DE69616692T2 - Testeinrichtung zur Bestimmung der Orientierung von Komponenten auf Leiterplatten - Google Patents
Testeinrichtung zur Bestimmung der Orientierung von Komponenten auf LeiterplattenInfo
- Publication number
- DE69616692T2 DE69616692T2 DE69616692T DE69616692T DE69616692T2 DE 69616692 T2 DE69616692 T2 DE 69616692T2 DE 69616692 T DE69616692 T DE 69616692T DE 69616692 T DE69616692 T DE 69616692T DE 69616692 T2 DE69616692 T2 DE 69616692T2
- Authority
- DE
- Germany
- Prior art keywords
- orientation
- determining
- components
- printed circuit
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/312—Contactless testing by capacitive methods
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2813—Checking the presence, location, orientation or value, e.g. resistance, of components or conductors
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/517,573 US5811980A (en) | 1995-08-21 | 1995-08-21 | Test system for determining the orientation of components on a circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69616692D1 DE69616692D1 (de) | 2001-12-13 |
DE69616692T2 true DE69616692T2 (de) | 2002-05-02 |
Family
ID=24060358
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69616692T Expired - Lifetime DE69616692T2 (de) | 1995-08-21 | 1996-08-21 | Testeinrichtung zur Bestimmung der Orientierung von Komponenten auf Leiterplatten |
Country Status (4)
Country | Link |
---|---|
US (1) | US5811980A (de) |
EP (1) | EP0759559B1 (de) |
JP (1) | JP3759247B2 (de) |
DE (1) | DE69616692T2 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5844412A (en) * | 1996-12-19 | 1998-12-01 | Teradyne, Inc. | Board test apparatus and method for fast capacitance measurement |
US6104198A (en) * | 1997-05-20 | 2000-08-15 | Zen Licensing Group Llp | Testing the integrity of an electrical connection to a device using an onboard controllable signal source |
WO2001013698A1 (de) * | 1999-08-12 | 2001-02-22 | Siemens Aktiengesellschaft | Verfahren zum erkennen der lage oder der oberflächenstruktur eines gegenstands und anwendung des verfahrens sowie eine maschine zur verarbeitung von gegenständen |
US6525553B1 (en) | 2000-09-11 | 2003-02-25 | St Assembly Test Services Ltd. | Ground pin concept for singulated ball grid array |
KR100609918B1 (ko) * | 2004-12-28 | 2006-08-08 | 삼성전자주식회사 | 전자부품이 장착된 기판의 검사유닛 |
SG126774A1 (en) * | 2005-04-06 | 2006-11-29 | Agilent Technologies Inc | Method for determining a set of guard points and asystem for use thereof |
US8179143B2 (en) * | 2008-10-15 | 2012-05-15 | Test Research, Inc. | Apparatus for testing printed circuit and method therefor |
FI124554B (en) * | 2012-05-28 | 2014-10-15 | Tellabs Oy | Equipment and plug-in unit for the equipment |
WO2015087440A1 (ja) * | 2013-12-13 | 2015-06-18 | 富士機械製造株式会社 | 電子回路部品取出指示データ作成装置および電子回路部品装着機 |
JP6568733B2 (ja) * | 2015-07-15 | 2019-08-28 | 株式会社Fuji | 検査装置 |
CN113573567B (zh) * | 2021-09-26 | 2021-12-17 | 深圳市凯泰精密设备有限公司 | 一种smt贴片机用防错供料装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4350040A (en) * | 1980-06-26 | 1982-09-21 | The United States Of America As Represented By The United States Department Of Energy | Capacitance-level/density monitor for fluidized-bed combustor |
US4583042A (en) * | 1983-04-18 | 1986-04-15 | The Boeing Company | Capacitive circuit board testing system and method using a conductive pliant elastomeric reference plane |
US4779043A (en) * | 1987-08-26 | 1988-10-18 | Hewlett-Packard Company | Reversed IC test device and method |
GB2214640B (en) * | 1988-01-20 | 1992-05-20 | Univ Manchester | Tomographic flow imaging system |
US5150047A (en) * | 1989-07-21 | 1992-09-22 | Nippon Steel Corporation | Member for use in assembly of integrated circuit elements and a method of testing assembled integrated circuit elements |
US5081421A (en) * | 1990-05-01 | 1992-01-14 | At&T Bell Laboratories | In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection |
US5124660A (en) * | 1990-12-20 | 1992-06-23 | Hewlett-Packard Company | Identification of pin-open faults by capacitive coupling through the integrated circuit package |
US5254953A (en) * | 1990-12-20 | 1993-10-19 | Hewlett-Packard Company | Identification of pin-open faults by capacitive coupling through the integrated circuit package |
US5159526A (en) * | 1991-12-20 | 1992-10-27 | Compaq Computer Corporation | Method and apparatus for determining orientation of polarized capacitors |
US5469064A (en) * | 1992-01-14 | 1995-11-21 | Hewlett-Packard Company | Electrical assembly testing using robotic positioning of probes |
US5363051A (en) * | 1992-11-23 | 1994-11-08 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Steering capaciflector sensor |
US5420500A (en) * | 1992-11-25 | 1995-05-30 | Hewlett-Packard Company | Pacitive electrode system for detecting open solder joints in printed circuit assemblies |
US5539676A (en) * | 1993-04-15 | 1996-07-23 | Tokyo Electron Limited | Method of identifying probe position and probing method in prober |
US5391993A (en) * | 1994-01-27 | 1995-02-21 | Genrad, Inc. | Capacitive open-circuit test employing threshold determination |
-
1995
- 1995-08-21 US US08/517,573 patent/US5811980A/en not_active Expired - Lifetime
-
1996
- 1996-08-21 JP JP21987696A patent/JP3759247B2/ja not_active Expired - Fee Related
- 1996-08-21 DE DE69616692T patent/DE69616692T2/de not_active Expired - Lifetime
- 1996-08-21 EP EP96113396A patent/EP0759559B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH09121100A (ja) | 1997-05-06 |
EP0759559A2 (de) | 1997-02-26 |
US5811980A (en) | 1998-09-22 |
JP3759247B2 (ja) | 2006-03-22 |
DE69616692D1 (de) | 2001-12-13 |
EP0759559A3 (de) | 1997-10-01 |
EP0759559B1 (de) | 2001-11-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69611020D1 (de) | Prepreg für Leiterplatten | |
DE68909853D1 (de) | Verfahren und Film zur Herstellung von gedruckten Schaltungsplatten. | |
DE69033784T2 (de) | Gedruckte Schaltungsplatte | |
DE69118301D1 (de) | Vorrichtung zur Förderung von Leiterplatten | |
DE59812171D1 (de) | Anordnung zur Kontaktierung von Leiterplatten | |
DE69226937T2 (de) | Prüfverfahren für Leiterplatten | |
DE69400238D1 (de) | Befestigungsvorrichtung für Leiterplatten | |
DE69631236D1 (de) | Gedruckte Schaltungsplatten | |
DE69616692D1 (de) | Testeinrichtung zur Bestimmung der Orientierung von Komponenten auf Leiterplatten | |
DE69406581D1 (de) | Gedruckte Schaltungsplatten | |
DE69214581D1 (de) | Leiterplatte für gedruckte Schaltungen | |
KR880700276A (ko) | 인쇄회로기판의 수리 및 검사 시스템(System for Testing and Repairing Printed Circuit Boards) | |
DE69707624T2 (de) | Apparat zur Inspektion von Leiterplatten | |
DE59202581D1 (de) | Messwandler für elektronische Anordnungen zur schnellen Erkennung von Kurzschlüssen. | |
KR960009581U (ko) | 검사용 인쇄회로 기판 | |
DE69407503D1 (de) | Flexible Schaltung zur Verbindung von Leiterplatten | |
KR950005228U (ko) | 인쇄회로기판부품 검사장치 | |
KR970003713U (ko) | 테스트포인트 지정용 홀을 갖춘 인쇄회로기판 | |
KR940027876U (ko) | 인쇄회로 기판의 착탈 고정 장치 | |
KR960012958U (ko) | 인쇄회로기판 고정구조 | |
KR920009935U (ko) | 인쇄회로기판의 패시브 콤포넌트 측정회로 | |
KR980006119U (ko) | 인쇄회로기판 부품 삽입 유/무 검사장치 | |
KR950005206U (ko) | 전자제품의 인쇄회로기판 고정장치 | |
KR950007230U (ko) | 가변 저항기용 인쇄 회로판 | |
KR950022289U (ko) | 인쇄 회로 기판의 착탈 고정 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |