DE69705262D1 - Verfahren zur Beschichtung eines Gegenstandes mit einer konformen Nickelbeschichtung - Google Patents

Verfahren zur Beschichtung eines Gegenstandes mit einer konformen Nickelbeschichtung

Info

Publication number
DE69705262D1
DE69705262D1 DE69705262T DE69705262T DE69705262D1 DE 69705262 D1 DE69705262 D1 DE 69705262D1 DE 69705262 T DE69705262 T DE 69705262T DE 69705262 T DE69705262 T DE 69705262T DE 69705262 D1 DE69705262 D1 DE 69705262D1
Authority
DE
Germany
Prior art keywords
coating
conformal nickel
conformal
nickel coating
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69705262T
Other languages
English (en)
Other versions
DE69705262T2 (de
Inventor
Joseph Anthony Abys
Igor Veljko Kadija
Chonglun Fan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia of America Corp
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Publication of DE69705262D1 publication Critical patent/DE69705262D1/de
Application granted granted Critical
Publication of DE69705262T2 publication Critical patent/DE69705262T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/929—Electrical contact feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/934—Electrical process
    • Y10S428/935—Electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12389—All metal or with adjacent metals having variation in thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12875—Platinum group metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12889—Au-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12896—Ag-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12937—Co- or Ni-base component next to Fe-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
DE69705262T 1996-06-06 1997-05-27 Verfahren zur Beschichtung eines Gegenstandes mit einer konformen Nickelbeschichtung Expired - Lifetime DE69705262T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/660,628 US5916696A (en) 1996-06-06 1996-06-06 Conformable nickel coating and process for coating an article with a conformable nickel coating

Publications (2)

Publication Number Publication Date
DE69705262D1 true DE69705262D1 (de) 2001-07-26
DE69705262T2 DE69705262T2 (de) 2002-04-18

Family

ID=24650303

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69705262T Expired - Lifetime DE69705262T2 (de) 1996-06-06 1997-05-27 Verfahren zur Beschichtung eines Gegenstandes mit einer konformen Nickelbeschichtung

Country Status (8)

Country Link
US (3) US5916696A (de)
EP (1) EP0811706B1 (de)
JP (1) JP3266545B2 (de)
KR (1) KR100440363B1 (de)
DE (1) DE69705262T2 (de)
HK (1) HK1004817A1 (de)
MY (1) MY133609A (de)
SG (1) SG55327A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
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EP0887850A3 (de) 1997-06-23 2001-05-02 STMicroelectronics, Inc. Erzeugung eines Leiterrahmens mit verbesserten thermischen Eigenschaften
DE19850039A1 (de) * 1998-09-08 2000-03-23 Mahesh Chandra Dwivedi Elektrischer Leiter
US20030151120A1 (en) * 2000-06-28 2003-08-14 Hundt Michael J. Lead-frame forming for improved thermal performance
JP4554873B2 (ja) 2002-04-22 2010-09-29 日本電気株式会社 配線板、電子機器および電子部品の実装方法並びに製造方法
US20040109525A1 (en) * 2002-12-09 2004-06-10 Chieng Koc Vai Chieng Aka Michael Automatic chip counting system (process)
DE10333840B4 (de) 2003-07-24 2006-12-28 Infineon Technologies Ag Halbleiterbauteil mit einem Kunststoffgehäuse, das eine Umverdrahrungsstruktur aufweist und Verfahren zu deren Herstellung
JP2005194618A (ja) * 2003-12-31 2005-07-21 Rohm & Haas Electronic Materials Llc 非導電性基体を金属化する方法およびそれにより形成される金属化非導電性基体
US20050249968A1 (en) * 2004-05-04 2005-11-10 Enthone Inc. Whisker inhibition in tin surfaces of electronic components
TW200530433A (en) * 2004-01-21 2005-09-16 Enthone Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components
US7125750B2 (en) * 2004-11-22 2006-10-24 Asm Assembly Materials Ltd. Leadframe with enhanced encapsulation adhesion
US20070052105A1 (en) * 2005-09-07 2007-03-08 Rohm And Haas Electronic Materials Llc Metal duplex method
CN101425468B (zh) * 2007-10-29 2012-07-04 飞思卡尔半导体（中国）有限公司 经过涂敷的引线框
EP2242873B1 (de) 2007-12-11 2018-09-12 MacDermid Enthone Inc. Elektrolytische abscheidung von auf metall basierenden verbundbeschichtungen, die nanopartikel umfassen
WO2011049091A1 (ja) * 2009-10-22 2011-04-28 三菱瓦斯化学株式会社 金属微細構造体のパターン倒壊抑制用処理液及びこれを用いた金属微細構造体の製造方法
JP4929382B2 (ja) * 2010-07-13 2012-05-09 株式会社東芝 電子部品構造体及び電子機器
EP2628824B1 (de) * 2012-02-16 2014-09-17 Atotech Deutschland GmbH Verfahren zur stromfreien nickelphosphorhaltigen Legierungsablagerung auf flexiblen Substraten
CN103334151A (zh) * 2013-07-22 2013-10-02 苏州昕皓新材料科技有限公司 一种改进添加剂添加顺序的镀镍方法
US9129951B2 (en) 2013-10-17 2015-09-08 Freescale Semiconductor, Inc. Coated lead frame bond finger
US9070392B1 (en) 2014-12-16 2015-06-30 Hutchinson Technology Incorporated Piezoelectric disk drive suspension motors having plated stiffeners
WO2017003782A1 (en) 2015-06-30 2017-01-05 Hutchinson Technology Incorporated Disk drive head suspension structures having improved gold-dielectric joint reliability
JP7334485B2 (ja) * 2019-06-07 2023-08-29 富士電機株式会社 半導体モジュールの外部接続部、半導体モジュールの外部接続部の製造方法、半導体モジュール、車両、及び外部接続部とバスバーとの接続方法

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US4122215A (en) * 1976-12-27 1978-10-24 Bell Telephone Laboratories, Incorporated Electroless deposition of nickel on a masked aluminum surface
US4183789A (en) * 1977-03-30 1980-01-15 M&T Chemicals Inc. Anode bag benefaction
US4178475A (en) * 1978-03-09 1979-12-11 General Communications Co., Inc. Method and control apparatus for radio paging systems
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US4411744A (en) * 1980-10-23 1983-10-25 Occidental Chemical Corporation Bath and process for high speed nickel electroplating
US4411965A (en) * 1980-10-31 1983-10-25 Occidental Chemical Corporation Process for high speed nickel and gold electroplate system and article having improved corrosion resistance
US4767508A (en) * 1986-02-27 1988-08-30 Nippon Mining Co., Ltd. Strike plating solution useful in applying primer plating to electronic parts
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US4911799A (en) * 1989-08-29 1990-03-27 At&T Bell Laboratories Electrodeposition of palladium films
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US5360991A (en) * 1993-07-29 1994-11-01 At&T Bell Laboratories Integrated circuit devices with solderable lead frame
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US5436082A (en) * 1993-12-27 1995-07-25 National Semiconductor Corporation Protective coating combination for lead frames
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US5929511A (en) * 1996-07-15 1999-07-27 Matsushita Electronics Corporation Lead frame for resin sealed semiconductor device
US6037653A (en) * 1997-03-25 2000-03-14 Samsung Aerospace Industries, Ltd. Semiconductor lead frame having multi-layered plating layer including copper-nickel plating layer

Also Published As

Publication number Publication date
KR100440363B1 (ko) 2004-11-03
MY133609A (en) 2007-11-30
US6090263A (en) 2000-07-18
EP0811706B1 (de) 2001-06-20
EP0811706A1 (de) 1997-12-10
US5916696A (en) 1999-06-29
JPH1060685A (ja) 1998-03-03
US6399220B1 (en) 2002-06-04
HK1004817A1 (en) 1998-12-11
JP3266545B2 (ja) 2002-03-18
DE69705262T2 (de) 2002-04-18
KR980006215A (ko) 1998-03-30
SG55327A1 (en) 1998-12-21

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