69731245 T DE 69731245T DE 69731245 D1 DE69731245 D1 DE 69731245D1
Authority
DE
Germany
Prior art keywords
manufacturing device
hollow pack
pack
hollow
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69731245T
Other languages
English (en)
Other versions
DE69731245T2 (de
DE69731245T8 (de
Inventor
Masatoshi Ohara
Takeo Ogihara
Satoshi Murata
Kenji Uchida
Tsutomu Kubota
Seiji Ichikawa
Tomoaki Hirokawa
Tomoaki Kimura
Taku Sato
Junichi Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
NEC Compound Semiconductor Devices Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=13532350&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69731245(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by NEC Compound Semiconductor Devices Ltd filed Critical NEC Compound Semiconductor Devices Ltd
Application granted granted Critical
Publication of DE69731245D1 publication Critical patent/DE69731245D1/de
Publication of DE69731245T2 publication Critical patent/DE69731245T2/de
Publication of DE69731245T8 publication Critical patent/DE69731245T8/de
Active legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/924—Active solid-state devices, e.g. transistors, solid-state diodes with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coating Apparatus (AREA)
  • Closing Of Containers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
DE69731245T 1996-03-28 1997-03-25 Herstellungsvorrichtung einer Hohlpackung Active DE69731245T8 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8073930A JP2970525B2 (ja) 1996-03-28 1996-03-28 中空パッケージの製造方法および中空パッケージ用製造装置
JP7393096 1996-03-28

Publications (3)

Publication Number Publication Date
DE69731245D1 true DE69731245D1 (de) 2004-11-25
DE69731245T2 DE69731245T2 (de) 2006-03-09
DE69731245T8 DE69731245T8 (de) 2006-06-08

Family

ID=13532350

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69731245T Active DE69731245T8 (de) 1996-03-28 1997-03-25 Herstellungsvorrichtung einer Hohlpackung

Country Status (8)

Country Link
US (1) US5904501A (de)
EP (1) EP0798764B1 (de)
JP (1) JP2970525B2 (de)
KR (1) KR100242037B1 (de)
AU (1) AU723032B2 (de)
CA (1) CA2201083C (de)
DE (1) DE69731245T8 (de)
TW (1) TW365058B (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6204093B1 (en) * 1997-08-21 2001-03-20 Micron Technology, Inc. Method and apparatus for applying viscous materials to a lead frame
EP3162454B1 (de) 2006-06-28 2019-04-24 Monsanto Technology LLC Verfahren zur sortierung kleiner objekte
US7568606B2 (en) * 2006-10-19 2009-08-04 Asm Technology Singapore Pte Ltd. Electronic device handler for a bonding apparatus
US9947560B1 (en) * 2016-11-22 2018-04-17 Xilinx, Inc. Integrated circuit package, and methods and tools for fabricating the same

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58166744A (ja) * 1982-03-26 1983-10-01 Sanyo Electric Co Ltd 混成集積回路の密封方法
US4946733A (en) * 1984-10-25 1990-08-07 Amoco Corporation Electric carrier devices and methods of manufacture
JPS6348378A (ja) 1986-08-19 1988-03-01 Fujitsu Ltd 部品部材接着組立方法
US4750665A (en) * 1986-11-21 1988-06-14 Indium Corporation Of America Method of producing a combination cover
JPS6466998A (en) 1987-09-08 1989-03-13 Hitachi Ltd Automatic component mounting machine
FR2636546B1 (fr) * 1988-09-15 1991-03-15 Sulzer Electro Tech Procede et dispositif pour l'application uniformement reguliere d'une couche de resine sur un substrat
EP0434392B1 (de) * 1989-12-19 1994-06-15 Fujitsu Limited Adhäsionsstruktur für Halbleiterbauelement und Verfahren zu ihrer Herstellung
JPH03220753A (ja) * 1990-01-25 1991-09-27 Murata Mfg Co Ltd 電子部品のパッケージング方法
US5056296A (en) * 1990-03-30 1991-10-15 R. J. R. Polymers, Inc. Iso-thermal seal process for electronic devices
JPH0590429A (ja) * 1991-09-27 1993-04-09 Nec Corp 半導体装置
JPH05261336A (ja) 1992-03-18 1993-10-12 Fujitsu Ltd 樹脂塗布方法
JPH06261336A (ja) * 1993-03-04 1994-09-16 Canon Inc ビデオ撮像装置
US5596171A (en) * 1993-05-21 1997-01-21 Harris; James M. Package for a high frequency semiconductor device and methods for fabricating and connecting the same to an external circuit
JPH06348378A (ja) * 1993-06-02 1994-12-22 Fujitsu Ltd レジスタ未使用ビット処理回路
JPH07212169A (ja) * 1994-01-21 1995-08-11 Nippon Carbide Ind Co Inc 電子素子用パッケージ

Also Published As

Publication number Publication date
KR100242037B1 (ko) 2000-02-01
JPH09266262A (ja) 1997-10-07
EP0798764A3 (de) 2002-06-12
CA2201083A1 (en) 1997-09-28
EP0798764B1 (de) 2004-10-20
JP2970525B2 (ja) 1999-11-02
KR970067779A (ko) 1997-10-13
DE69731245T2 (de) 2006-03-09
AU723032B2 (en) 2000-08-17
EP0798764A2 (de) 1997-10-01
DE69731245T8 (de) 2006-06-08
AU1651597A (en) 1997-10-02
US5904501A (en) 1999-05-18
CA2201083C (en) 2001-11-27
TW365058B (en) 1999-07-21

Similar Documents

Publication Publication Date Title
DE69842181D1 (de) Prüfung einer telekommunikationsvorrichtung
DE69734931D1 (de) Herstellung einer honigwabenstruktur
DE69534709D1 (de) Herstellungsverfahren einer Halbleiteranordnung
DE69508160T2 (de) Verbesserte mikromechanische Geräte
DE69524816D1 (de) Verbesserte mikromechanische Geräte
DE69824525D1 (de) Mantelgepumpte Faserstrukturen
DE69712346T2 (de) Zusammenbau einer handgelenkstütze
DE69535813D1 (de) Abspulvorrichtung
ID18017A (id) Perekat (adesif) sensitif-tekanan dengan sejumlah kecil stirena
FI955157A (fi) Mikrogyrometri
DE69500985D1 (de) Herstellungsverfahren einer verpackten Batterie
NO980373L (no) A/D omformingsapparat
DE69733202D1 (de) Eine multiwellenlängenreferenz
ATA136097A (de) Trägeranordnung einer gesimskappenschalung
DK100996A (da) Legetøjsbyggesæt
DE69731245D1 (de) Herstellungsvorrichtung einer Hohlpackung
NO964978D0 (no) Holdeanordning
DE59802828D1 (de) Wickelvorrichtung
NO995005D0 (no) En ny fremgangsmåte
DE29805110U1 (de) Abstützeinrichtung einer Aufschneidemaschine
DE69801327D1 (de) Herstellung einer zugring
DE29813365U1 (de) Preßvorrichtung einer Wickelmaschine
KR960003536U (ko) A/v기기의 버튼구조
FI945565A0 (fi) Käsiohjain
KR960015011U (ko) 가대

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: NEC ELECTRONICS CORP., KAWASAKI, KANAGAWA, JP

R082 Change of representative

Ref document number: 798764

Country of ref document: EP

Representative=s name: GLAWE DELFS MOLL - PARTNERSCHAFT VON PATENT- U, DE

R081 Change of applicant/patentee

Ref document number: 798764

Country of ref document: EP

Owner name: RENESAS ELECTRONICS CORPORATION, JP

Free format text: FORMER OWNER: NEC ELECTRONICS CORP., KAWASAKI, JP

Effective date: 20120828

R082 Change of representative

Ref document number: 798764

Country of ref document: EP

Representative=s name: GLAWE DELFS MOLL - PARTNERSCHAFT VON PATENT- U, DE

Effective date: 20120828