ATE228037T1 - Verfahren zur galvanischen herstellung eines rakels - Google Patents
Verfahren zur galvanischen herstellung eines rakelsInfo
- Publication number
- ATE228037T1 ATE228037T1 AT97923561T AT97923561T ATE228037T1 AT E228037 T1 ATE228037 T1 AT E228037T1 AT 97923561 T AT97923561 T AT 97923561T AT 97923561 T AT97923561 T AT 97923561T AT E228037 T1 ATE228037 T1 AT E228037T1
- Authority
- AT
- Austria
- Prior art keywords
- electroformed
- squeegee blade
- disclosed
- squeegee
- printed wiring
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/14—Forme preparation for stencil-printing or silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/40—Inking units
- B41F15/42—Inking units comprising squeegees or doctors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N10/00—Blankets or like coverings; Coverings for wipers for intaglio printing
- B41N10/005—Coverings for wipers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Physical Vapour Deposition (AREA)
- Electrolytic Production Of Metals (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/646,380 US5746127A (en) | 1996-05-03 | 1996-05-03 | Electroformed squeegee blade for surface mount screen printing |
PCT/US1997/007630 WO1997041969A1 (en) | 1996-05-03 | 1997-05-05 | Electroformed squeegee blade for surface mount screen printing |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE228037T1 true ATE228037T1 (de) | 2002-12-15 |
Family
ID=24592816
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT97923561T ATE228037T1 (de) | 1996-05-03 | 1997-05-05 | Verfahren zur galvanischen herstellung eines rakels |
Country Status (9)
Country | Link |
---|---|
US (1) | US5746127A (de) |
EP (1) | EP1015130B1 (de) |
AT (1) | ATE228037T1 (de) |
AU (1) | AU2933597A (de) |
DE (1) | DE69717319T2 (de) |
DK (1) | DK1015130T3 (de) |
ES (1) | ES2187777T3 (de) |
PT (1) | PT1015130E (de) |
WO (1) | WO1997041969A1 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2754474B1 (fr) * | 1996-10-15 | 1999-04-30 | Novatec | Dispositif pour le depot d'un produit visqueux ou pateux sur un substrat a travers les ouvertures d'un pochoir |
EP0848586B1 (de) * | 1996-12-10 | 2007-01-24 | Matsushita Electric Industrial Co., Ltd. | Vorrichtung und Verfahren zum Drucken von Lötpaste |
US5947021A (en) * | 1997-11-04 | 1999-09-07 | Photo Stencil, Inc. | Metal squeegee blade with a titanium nitride coating |
TW409490B (en) * | 1998-12-31 | 2000-10-21 | World Wiser Electronics Inc | The equipment for plug hole process and the method thereof |
US6550662B2 (en) * | 2001-04-03 | 2003-04-22 | Kyocera Wireless Corporation | Chip rework solder tool |
US6659002B2 (en) * | 2001-10-31 | 2003-12-09 | International Business Machines Corporation | Screening apparatus with trailing squeegee and method of screening |
EP1428677B1 (de) * | 2002-09-24 | 2007-04-04 | Matsushita Electric Industrial Co., Ltd. | Druckplatte, leiterplatte und verfahren zum drucken einer leiterplatte |
US7726239B2 (en) * | 2005-08-24 | 2010-06-01 | Seagate Technology Llc | Controlled deposition of printing material |
US20070232055A1 (en) * | 2006-03-31 | 2007-10-04 | Richard Earl Corley | Methods and Apparatuses for Applying a Protective Material to an Interconnect Associated with a Component |
US20130213247A1 (en) * | 2012-02-17 | 2013-08-22 | Samsung Electronics Co., Ltd. | Stencil apparatus for printing solder paste |
CN103287063B (zh) * | 2012-02-29 | 2015-11-18 | 三星电子株式会社 | 用于印刷焊膏的漏印板设备 |
WO2015103030A1 (en) | 2013-12-31 | 2015-07-09 | Johnson & Johnson Consumer Companies, Inc. | Process for forming a multi layered shaped film |
KR102226590B1 (ko) | 2013-12-31 | 2021-03-12 | 존슨 앤드 존슨 컨수머 인코포레이티드 | 형상화된 필름 제품을 형성하기 위한 방법 |
RU2676288C2 (ru) | 2013-12-31 | 2018-12-27 | Джонсон энд Джонсон Консьюмер Инк. | Способ формирования многослойного формованного пленочного продукта в один проход |
CN112105504B (zh) | 2018-06-05 | 2021-12-21 | 雅马哈发动机株式会社 | 印刷装置 |
US10960607B2 (en) * | 2018-12-13 | 2021-03-30 | General Electric Company | Systems and methods for monitoring powder spreading in additive manufacturing systems |
TWI698287B (zh) * | 2019-08-27 | 2020-07-11 | 華碩電腦股份有限公司 | 液態金屬散熱膏塗佈方法及使用液態金屬散熱膏的散熱模組 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3930455A (en) * | 1974-09-19 | 1976-01-06 | Harry Bremer | Boat hull construction |
JPH0288787A (ja) * | 1988-09-27 | 1990-03-28 | Matsushita Electric Works Ltd | 電鋳刃 |
US5078082A (en) * | 1989-08-16 | 1992-01-07 | Smt East Corporation | Method and apparatus for applying bonding material to a populated mounting surface |
US5044306A (en) * | 1990-06-11 | 1991-09-03 | Gunter Erdmann | Solder applying mechanism |
JP3004416B2 (ja) * | 1991-09-13 | 2000-01-31 | 理想科学工業株式会社 | 孔版印刷装置のインキ供給用スキージ装置 |
JP3025361B2 (ja) * | 1992-02-07 | 2000-03-27 | 理想科学工業株式会社 | 孔版印刷装置のブレード式スキージ装置 |
US5478699A (en) * | 1992-03-12 | 1995-12-26 | Amtx, Inc. | Method for preparing a screen printing stencil |
US5254362A (en) * | 1992-10-23 | 1993-10-19 | Motorola, Inc. | Method and apparatus for deposition of solder paste on a printed wiring board |
US5387044A (en) * | 1993-12-15 | 1995-02-07 | Accardo; Thomas A. | Screen filler applicator for the screen printing industry |
-
1996
- 1996-05-03 US US08/646,380 patent/US5746127A/en not_active Expired - Lifetime
-
1997
- 1997-05-05 ES ES97923561T patent/ES2187777T3/es not_active Expired - Lifetime
- 1997-05-05 PT PT97923561T patent/PT1015130E/pt unknown
- 1997-05-05 DK DK97923561T patent/DK1015130T3/da active
- 1997-05-05 WO PCT/US1997/007630 patent/WO1997041969A1/en active IP Right Grant
- 1997-05-05 DE DE69717319T patent/DE69717319T2/de not_active Expired - Fee Related
- 1997-05-05 EP EP97923561A patent/EP1015130B1/de not_active Expired - Lifetime
- 1997-05-05 AT AT97923561T patent/ATE228037T1/de not_active IP Right Cessation
- 1997-05-05 AU AU29335/97A patent/AU2933597A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO1997041969A1 (en) | 1997-11-13 |
DK1015130T3 (da) | 2003-03-17 |
DE69717319D1 (de) | 2003-01-02 |
ES2187777T3 (es) | 2003-06-16 |
DE69717319T2 (de) | 2003-04-03 |
EP1015130B1 (de) | 2002-11-20 |
AU2933597A (en) | 1997-11-26 |
EP1015130A1 (de) | 2000-07-05 |
PT1015130E (pt) | 2003-03-31 |
US5746127A (en) | 1998-05-05 |
EP1015130A4 (de) | 2000-07-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
UEP | Publication of translation of european patent specification |
Ref document number: 1015130 Country of ref document: EP |
|
REN | Ceased due to non-payment of the annual fee |