DE69707624T2 - Apparat zur Inspektion von Leiterplatten - Google Patents

Apparat zur Inspektion von Leiterplatten

Info

Publication number
DE69707624T2
DE69707624T2 DE69707624T DE69707624T DE69707624T2 DE 69707624 T2 DE69707624 T2 DE 69707624T2 DE 69707624 T DE69707624 T DE 69707624T DE 69707624 T DE69707624 T DE 69707624T DE 69707624 T2 DE69707624 T2 DE 69707624T2
Authority
DE
Germany
Prior art keywords
inspection
printed circuit
circuit boards
boards
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69707624T
Other languages
English (en)
Other versions
DE69707624D1 (de
Inventor
Hideo Nishikawa
Takashi Miki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Read Corp
Original Assignee
Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Read Corp filed Critical Nidec Read Corp
Publication of DE69707624D1 publication Critical patent/DE69707624D1/de
Application granted granted Critical
Publication of DE69707624T2 publication Critical patent/DE69707624T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
DE69707624T 1996-12-05 1997-12-05 Apparat zur Inspektion von Leiterplatten Expired - Fee Related DE69707624T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08325637A JP3099873B2 (ja) 1996-12-05 1996-12-05 プリント基板検査装置およびユニバーサル型プリント基板検査装置の使用方法

Publications (2)

Publication Number Publication Date
DE69707624D1 DE69707624D1 (de) 2001-11-29
DE69707624T2 true DE69707624T2 (de) 2002-07-18

Family

ID=18179070

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69707624T Expired - Fee Related DE69707624T2 (de) 1996-12-05 1997-12-05 Apparat zur Inspektion von Leiterplatten

Country Status (4)

Country Link
US (1) US6049214A (de)
EP (1) EP0846953B1 (de)
JP (1) JP3099873B2 (de)
DE (1) DE69707624T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US6483328B1 (en) 1995-11-09 2002-11-19 Formfactor, Inc. Probe card for probing wafers with raised contact elements
US6447339B1 (en) * 2001-12-12 2002-09-10 Tektronix, Inc. Adapter for a multi-channel signal probe
US6876211B2 (en) * 2002-03-13 2005-04-05 Seagate Technology Llc Printed circuit board test fixture that supports a PCB to be tested
CN100592432C (zh) * 2006-11-16 2010-02-24 鸿富锦精密工业（深圳）有限公司 主板固定装置
TWI439709B (zh) * 2006-12-29 2014-06-01 Intest Corp 用於使負載沿平移軸線平移之操縱器與負載定位系統
WO2008085463A1 (en) * 2006-12-29 2008-07-17 In Test Corporation Test head positioning system and method
JP2013015508A (ja) * 2011-06-06 2013-01-24 Ricoh Co Ltd 基板検査用治具及び基板検査方法
US11050208B2 (en) * 2018-10-31 2021-06-29 International Business Machines Corporation Pre-screening, compliant pin guiding and quality monitoring press-fit apparatus

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3654585A (en) * 1970-03-11 1972-04-04 Brooks Research And Mfg Inc Coordinate conversion for the testing of printed circuit boards
US4551675A (en) * 1983-12-19 1985-11-05 Ncr Corporation Apparatus for testing printed circuit boards
US4724383A (en) * 1985-05-03 1988-02-09 Testsystems, Inc. PC board test fixture
FR2634025B1 (fr) * 1988-07-08 1990-11-09 Thomson Csf Adaptateur de brochage pour le test de circuits imprimes de haute densite
DE4237591A1 (de) * 1992-11-06 1994-05-11 Mania Gmbh Leiterplatten-Prüfeinrichtung mit Folienadapter
US5399982A (en) * 1989-11-13 1995-03-21 Mania Gmbh & Co. Printed circuit board testing device with foil adapter
US5574382A (en) * 1991-09-17 1996-11-12 Japan Synthetic Rubber Co., Ltd. Inspection electrode unit for printed wiring board
DE19507127A1 (de) * 1995-03-01 1996-09-12 Test Plus Electronic Gmbh Adaptersystem für Baugruppen-Platinen, zu verwenden in einer Prüfeinrichtung
US5883520A (en) * 1996-06-14 1999-03-16 Star Technology Group, Inc. Retention of test probes in translator fixtures
US5828226A (en) * 1996-11-06 1998-10-27 Cerprobe Corporation Probe card assembly for high density integrated circuits

Also Published As

Publication number Publication date
EP0846953A2 (de) 1998-06-10
US6049214A (en) 2000-04-11
JPH10170580A (ja) 1998-06-26
DE69707624D1 (de) 2001-11-29
JP3099873B2 (ja) 2000-10-16
EP0846953B1 (de) 2001-10-24
EP0846953A3 (de) 1998-08-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee