JPH0579197B2 - - Google Patents
Info
- Publication number
- JPH0579197B2 JPH0579197B2 JP61202048A JP20204886A JPH0579197B2 JP H0579197 B2 JPH0579197 B2 JP H0579197B2 JP 61202048 A JP61202048 A JP 61202048A JP 20204886 A JP20204886 A JP 20204886A JP H0579197 B2 JPH0579197 B2 JP H0579197B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- film
- engineering plastic
- thin film
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 229910052802 copper Inorganic materials 0.000 claims description 22
- 239000010949 copper Substances 0.000 claims description 22
- 239000010408 film Substances 0.000 claims description 16
- 239000010409 thin film Substances 0.000 claims description 15
- 238000000576 coating method Methods 0.000 claims description 9
- 238000004070 electrodeposition Methods 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000010884 ion-beam technique Methods 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 claims 1
- 229920006351 engineering plastic Polymers 0.000 description 24
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 239000011889 copper foil Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20204886A JPS6356987A (ja) | 1986-08-27 | 1986-08-27 | プリント配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20204886A JPS6356987A (ja) | 1986-08-27 | 1986-08-27 | プリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6356987A JPS6356987A (ja) | 1988-03-11 |
| JPH0579197B2 true JPH0579197B2 (de) | 1993-11-01 |
Family
ID=16451067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20204886A Granted JPS6356987A (ja) | 1986-08-27 | 1986-08-27 | プリント配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6356987A (de) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55148491A (en) * | 1979-05-09 | 1980-11-19 | Meidensha Electric Mfg Co Ltd | Method of fabricating printed circuit board |
| JPS5670684A (en) * | 1979-11-14 | 1981-06-12 | Seikoo Keiyo Kogyo Kk | Circuit board and method of manufacturig same |
| JPS57184282A (en) * | 1981-05-08 | 1982-11-12 | Matsushita Electric Works Ltd | Board for printed circuit substrate |
| JPS5877285A (ja) * | 1981-11-02 | 1983-05-10 | 松下電工株式会社 | プリント配線板の製造方法 |
-
1986
- 1986-08-27 JP JP20204886A patent/JPS6356987A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55148491A (en) * | 1979-05-09 | 1980-11-19 | Meidensha Electric Mfg Co Ltd | Method of fabricating printed circuit board |
| JPS5670684A (en) * | 1979-11-14 | 1981-06-12 | Seikoo Keiyo Kogyo Kk | Circuit board and method of manufacturig same |
| JPS57184282A (en) * | 1981-05-08 | 1982-11-12 | Matsushita Electric Works Ltd | Board for printed circuit substrate |
| JPS5877285A (ja) * | 1981-11-02 | 1983-05-10 | 松下電工株式会社 | プリント配線板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6356987A (ja) | 1988-03-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |