DE69713879D1 - Transporteinrichtung für flache gegenstände und verfahren zum transferieren dieser gegenstände zwischen dieser einrichtung und einem behandlungsapparat - Google Patents

Transporteinrichtung für flache gegenstände und verfahren zum transferieren dieser gegenstände zwischen dieser einrichtung und einem behandlungsapparat

Info

Publication number
DE69713879D1
DE69713879D1 DE69713879T DE69713879T DE69713879D1 DE 69713879 D1 DE69713879 D1 DE 69713879D1 DE 69713879 T DE69713879 T DE 69713879T DE 69713879 T DE69713879 T DE 69713879T DE 69713879 D1 DE69713879 D1 DE 69713879D1
Authority
DE
Germany
Prior art keywords
objects
transferring
treatment apparatus
flat
transportation device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69713879T
Other languages
English (en)
Other versions
DE69713879T2 (de
Inventor
Claude Doche
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of DE69713879D1 publication Critical patent/DE69713879D1/de
Application granted granted Critical
Publication of DE69713879T2 publication Critical patent/DE69713879T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging For Recording Disks (AREA)
DE69713879T 1996-04-03 1997-04-02 Transporteinrichtung für flache gegenstände und verfahren zum transferieren dieser gegenstände zwischen dieser einrichtung und einem behandlungsapparat Expired - Fee Related DE69713879T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9604173A FR2747112B1 (fr) 1996-04-03 1996-04-03 Dispositif de transport d'objets plats et procede de transfert de ces objets entre ledit dispositif et une machine de traitement
PCT/FR1997/000587 WO1997038439A1 (fr) 1996-04-03 1997-04-02 Dispositif de transport d'objets plats et procede de transfert de ces objets entre ledit dispositif et une machine de traitement

Publications (2)

Publication Number Publication Date
DE69713879D1 true DE69713879D1 (de) 2002-08-14
DE69713879T2 DE69713879T2 (de) 2003-02-27

Family

ID=9490859

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69713879T Expired - Fee Related DE69713879T2 (de) 1996-04-03 1997-04-02 Transporteinrichtung für flache gegenstände und verfahren zum transferieren dieser gegenstände zwischen dieser einrichtung und einem behandlungsapparat

Country Status (6)

Country Link
US (1) US6176023B1 (de)
EP (1) EP0892985B1 (de)
JP (1) JP2001516500A (de)
DE (1) DE69713879T2 (de)
FR (1) FR2747112B1 (de)
WO (1) WO1997038439A1 (de)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5879458A (en) * 1996-09-13 1999-03-09 Semifab Incorporated Molecular contamination control system
FR2779421B1 (fr) 1998-06-08 2000-08-18 Incam Solutions Dispositif adaptateur pour des boites de confinement d'au moins un objet plat sous atmosphere ultrapropre
US6042324A (en) * 1999-03-26 2000-03-28 Asm America, Inc. Multi-stage single-drive FOUP door system
FR2802335B1 (fr) * 1999-12-09 2002-04-05 Cit Alcatel Systeme et procede de controle de minienvironnement
US6631935B1 (en) * 2000-08-04 2003-10-14 Tru-Si Technologies, Inc. Detection and handling of semiconductor wafer and wafer-like objects
JP2002096013A (ja) * 2000-09-26 2002-04-02 Fujitsu Ltd 樹脂塗布方法
US6901971B2 (en) * 2001-01-10 2005-06-07 Entegris, Inc. Transportable container including an internal environment monitor
US6615113B2 (en) 2001-07-13 2003-09-02 Tru-Si Technologies, Inc. Articles holders with sensors detecting a type of article held by the holder
US6638004B2 (en) 2001-07-13 2003-10-28 Tru-Si Technologies, Inc. Article holders and article positioning methods
US6935830B2 (en) * 2001-07-13 2005-08-30 Tru-Si Technologies, Inc. Alignment of semiconductor wafers and other articles
JP3960787B2 (ja) * 2001-11-30 2007-08-15 信越ポリマー株式会社 精密基板収納容器
US7121414B2 (en) * 2001-12-28 2006-10-17 Brooks Automation, Inc. Semiconductor cassette reducer
US7363777B2 (en) * 2004-03-05 2008-04-29 Corning Incorporated Closed cassette and method for heat treating glass sheets
TWI247974B (en) * 2004-03-11 2006-01-21 Gudeng Prec Ind Co Ltd Optical mask positioning device
US7611319B2 (en) * 2004-06-16 2009-11-03 Applied Materials, Inc. Methods and apparatus for identifying small lot size substrate carriers
KR20070048649A (ko) * 2004-09-04 2007-05-09 어플라이드 머티어리얼스, 인코포레이티드 높이가 감소된 기판 캐리어
US7771563B2 (en) 2004-11-18 2010-08-10 Sumitomo Precision Products Co., Ltd. Systems and methods for achieving isothermal batch processing of substrates used for the production of micro-electro-mechanical-systems
AU2006216509B8 (en) * 2005-02-24 2012-11-01 Technion Research And Development Foundation Ltd Formulations of ladostigil tartrate
TWI399823B (zh) * 2005-07-09 2013-06-21 Tec Sem Ag 用以存放基板之裝置
WO2007061604A2 (en) * 2005-11-21 2007-05-31 Applied Materials, Inc. Apparatus and methods for a substrate carrier having an inflatable seal
US20070141280A1 (en) * 2005-12-16 2007-06-21 Applied Materials, Inc. Substrate carrier having an interior lining
CN101461026B (zh) * 2006-06-07 2012-01-18 Fei公司 与包含真空室的装置一起使用的滑动轴承
US8598524B2 (en) 2006-06-07 2013-12-03 Fei Company Slider bearing for use with an apparatus comprising a vacuum chamber
JP4367440B2 (ja) * 2006-06-14 2009-11-18 村田機械株式会社 搬送システム
WO2008008738A2 (en) * 2006-07-10 2008-01-17 Asyst Technologies, Inc. Variable lot size load port
US8297319B2 (en) * 2006-09-14 2012-10-30 Brooks Automation, Inc. Carrier gas system and coupling substrate carrier to a loadport
TWI475627B (zh) * 2007-05-17 2015-03-01 Brooks Automation Inc 基板運送機、基板處理裝置和系統、於基板處理期間降低基板之微粒污染的方法，及使運送機與處理機結合之方法
KR101687836B1 (ko) 2008-03-13 2016-12-19 엔테그리스, 아이엔씨. 관형 환경 제어 요소를 갖는 웨이퍼 용기
FR2963327B1 (fr) * 2010-07-27 2012-08-24 Air Liquide Dispositif de stockage d'articles sous atmosphere controlee
KR101147192B1 (ko) * 2011-11-11 2012-05-25 주식회사 엘에스테크 웨이퍼 표면상의 증착 이물 제거 장치
CN104221136B (zh) 2012-04-16 2017-05-31 日商乐华股份有限公司 收纳容器、收纳容器的开闭器开闭单元、及使用它们的晶圆储料器
US9841671B2 (en) * 2013-07-03 2017-12-12 Murata Machinery, Ltd. Storage container
US9837293B2 (en) 2013-10-30 2017-12-05 Taiwan Semiconductor Manufacturing Co., Ltd. Mechanisms for charging gas into cassette pod
CN110120360B (zh) 2014-12-11 2023-01-13 瑞士艾发科技 用于衬底脱气的室
KR101670382B1 (ko) * 2015-03-10 2016-10-28 우범제 퍼지가스 분사 플레이트 및 그 제조 방법
JP6554872B2 (ja) * 2015-03-31 2019-08-07 Tdk株式会社 ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法
JP6800237B2 (ja) * 2016-03-08 2020-12-16 エヴァテック・アーゲー 基板を脱ガスするためのチャンバ
JP7048885B2 (ja) * 2018-03-15 2022-04-06 シンフォニアテクノロジー株式会社 Ｅｆｅｍ
US12027397B2 (en) 2020-03-23 2024-07-02 Applied Materials, Inc Enclosure system shelf including alignment features
USD954769S1 (en) * 2020-06-02 2022-06-14 Applied Materials, Inc. Enclosure system shelf
CN112013655A (zh) * 2020-08-18 2020-12-01 涌明科技(上海)有限公司 一种半导体芯片烘烤装置
JP7465855B2 (ja) * 2021-09-27 2024-04-11 芝浦メカトロニクス株式会社 加熱処理装置、搬入搬出治具、および有機膜の形成方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4682927A (en) * 1982-09-17 1987-07-28 Nacom Industries, Incorporated Conveyor system
ES2054357T3 (es) * 1989-05-08 1994-08-01 Philips Nv Aparato y metodo para tratar substratos planos bajo una presion reducida.
DE4024973C2 (de) 1990-08-07 1994-11-03 Ibm Anordnung zum Lagern, Transportieren und Einschleusen von Substraten
US5169272A (en) * 1990-11-01 1992-12-08 Asyst Technologies, Inc. Method and apparatus for transferring articles between two controlled environments
FR2697003B1 (fr) * 1992-10-16 1994-11-18 Commissariat Energie Atomique Système de manipulation et de confinement d'objets plats dans des boîtes individuelles.
EP0552756A1 (de) * 1992-01-21 1993-07-28 Shinko Electric Co. Ltd. Artikel-Lager in Reinraum
JP3191392B2 (ja) * 1992-04-07 2001-07-23 神鋼電機株式会社 クリーンルーム用密閉式コンテナ
US5351415A (en) * 1992-05-18 1994-10-04 Convey, Inc. Method and apparatus for maintaining clean articles
KR100304127B1 (ko) * 1992-07-29 2001-11-30 이노마다 시게오 가반식 밀폐 컨테이너를 사용한 전자기판 처리시스템과 그의 장치
EP0582018B1 (de) * 1992-08-04 1995-10-18 International Business Machines Corporation Unter Druck stehende Koppelsysteme zum Transferieren von einem Halbleiterwafer zwischen einem tragbaren abdichtbaren unter druckstehenden Behälter und einer Bearbeitungsanlage
ES2078718T3 (es) * 1992-08-04 1995-12-16 Ibm Estructuras de cadenas de fabricacion a base de transportadores totalmente automatizados e informatizados adaptados a recipientes transportables estancos a presion.
EP0582016B1 (de) * 1992-08-04 1997-04-23 International Business Machines Corporation Tragbare abdichtbare unter Druck stehende Behältern zum Speichern von Halbleiterwafern in einer Schützenden gasartigen Umgebung
ATE129359T1 (de) * 1992-08-04 1995-11-15 Ibm Verteilungseinrichtung mit gaszufuhr- abgabevorrichtung zum handhaben und speichern von abdichtbaren tragbaren unter druck stehenden behältern.
US5295522A (en) * 1992-09-24 1994-03-22 International Business Machines Corporation Gas purge system for isolation enclosure for contamination sensitive items
FR2697000B1 (fr) * 1992-10-16 1994-11-25 Commissariat Energie Atomique Boîte plate de confinement d'un objet plat sous atmosphère spéciale.
FR2697004B1 (fr) * 1992-10-16 1994-11-18 Commissariat Energie Atomique Système de stockage et de transport d'objets plats tels que des boîtes extra-plates et son ratelier portatif.
US5346518A (en) * 1993-03-23 1994-09-13 International Business Machines Corporation Vapor drain system
US5440822A (en) * 1993-07-16 1995-08-15 Novel Experimental Technology Method and apparatus for drying electrophoresis gels
US5538390A (en) * 1993-10-29 1996-07-23 Applied Materials, Inc. Enclosure for load lock interface
US5570987A (en) * 1993-12-14 1996-11-05 W. L. Gore & Associates, Inc. Semiconductor wafer transport container
US5544421A (en) * 1994-04-28 1996-08-13 Semitool, Inc. Semiconductor wafer processing system
JP3073886B2 (ja) * 1994-05-30 2000-08-07 大日本スクリーン製造株式会社 基板の熱処理装置
US5810537A (en) * 1995-10-18 1998-09-22 Bye/Oasis Engineering Inc. Isolation chamber transfer apparatus
US5756157A (en) * 1996-10-02 1998-05-26 Silicon Valley Group Method for processing flat panel displays and large wafers

Also Published As

Publication number Publication date
WO1997038439A1 (fr) 1997-10-16
FR2747112A1 (fr) 1997-10-10
JP2001516500A (ja) 2001-09-25
FR2747112B1 (fr) 1998-05-07
EP0892985A1 (de) 1999-01-27
US6176023B1 (en) 2001-01-23
EP0892985B1 (de) 2002-07-10
DE69713879T2 (de) 2003-02-27

Similar Documents

Publication Publication Date Title
DE69713879D1 (de) Transporteinrichtung für flache gegenstände und verfahren zum transferieren dieser gegenstände zwischen dieser einrichtung und einem behandlungsapparat
DE69314802D1 (de) Verfahren und vorrichtung zum verdichten
DE69633771D1 (de) Verfahren und gerät zum kontaktieren
DE59508637D1 (de) Verfahren und Vorrichtung zum Stapeln
DE69423521D1 (de) Verfahren und vorrichtung zum plazieren mehrerer komponenten auf einem sich bewegenden materialbahn
DE69716493D1 (de) Verfahren und Vorrichtung zum Aufwickeln
DE69210461D1 (de) Verfahren und Vorrichtung zum Einwickeln
DE59606087D1 (de) Verfahren und einrichtung zum kommissionieren
DE69727113D1 (de) Vorrichtung und Verfahren zum Reinigen
DE69735371D1 (de) Verfahren und vorrichtung zum verbinden zweier rohre
DE69322695D1 (de) Verfahren und vorrichtung zum gefrieren
DE69715254D1 (de) Vorrichtung und Verfahren zum Reinigen
DE69724325D1 (de) Verfahren und Einrichtung zum Auswählen der optimalen Fähigkeit zwischen einem Computersystem und einem Peripheriegerät
DE69739337D1 (de) Apparat und verfahren zum zeichnen
DE59601324D1 (de) Verfahren und Vorrichtung zum Depalettieren
DE69530055D1 (de) System und Verfahren zum Versetzen einer Flüssigkeit zwischen einem Behälter und einem zugeordneten Apparat zur Verwendung der Flüssigkeit
DE59507256D1 (de) Verfahren und vorrichtung zum schleifen von nocken mit konkaven flanken
DE69412447D1 (de) Verfahren und Vorrichtung zum Biegen von Rohren
DE69500725D1 (de) Verfahren und Gerät zum Löten
DE69730069D1 (de) Verfahren und Vorrichtung zum Herstellen von aneinanderliegenden und verbundenen Rohren
DE69729779D1 (de) Verfahren und Vorrichtung zum Polieren
DE69515535D1 (de) Verfahren und Vorrichtung zum Bildvergleich
DE69519147D1 (de) Verfahren und vorrichtung zum einführen von flachen trennelementen zwischen artikeln
DE69933435D1 (de) Apparat und verfahren zum übermitteln von dokumenten zwischen einem server-rechner und einem benutzer-rechner
DE69712945D1 (de) Vorrichtung und Verfahren zum Umschlagen von Reifenbestandteilen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee