JPS5514869A - Plating method - Google Patents

Plating method

Info

Publication number
JPS5514869A
JPS5514869A JP8769778A JP8769778A JPS5514869A JP S5514869 A JPS5514869 A JP S5514869A JP 8769778 A JP8769778 A JP 8769778A JP 8769778 A JP8769778 A JP 8769778A JP S5514869 A JPS5514869 A JP S5514869A
Authority
JP
Japan
Prior art keywords
plating
plating bath
active agent
adjusted
current density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8769778A
Other languages
Japanese (ja)
Inventor
Shunji Matsuura
Yukio Mizutani
Atsuyuki Mimura
Hiroshi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuyama Corp
Original Assignee
Tokuyama Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuyama Corp filed Critical Tokuyama Corp
Priority to JP8769778A priority Critical patent/JPS5514869A/en
Publication of JPS5514869A publication Critical patent/JPS5514869A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To form Ni plating surface excelling in strength, by adjusting the surface tension of the plating bath to a specified value, and controlling the current density within a specified range, when applying Ni plating by adding carbon fluroide or fluorine group surface active agent into Ni plating bath.
CONSTITUTION: In an ordinary Ni plating bath in which are dissolved nickel chloride and nickel sulfate, a fluorine group surface active agent possessing cation hydrophilic group in carbon fluoride or perfluoroalkyl is added, and the surface tension is adjusted to 45 to 78 dyne-cm-1. At the same time, the current density of the current for plating is adjusted to 6 to 30 A/dm2, and electroplating is applied. Thus is formed a strong Ni plating layer free from crack or peeling on the surface of the metal material being plated at the cathode.
COPYRIGHT: (C)1980,JPO&Japio
JP8769778A 1978-07-20 1978-07-20 Plating method Pending JPS5514869A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8769778A JPS5514869A (en) 1978-07-20 1978-07-20 Plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8769778A JPS5514869A (en) 1978-07-20 1978-07-20 Plating method

Publications (1)

Publication Number Publication Date
JPS5514869A true JPS5514869A (en) 1980-02-01

Family

ID=13922108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8769778A Pending JPS5514869A (en) 1978-07-20 1978-07-20 Plating method

Country Status (1)

Country Link
JP (1) JPS5514869A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58170074A (en) * 1982-03-31 1983-10-06 Hoxan Corp Surface electrode depositing method by direct masking system of solar battery and depositing jig
EP0811706A1 (en) * 1996-06-06 1997-12-10 Lucent Technologies Inc. Conformable nickel coating and process for coating an article with a conformable nickel coating
US20160032478A1 (en) * 2013-03-19 2016-02-04 Sony Corporation Plating film, method of manufacturing plating film, and plated product

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58170074A (en) * 1982-03-31 1983-10-06 Hoxan Corp Surface electrode depositing method by direct masking system of solar battery and depositing jig
EP0811706A1 (en) * 1996-06-06 1997-12-10 Lucent Technologies Inc. Conformable nickel coating and process for coating an article with a conformable nickel coating
US5916696A (en) * 1996-06-06 1999-06-29 Lucent Technologies Inc. Conformable nickel coating and process for coating an article with a conformable nickel coating
US6090263A (en) * 1996-06-06 2000-07-18 Lucent Technologies Inc. Process for coating an article with a conformable nickel coating
US20160032478A1 (en) * 2013-03-19 2016-02-04 Sony Corporation Plating film, method of manufacturing plating film, and plated product

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