DE69724859D1 - Verfahren zur Herstellung von Kontakten auf einem Halbleiterbauelement - Google Patents
Verfahren zur Herstellung von Kontakten auf einem HalbleiterbauelementInfo
- Publication number
- DE69724859D1 DE69724859D1 DE69724859T DE69724859T DE69724859D1 DE 69724859 D1 DE69724859 D1 DE 69724859D1 DE 69724859 T DE69724859 T DE 69724859T DE 69724859 T DE69724859 T DE 69724859T DE 69724859 D1 DE69724859 D1 DE 69724859D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- making contacts
- contacts
- making
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76897—Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41775—Source or drain electrodes for field effect devices characterised by the proximity or the relative position of the source or drain electrode and the gate electrode, e.g. the source or drain electrode separated from the gate electrode by side-walls or spreading around or above the gate electrode
- H01L29/41783—Raised source or drain electrodes self aligned with the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
- H01L29/6659—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with both lightly doped source and drain extensions and source and drain self-aligned to the sides of the gate, e.g. lightly doped drain [LDD] MOSFET, double diffused drain [DDD] MOSFET
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP06675396A JP3215320B2 (ja) | 1996-03-22 | 1996-03-22 | 半導体装置の製造方法 |
JP6675396 | 1996-03-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69724859D1 true DE69724859D1 (de) | 2003-10-23 |
DE69724859T2 DE69724859T2 (de) | 2004-07-08 |
Family
ID=13324970
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69724859T Expired - Lifetime DE69724859T2 (de) | 1996-03-22 | 1997-03-24 | Verfahren zur Herstellung von Kontakten auf einem Halbleiterbauelement |
Country Status (5)
Country | Link |
---|---|
US (1) | US5863837A (de) |
EP (1) | EP0797250B1 (de) |
JP (1) | JP3215320B2 (de) |
KR (1) | KR100222185B1 (de) |
DE (1) | DE69724859T2 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6124189A (en) * | 1997-03-14 | 2000-09-26 | Kabushiki Kaisha Toshiba | Metallization structure and method for a semiconductor device |
US6080672A (en) | 1997-08-20 | 2000-06-27 | Micron Technology, Inc. | Self-aligned contact formation for semiconductor devices |
US6165910A (en) * | 1997-12-29 | 2000-12-26 | Lam Research Corporation | Self-aligned contacts for semiconductor device |
KR100276387B1 (ko) * | 1998-01-08 | 2000-12-15 | 윤종용 | 반도체 장치의 자기정렬 콘택 형성 방법 |
KR100284535B1 (ko) * | 1998-06-17 | 2001-04-02 | 윤종용 | 반도체장치의자기정렬콘택형성방법 |
KR100268443B1 (ko) * | 1998-08-29 | 2000-10-16 | 윤종용 | 반도체 장치의 자기 정렬 콘택 형성 방법 |
US6124172A (en) * | 1998-09-30 | 2000-09-26 | Advanced Micro Devices, Inc. | Method of making a semiconductor device having source/drain structures with self-aligned heavily-doped and lightly-doped regions |
KR100345069B1 (ko) * | 1999-06-30 | 2002-07-19 | 주식회사 하이닉스반도체 | 반도체 소자의 폴리실리콘 플러그 형성방법 |
US6445050B1 (en) | 2000-02-08 | 2002-09-03 | International Business Machines Corporation | Symmetric device with contacts self aligned to gate |
DE10332600B3 (de) * | 2003-07-17 | 2005-04-14 | Infineon Technologies Ag | Verfahren zum Herstellen eines elektrisch leitenden Kontaktes |
US8367509B1 (en) * | 2011-09-21 | 2013-02-05 | Nanya Technology Corporation | Self-aligned method for forming contact of device with reduced step height |
US9748356B2 (en) | 2012-09-25 | 2017-08-29 | Stmicroelectronics, Inc. | Threshold adjustment for quantum dot array devices with metal source and drain |
US9601630B2 (en) * | 2012-09-25 | 2017-03-21 | Stmicroelectronics, Inc. | Transistors incorporating metal quantum dots into doped source and drain regions |
US10002938B2 (en) | 2013-08-20 | 2018-06-19 | Stmicroelectronics, Inc. | Atomic layer deposition of selected molecular clusters |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4221045A (en) * | 1978-06-06 | 1980-09-09 | Rockwell International Corporation | Self-aligned contacts in an ion implanted VLSI circuit |
US4822754A (en) * | 1983-05-27 | 1989-04-18 | American Telephone And Telegraph Company, At&T Bell Laboratories | Fabrication of FETs with source and drain contacts aligned with the gate electrode |
US4737828A (en) * | 1986-03-17 | 1988-04-12 | General Electric Company | Method for gate electrode fabrication and symmetrical and non-symmetrical self-aligned inlay transistors made therefrom |
EP0422824A1 (de) * | 1989-10-12 | 1991-04-17 | AT&T Corp. | Feldeffekttransistor mit Fenster aus Polysilizium |
EP0478871B1 (de) * | 1990-10-01 | 2004-04-28 | SGS-THOMSON MICROELECTRONICS S.r.l. | Herstellung von Kontaktanschlüssen bei der alles überdeckenden CVD-Abscheidung und Rückätzen |
KR970007830B1 (ko) * | 1993-12-21 | 1997-05-17 | 현대전자산업 주식회사 | 반도체 장치 및 그 제조방법 |
-
1996
- 1996-03-22 JP JP06675396A patent/JP3215320B2/ja not_active Expired - Fee Related
-
1997
- 1997-03-21 US US08/822,921 patent/US5863837A/en not_active Expired - Lifetime
- 1997-03-22 KR KR1019970009978A patent/KR100222185B1/ko not_active IP Right Cessation
- 1997-03-24 DE DE69724859T patent/DE69724859T2/de not_active Expired - Lifetime
- 1997-03-24 EP EP97104967A patent/EP0797250B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5863837A (en) | 1999-01-26 |
JPH09260655A (ja) | 1997-10-03 |
EP0797250A2 (de) | 1997-09-24 |
EP0797250B1 (de) | 2003-09-17 |
DE69724859T2 (de) | 2004-07-08 |
KR100222185B1 (ko) | 1999-10-01 |
JP3215320B2 (ja) | 2001-10-02 |
EP0797250A3 (de) | 1999-05-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69023951D1 (de) | Verfahren zur Herstellung von Kontakten an einer Halbleitervorrichtung. | |
DE69727413D1 (de) | Verfahren zur Herstellung von einem vertikalen MOS-Halbleiterbauelement | |
DE69625045D1 (de) | VERFAHREN ZUR HERSTELLUNG VON EINEM AUF GaN-AlN BASIERTEN HOCHSPANNUNGSHALBLEITERBAUELEMENT UND HERGESTELLTES HALBLEITERBAUELEMENT | |
DE59610212D1 (de) | Schaltungseinheit und Verfahren zur Herstellung einer Schaltungseinheit | |
DE69528117D1 (de) | Verfahren zur Herstellung von Halbleiter-Anordnungen | |
DE59506266D1 (de) | Verfahren zur Herstellung einer vertikalen integrierten Schaltungsstruktur | |
DE59708146D1 (de) | Verfahren zur herstellung von polyalkoholen | |
DE69514201D1 (de) | Verfahren zur Herstellung eines Halbleiterbauelements | |
DE69618020D1 (de) | Verfahren zur herstellung von hydrofluorethern | |
DE69730738D1 (de) | Verfahren zur herstellung von polysilanen | |
DE69737783D1 (de) | Verfahren zur Herstellung eines Halbleiterspeicherbauteils | |
DE69416225D1 (de) | Verfahren zur Trockenätzung | |
DE69724859D1 (de) | Verfahren zur Herstellung von Kontakten auf einem Halbleiterbauelement | |
DE69525273D1 (de) | Verfahren zur Herstellung einer integrierten Schaltung | |
DE69014077D1 (de) | Elektrische Verbindereinrichtung und Verfahren zur Herstellung einer derartigen Verbindereinrichtung. | |
DE69517571D1 (de) | Verfahren zur Erkennung von Mustern | |
ATE194850T1 (de) | Verfahren zur herstellung von peroxiperfluoropolyxyalkylene | |
DE69529343D1 (de) | Verfahren zur isolierung von mesophasepech | |
DE59705109D1 (de) | Verfahren zur herstellung von arylcyanaten | |
DE69718134D1 (de) | Verfahren zur Herstellung einer hochintegrierten Schaltung | |
DE69606723D1 (de) | Verfahren zur herstellung von alkylenglykolen | |
DE69231268D1 (de) | Verfahren zur Trockenätzung | |
DE69615642D1 (de) | Verfahren zur Herstellung einer Halbleiteranordnung | |
DE69332496D1 (de) | Verfahren zur Dielektrikim-Entfernung | |
DE69730519D1 (de) | Verfahren zur herstellung von vernetzten maleinsäureanhydrid-copolymeren |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |