DE69717319T2 - Verfahren zur galvanischen herstellung eines rakels - Google Patents
Verfahren zur galvanischen herstellung eines rakelsInfo
- Publication number
- DE69717319T2 DE69717319T2 DE69717319T DE69717319T DE69717319T2 DE 69717319 T2 DE69717319 T2 DE 69717319T2 DE 69717319 T DE69717319 T DE 69717319T DE 69717319 T DE69717319 T DE 69717319T DE 69717319 T2 DE69717319 T2 DE 69717319T2
- Authority
- DE
- Germany
- Prior art keywords
- electroformed
- squeegee blade
- disclosed
- squeegee
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/14—Forme preparation for stencil-printing or silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/40—Inking units
- B41F15/42—Inking units comprising squeegees or doctors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N10/00—Blankets or like coverings; Coverings for wipers for intaglio printing
- B41N10/005—Coverings for wipers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/646,380 US5746127A (en) | 1996-05-03 | 1996-05-03 | Electroformed squeegee blade for surface mount screen printing |
PCT/US1997/007630 WO1997041969A1 (en) | 1996-05-03 | 1997-05-05 | Electroformed squeegee blade for surface mount screen printing |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69717319D1 DE69717319D1 (de) | 2003-01-02 |
DE69717319T2 true DE69717319T2 (de) | 2003-04-03 |
Family
ID=24592816
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69717319T Expired - Fee Related DE69717319T2 (de) | 1996-05-03 | 1997-05-05 | Verfahren zur galvanischen herstellung eines rakels |
Country Status (9)
Country | Link |
---|---|
US (1) | US5746127A (de) |
EP (1) | EP1015130B1 (de) |
AT (1) | ATE228037T1 (de) |
AU (1) | AU2933597A (de) |
DE (1) | DE69717319T2 (de) |
DK (1) | DK1015130T3 (de) |
ES (1) | ES2187777T3 (de) |
PT (1) | PT1015130E (de) |
WO (1) | WO1997041969A1 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2754474B1 (fr) * | 1996-10-15 | 1999-04-30 | Novatec | Dispositif pour le depot d'un produit visqueux ou pateux sur un substrat a travers les ouvertures d'un pochoir |
US6395335B2 (en) * | 1996-12-10 | 2002-05-28 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for printing solder paste |
US5947021A (en) * | 1997-11-04 | 1999-09-07 | Photo Stencil, Inc. | Metal squeegee blade with a titanium nitride coating |
TW409490B (en) * | 1998-12-31 | 2000-10-21 | World Wiser Electronics Inc | The equipment for plug hole process and the method thereof |
US6550662B2 (en) * | 2001-04-03 | 2003-04-22 | Kyocera Wireless Corporation | Chip rework solder tool |
US6659002B2 (en) * | 2001-10-31 | 2003-12-09 | International Business Machines Corporation | Screening apparatus with trailing squeegee and method of screening |
EP1780034B1 (de) * | 2002-09-24 | 2008-09-10 | Matsushita Electric Industrial Co., Ltd. | Druckplatte, Leiterplatte und Druckverfahren für eine Leiterplatte |
US7726239B2 (en) * | 2005-08-24 | 2010-06-01 | Seagate Technology Llc | Controlled deposition of printing material |
US20070232055A1 (en) * | 2006-03-31 | 2007-10-04 | Richard Earl Corley | Methods and Apparatuses for Applying a Protective Material to an Interconnect Associated with a Component |
US20130213247A1 (en) * | 2012-02-17 | 2013-08-22 | Samsung Electronics Co., Ltd. | Stencil apparatus for printing solder paste |
CN103287063B (zh) * | 2012-02-29 | 2015-11-18 | 三星电子株式会社 | 用于印刷焊膏的漏印板设备 |
RU2700870C2 (ru) | 2013-12-31 | 2019-09-23 | Джонсон энд Джонсон Консьюмер Инк. | Способ формования пленочного продукта |
AU2014374104B2 (en) | 2013-12-31 | 2020-02-20 | Johnson & Johnson Consumer Inc. | Process for forming a multi layered shaped film |
AU2014374017B2 (en) | 2013-12-31 | 2018-09-13 | Johnson & Johnson Consumer Inc. | Single-pass process for forming a multilayered shaped film product |
WO2019234820A1 (ja) * | 2018-06-05 | 2019-12-12 | ヤマハ発動機株式会社 | 印刷装置 |
US10960607B2 (en) * | 2018-12-13 | 2021-03-30 | General Electric Company | Systems and methods for monitoring powder spreading in additive manufacturing systems |
