JPS5514869A - Plating method - Google Patents
Plating methodInfo
- Publication number
- JPS5514869A JPS5514869A JP8769778A JP8769778A JPS5514869A JP S5514869 A JPS5514869 A JP S5514869A JP 8769778 A JP8769778 A JP 8769778A JP 8769778 A JP8769778 A JP 8769778A JP S5514869 A JPS5514869 A JP S5514869A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plating bath
- active agent
- adjusted
- current density
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To form Ni plating surface excelling in strength, by adjusting the surface tension of the plating bath to a specified value, and controlling the current density within a specified range, when applying Ni plating by adding carbon fluroide or fluorine group surface active agent into Ni plating bath.
CONSTITUTION: In an ordinary Ni plating bath in which are dissolved nickel chloride and nickel sulfate, a fluorine group surface active agent possessing cation hydrophilic group in carbon fluoride or perfluoroalkyl is added, and the surface tension is adjusted to 45 to 78 dyne-cm-1. At the same time, the current density of the current for plating is adjusted to 6 to 30 A/dm2, and electroplating is applied. Thus is formed a strong Ni plating layer free from crack or peeling on the surface of the metal material being plated at the cathode.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8769778A JPS5514869A (en) | 1978-07-20 | 1978-07-20 | Plating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8769778A JPS5514869A (en) | 1978-07-20 | 1978-07-20 | Plating method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5514869A true JPS5514869A (en) | 1980-02-01 |
Family
ID=13922108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8769778A Pending JPS5514869A (en) | 1978-07-20 | 1978-07-20 | Plating method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5514869A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58170074A (en) * | 1982-03-31 | 1983-10-06 | Hoxan Corp | Surface electrode depositing method by direct masking system of solar battery and depositing jig |
EP0811706A1 (en) * | 1996-06-06 | 1997-12-10 | Lucent Technologies Inc. | Conformable nickel coating and process for coating an article with a conformable nickel coating |
US20160032478A1 (en) * | 2013-03-19 | 2016-02-04 | Sony Corporation | Plating film, method of manufacturing plating film, and plated product |
-
1978
- 1978-07-20 JP JP8769778A patent/JPS5514869A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58170074A (en) * | 1982-03-31 | 1983-10-06 | Hoxan Corp | Surface electrode depositing method by direct masking system of solar battery and depositing jig |
EP0811706A1 (en) * | 1996-06-06 | 1997-12-10 | Lucent Technologies Inc. | Conformable nickel coating and process for coating an article with a conformable nickel coating |
US5916696A (en) * | 1996-06-06 | 1999-06-29 | Lucent Technologies Inc. | Conformable nickel coating and process for coating an article with a conformable nickel coating |
US6090263A (en) * | 1996-06-06 | 2000-07-18 | Lucent Technologies Inc. | Process for coating an article with a conformable nickel coating |
US20160032478A1 (en) * | 2013-03-19 | 2016-02-04 | Sony Corporation | Plating film, method of manufacturing plating film, and plated product |
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