DE69730291D1 - Verfahren zum herstellen einer justiermarke in einer harzschablone und so hergestellte schablone - Google Patents

Verfahren zum herstellen einer justiermarke in einer harzschablone und so hergestellte schablone

Info

Publication number
DE69730291D1
DE69730291D1 DE69730291T DE69730291T DE69730291D1 DE 69730291 D1 DE69730291 D1 DE 69730291D1 DE 69730291 T DE69730291 T DE 69730291T DE 69730291 T DE69730291 T DE 69730291T DE 69730291 D1 DE69730291 D1 DE 69730291D1
Authority
DE
Germany
Prior art keywords
template
brand
adjustable
producing
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69730291T
Other languages
English (en)
Other versions
DE69730291T2 (de
Inventor
Eigo Sarashina
Yousuke Nagasawa
Ken Takahashi
Takao Naito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69730291D1 publication Critical patent/DE69730291D1/de
Application granted granted Critical
Publication of DE69730291T2 publication Critical patent/DE69730291T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/24—Stencils; Stencil materials; Carriers therefor
    • B41N1/248—Mechanical details, e.g. fixation holes, reinforcement or guiding means; Perforation lines; Ink holding means; Visually or otherwise detectable marking means; Stencil units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
    • B41C1/145—Forme preparation for stencil-printing or silk-screen printing by perforation using an energetic radiation beam, e.g. a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/945—Special, e.g. metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/975—Substrate or mask aligning feature
DE69730291T 1996-04-18 1997-04-16 Verfahren zum ausbilden einer bezugsmarkierung in einer harzschablone und die dabei hergestellte schablone Expired - Lifetime DE69730291T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP9708296 1996-04-18
JP8097082A JPH09283904A (ja) 1996-04-18 1996-04-18 樹脂スクリーンマスクの認識マーク作成方法
PCT/JP1997/001310 WO1997039609A1 (en) 1996-04-18 1997-04-16 Method for forming fiducial mark in resin stencil and stencil formed thereby

Publications (2)

Publication Number Publication Date
DE69730291D1 true DE69730291D1 (de) 2004-09-23
DE69730291T2 DE69730291T2 (de) 2005-09-01

Family

ID=14182728

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69730291T Expired - Lifetime DE69730291T2 (de) 1996-04-18 1997-04-16 Verfahren zum ausbilden einer bezugsmarkierung in einer harzschablone und die dabei hergestellte schablone

Country Status (7)

Country Link
US (1) US5948466A (de)
EP (1) EP0839439B1 (de)
JP (1) JPH09283904A (de)
KR (2) KR100272674B1 (de)
CN (1) CN1088322C (de)
DE (1) DE69730291T2 (de)
WO (1) WO1997039609A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW289901B (de) * 1994-12-28 1996-11-01 Ricoh Microelectronics Kk
TW342365B (en) * 1995-12-21 1998-10-11 Ricoh Microelectronics Kk A printing mask with a plastic printing plate and process for producing the same
US6373572B1 (en) * 1999-11-30 2002-04-16 Intel Corporation Method and apparatus for making and using an improved fiducial for an intergrated circuit
JP2004155185A (ja) * 2002-10-18 2004-06-03 Ngk Spark Plug Co Ltd はんだペースト印刷方法、はんだペースト印刷装置、はんだ印刷層を有する配線基板の製造方法
GB2421006B (en) * 2004-12-09 2008-09-03 Dek International Gmbh Printing screens
DE102006062269A1 (de) * 2006-12-22 2008-06-26 Eckart Gmbh & Co. Kg Verwendung von sphärischen Metallpartikeln als Lasermarkierungs- oder Laserschweißbarkeitsmittel sowie lasermarkierbarer und/oder laserschweißbarer Kunststoff
JP2010161095A (ja) * 2009-01-06 2010-07-22 Rohm Co Ltd 半導体装置の印字方法およびその印字方法が用いられて作製された半導体装置
CN103203977B (zh) * 2012-01-16 2016-10-05 昆山允升吉光电科技有限公司 带有定位点的电铸网板的制作方法
CN103203981B (zh) * 2012-01-16 2015-05-13 昆山允升吉光电科技有限公司 带有定位点的smt模板及其制造方法
JP6382580B2 (ja) * 2014-05-30 2018-08-29 株式会社ソノコム アライメントマークを有するスクリーン製版
CN104139533B (zh) * 2014-06-27 2017-01-25 南京航空航天大学 抑制微波固化碳纤维增强复合材料放电击穿的方法
CN106793534A (zh) * 2015-11-20 2017-05-31 富泰华工业（深圳）有限公司 电路板钢网印刷方法
KR20180072036A (ko) * 2016-12-20 2018-06-29 삼성전자주식회사 마스크 처리 장치 및 방법
CN110337193A (zh) * 2019-05-05 2019-10-15 天津光韵达光电科技有限公司 一种smt激光模板的mark点及其加工方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63216983A (ja) * 1987-03-03 1988-09-09 Seiko Instr & Electronics Ltd 難削加工部材への着色マ−キング製造方法
EP0359862A1 (de) * 1988-09-23 1990-03-28 Siemens Aktiengesellschaft Verfahren zum Herstellen von elektrischen Flachbaugruppen
JPH0577577A (ja) * 1991-09-18 1993-03-30 Hitachi Ltd 印刷マスク
JPH06250395A (ja) * 1993-02-26 1994-09-09 Murata Mfg Co Ltd 金属印刷刷版の製造方法
JPH07156569A (ja) * 1993-12-10 1995-06-20 Ricoh Co Ltd クリームハンダ用マスクおよびその製造方法
US5669970A (en) * 1995-06-02 1997-09-23 Mpm Corporation Stencil apparatus for applying solder paste
US5740730A (en) * 1996-09-03 1998-04-21 Micron Electronics, Inc. Apparatus for depositing solder and adhesive materials onto a printed circuit board
US5727461A (en) * 1997-02-06 1998-03-17 Amtx, Inc. Method of forming fiducials, and stencils containing such fiducials

Also Published As

Publication number Publication date
EP0839439B1 (de) 2004-08-18
KR100272674B1 (ko) 2001-01-15
CN1189287A (zh) 1998-07-29
WO1997039609A1 (en) 1997-10-23
KR19990021935A (ko) 1999-03-25
DE69730291T2 (de) 2005-09-01
KR100319795B1 (ko) 2002-01-12
US5948466A (en) 1999-09-07
CN1088322C (zh) 2002-07-24
EP0839439A1 (de) 1998-05-06
JPH09283904A (ja) 1997-10-31

Similar Documents

Publication Publication Date Title
DE59702885D1 (de) Vorrichtung und verfahren zum herstellen eines dreidimensionalen objektes
DE59408364D1 (de) Verfahren und vorrichtung zum herstellen eines dreidimensionalen objekts
DE59504444D1 (de) Verfahren und vorrichtung zum herstellen eines dreidimensionalen objektes
DE69735362D1 (de) Vorrichtung und verfahren zum herstellen eines beheizten sitzes
DE69727275D1 (de) Verfahren und Vorrichtung zum Herstellen einer Kunststofflinse
DE69702456D1 (de) Verfahren und Vorrichtung zum Herstellen einer Dosendeckelrille
DE69414292T2 (de) Verfahren und Vorrichtung zum Herstellen einer Speicherkarte
DE59305645D1 (de) Verfahren und vorrichtung zum herstellen eines dreidimensionalen objekts
DE59703324D1 (de) Verfahren zum Herstellen einer Messeinrichtung sowie danach hergestellte Messeinrichtung
DE59602684D1 (de) Vorrichtung und Verfahren zum Herstellen eines dreidimensionalen Objektes
DE59600002D1 (de) Vorrichtung und Verfahren zum Herstellen eines dreidimensionalen Objektes
DE69406366D1 (de) Verfahren und Vorrichtung zum Herstellen eines biologisch abbaubaren Schaumstoffs
DE69531000D1 (de) Verfahren und vorrichtung zum herstellen einer kontinuierlichen stoffbahn
DE69515447D1 (de) Verfahren und Vorrichtung zur Herstellung eines Flächenhaftverschluss
DE59506452D1 (de) Verfahren und Vorrichtung zum Herstellen eines kaschierten Formteiles
DE69730291D1 (de) Verfahren zum herstellen einer justiermarke in einer harzschablone und so hergestellte schablone
ATE176888T1 (de) Verfahren und vorrichtung zum herstellen einer streckfolie
ATE204529T1 (de) Verfahren und vorrichtung zum herstellen von kunststoffschaum
DE59406295D1 (de) Verfahren und vorrichtung zum herstellen eines längsfalzes
DE59503553D1 (de) Vorrichtung und verfahren zum herstellen einer spulenanordnung
DE59500643D1 (de) Verfahren und vorrichtung zum herstellen eines dreidimensionalen objektes
DE69523619T2 (de) Verfahren und vorrichtung zum herstellen einer schichtplatte
DE59700610D1 (de) Verfahren und Vorrichtung zum Herstellen einer Poly-V-Scheibe
DE59506694D1 (de) Verfahren zum herstellen von granulaten in einer wirbelschicht und vorrichtung zum durchführen des verfahrens
DE69608267T2 (de) Verfahren und vorrichtung zur herstellung einer schablone

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)