TWI698287B (zh) * | 2019-08-27 | 2020-07-11 | 華碩電腦股份有限公司 | 液態金屬散熱膏塗佈方法及使用液態金屬散熱膏的散熱模組 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3930455A (en) * | 1974-09-19 | 1976-01-06 | Harry Bremer | Boat hull construction |
JPH0288787A (ja) * | 1988-09-27 | 1990-03-28 | Matsushita Electric Works Ltd | 電鋳刃 |
US5078082A (en) * | 1989-08-16 | 1992-01-07 | Smt East Corporation | Method and apparatus for applying bonding material to a populated mounting surface |
US5044306A (en) * | 1990-06-11 | 1991-09-03 | Gunter Erdmann | Solder applying mechanism |
JP3004416B2 (ja) * | 1991-09-13 | 2000-01-31 | 理想科学工業株式会社 | 孔版印刷装置のインキ供給用スキージ装置 |
JP3025361B2 (ja) * | 1992-02-07 | 2000-03-27 | 理想科学工業株式会社 | 孔版印刷装置のブレード式スキージ装置 |
US5478699A (en) * | 1992-03-12 | 1995-12-26 | Amtx, Inc. | Method for preparing a screen printing stencil |
US5254362A (en) * | 1992-10-23 | 1993-10-19 | Motorola, Inc. | Method and apparatus for deposition of solder paste on a printed wiring board |
US5387044A (en) * | 1993-12-15 | 1995-02-07 | Accardo; Thomas A. | Screen filler applicator for the screen printing industry |
-
1996
- 1996-05-03 US US08/646,380 patent/US5746127A/en not_active Expired - Lifetime
-
1997
- 1997-05-05 EP EP97923561A patent/EP1015130B1/de not_active Expired - Lifetime
- 1997-05-05 WO PCT/US1997/007630 patent/WO1997041969A1/en active IP Right Grant
- 1997-05-05 DE DE69717319T patent/DE69717319T2/de not_active Expired - Fee Related
- 1997-05-05 AU AU29335/97A patent/AU2933597A/en not_active Abandoned
- 1997-05-05 PT PT97923561T patent/PT1015130E/pt unknown
- 1997-05-05 ES ES97923561T patent/ES2187777T3/es not_active Expired - Lifetime
- 1997-05-05 DK DK97923561T patent/DK1015130T3/da active
- 1997-05-05 AT AT97923561T patent/ATE228037T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO1997041969A1 (en) | 1997-11-13 |
DE69717319D1 (de) | 2003-01-02 |
ES2187777T3 (es) | 2003-06-16 |
EP1015130B1 (de) | 2002-11-20 |
EP1015130A4 (de) | 2000-07-05 |
US5746127A (en) | 1998-05-05 |
EP1015130A1 (de) | 2000-07-05 |
ATE228037T1 (de) | 2002-12-15 |
DK1015130T3 (da) | 2003-03-17 |
PT1015130E (pt) | 2003-03-31 |
AU2933597A (en) | 1997-11-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69717319T2 (de) | Verfahren zur galvanischen herstellung eines rakels | |
DE69842001D1 (de) | Galvanisches verfahren zur herstellung einer mehrlagenstruktur | |
DE59503657D1 (de) | Verfahren zur strukturierten Metallisierung der Oberfläche von Substraten | |
EP0186185A3 (de) | Kontinuierliches Verfahren zur Herstellung metallischer Muster auf einem Dunnfilmsubstrat | |
EP0850758A3 (de) | Herstellung einer Siebdruckschablone mit erhöhten Kanten | |
US4651417A (en) | Method for forming printed circuit board | |
EP0255557A3 (de) | Verfahren zur Bildung von metallischen Bildern | |
DE59801021D1 (de) | Wässriges bad und verfahren zum elektrolytischen abscheiden von kupferschichten | |
DE69834548D1 (de) | Ein elektrolytisch verfahren zur herstellung einer ein mineral enthaltende beschichtung | |
ATE385398T1 (de) | Verfahren zur herstellung von starren und flexiblen schaltungen | |
AU748566C (en) | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method | |
EP0402315A3 (de) | Verfahren zur Herstellung eines metallischen Musters auf einem Substrat | |
DE59004525D1 (de) | Verfahren zur beschichtung elektrisch leitfähiger substrate. | |
JPS59215790A (ja) | 印刷回路板の製造法 | |
ATE162923T1 (de) | Verfahren zur herstellung einer leiterplatte. | |
EP0820095A3 (de) | Herstellungsverfahren für eine Zwischenschicht | |
JPH10250032A (ja) | 印刷用メタルマスク | |
JP3517286B2 (ja) | 電着転写用原版およびその製造方法 | |
GB2217918A (en) | Method of manufacturing printed circuit boards | |
JPS61124600A (ja) | フレ−ムパタ−ンの形成方法 | |
JPH01257395A (ja) | 印刷回路基板の製造方法 | |
JPH0579197B2 (de) | ||
SU641684A1 (ru) | Способ металлизации отверстий в платах | |
JPH046261A (ja) | 装飾板の製造方法 | |
JPH0695485B2 (ja) | 電子部品の被覆方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |