DE69703603T2 - Wärmeleitfähige Silikonzusammensetzung, thermisch leitendes Material und ein thermisch leitendes Silikonfett - Google Patents

Wärmeleitfähige Silikonzusammensetzung, thermisch leitendes Material und ein thermisch leitendes Silikonfett

Info

Publication number
DE69703603T2
DE69703603T2 DE69703603T DE69703603T DE69703603T2 DE 69703603 T2 DE69703603 T2 DE 69703603T2 DE 69703603 T DE69703603 T DE 69703603T DE 69703603 T DE69703603 T DE 69703603T DE 69703603 T2 DE69703603 T2 DE 69703603T2
Authority
DE
Germany
Prior art keywords
thermally conductive
conductive silicone
silicone composition
conductive material
silicone grease
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69703603T
Other languages
English (en)
Other versions
DE69703603D1 (de
Inventor
Takayuki Takahashi
Masahiko Minemura
Takashi Ohkawara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of DE69703603D1 publication Critical patent/DE69703603D1/de
Application granted granted Critical
Publication of DE69703603T2 publication Critical patent/DE69703603T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M111/00—Lubrication compositions characterised by the base-material being a mixture of two or more compounds covered by more than one of the main groups C10M101/00 - C10M109/00, each of these compounds being essential
    • C10M111/04—Lubrication compositions characterised by the base-material being a mixture of two or more compounds covered by more than one of the main groups C10M101/00 - C10M109/00, each of these compounds being essential at least one of them being a macromolecular organic compound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/06—Metal compounds
    • C10M2201/061—Carbides; Hydrides; Nitrides
    • C10M2201/0613—Carbides; Hydrides; Nitrides used as base material
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/06—Metal compounds
    • C10M2201/062—Oxides; Hydroxides; Carbonates or bicarbonates
    • C10M2201/0623—Oxides; Hydroxides; Carbonates or bicarbonates used as base material
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2229/00—Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
    • C10M2229/04—Siloxanes with specific structure
    • C10M2229/042—Siloxanes with specific structure containing aromatic substituents
    • C10M2229/0425—Siloxanes with specific structure containing aromatic substituents used as base material
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2020/00—Specified physical or chemical properties or characteristics, i.e. function, of component of lubricating compositions
    • C10N2020/01—Physico-chemical properties
    • C10N2020/02—Viscosity; Viscosity index
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2020/00—Specified physical or chemical properties or characteristics, i.e. function, of component of lubricating compositions
    • C10N2020/01—Physico-chemical properties
    • C10N2020/055—Particles related characteristics
    • C10N2020/06—Particles of special shape or size
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2040/00—Specified use or application for which the lubricating composition is intended
    • C10N2040/14—Electric or magnetic purposes
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2050/00—Form in which the lubricant is applied to the material being lubricated
    • C10N2050/10—Semi-solids; greasy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Lubricants (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE69703603T 1996-08-09 1997-08-07 Wärmeleitfähige Silikonzusammensetzung, thermisch leitendes Material und ein thermisch leitendes Silikonfett Expired - Lifetime DE69703603T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22787896 1996-08-09
JP09208464A JP3142800B2 (ja) 1996-08-09 1997-07-16 熱伝導性シリコーン組成物、熱伝導性材料及び熱伝導性シリコーングリース

Publications (2)

Publication Number Publication Date
DE69703603D1 DE69703603D1 (de) 2001-01-04
DE69703603T2 true DE69703603T2 (de) 2001-04-05

Family

ID=26516848

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69703603T Expired - Lifetime DE69703603T2 (de) 1996-08-09 1997-08-07 Wärmeleitfähige Silikonzusammensetzung, thermisch leitendes Material und ein thermisch leitendes Silikonfett

Country Status (4)

Country Link
US (1) US5981641A (de)
EP (1) EP0823451B1 (de)
JP (1) JP3142800B2 (de)
DE (1) DE69703603T2 (de)

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WO2002086911A1 (en) * 2001-04-23 2002-10-31 Henkel Loctite Corporation Conductive, silicone-based compositions with improved initial adhesion and reduced microvoiding
EP0939115A1 (de) * 1998-02-27 1999-09-01 Shin-Etsu Chemical Co., Ltd. Wärmeleitende Schmierfettzusammensetzung
JP3563590B2 (ja) * 1998-04-17 2004-09-08 電気化学工業株式会社 放熱スペーサー
JP3948642B2 (ja) * 1998-08-21 2007-07-25 信越化学工業株式会社 熱伝導性グリース組成物及びそれを使用した半導体装置
JP2000114438A (ja) * 1998-09-30 2000-04-21 Shin Etsu Chem Co Ltd 半導体装置
JP2000109373A (ja) * 1998-10-02 2000-04-18 Shin Etsu Chem Co Ltd 放熱用シリコーングリース組成物及びそれを使用した半導体装置
JP2000169873A (ja) * 1998-12-02 2000-06-20 Shin Etsu Chem Co Ltd シリコーングリース組成物
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US6660241B2 (en) * 2000-05-01 2003-12-09 Saint-Gobain Ceramics & Plastics, Inc. Highly delaminated hexagonal boron nitride powders, process for making, and uses thereof
US6794435B2 (en) 2000-05-18 2004-09-21 Saint Gobain Ceramics & Plastics, Inc. Agglomerated hexagonal boron nitride powders, method of making, and uses thereof
US6589918B2 (en) * 2000-06-22 2003-07-08 Nsk Ltd. Conductive grease and rolling apparatus packed with the same
US6764975B1 (en) * 2000-11-28 2004-07-20 Saint-Gobain Ceramics & Plastics, Inc. Method for making high thermal diffusivity boron nitride powders
JP4603700B2 (ja) * 2001-01-04 2010-12-22 株式会社日立製作所 高熱伝導グリース組成物及びそれを用いた冷却装置
US7396872B2 (en) 2001-03-09 2008-07-08 Dow Corning Toray Silicone Co. Greasy silicone composition
EP1397421B1 (de) * 2001-04-30 2019-09-04 Saint-Gobain Ceramics and Plastics, Inc. Polymerverarbeitung und verfahren zur verarbeitung von polymeren
US6592997B2 (en) * 2001-06-25 2003-07-15 General Electric Company Curable silicone compositions, methods and articles made thereby
US6645612B2 (en) 2001-08-07 2003-11-11 Saint-Gobain Ceramics & Plastics, Inc. High solids hBN slurry, hBN paste, spherical hBN powder, and methods of making and using them
JP4130091B2 (ja) * 2002-04-10 2008-08-06 信越化学工業株式会社 放熱用シリコーングリース組成物
US7494635B2 (en) * 2003-08-21 2009-02-24 Saint-Gobain Ceramics & Plastics, Inc. Boron nitride agglomerated powder
US20050049350A1 (en) * 2003-08-25 2005-03-03 Sandeep Tonapi Thin bond-line silicone adhesive composition and method for preparing the same
US7695817B2 (en) * 2003-11-05 2010-04-13 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
JP2005146057A (ja) * 2003-11-12 2005-06-09 Polymatech Co Ltd 高熱伝導性成形体及びその製造方法
JP2005234464A (ja) * 2004-02-23 2005-09-02 Tdk Corp 光トランシーバ及びこれに用いる光モジュール
TWI385246B (zh) 2004-05-21 2013-02-11 Shinetsu Chemical Co 聚矽氧烷潤滑油組成物
JP4860229B2 (ja) * 2005-10-11 2012-01-25 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性グリース組成物
JP4933094B2 (ja) * 2005-12-27 2012-05-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP2007277387A (ja) * 2006-04-06 2007-10-25 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物
TWI419931B (zh) * 2006-06-16 2013-12-21 Shinetsu Chemical Co 導熱聚矽氧潤滑脂組成物
EP1878767A1 (de) * 2006-07-12 2008-01-16 Shin-Etsu Chemical Co., Ltd. Wärmeleitende Silikonfettzusammensetzung und gehärtetes Produkt daraus
US20100048435A1 (en) * 2006-10-17 2010-02-25 Denki Kagaku Kogyo Kabushiki Kaisha Grease
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US8106119B2 (en) * 2007-12-04 2012-01-31 Sea-Fue Wang Thermally conductive silicone composition
US20090143522A1 (en) * 2007-12-04 2009-06-04 Sea-Fue Wang Thermally Conductive Silicone Composition
US7906373B1 (en) * 2008-03-26 2011-03-15 Pawel Czubarow Thermally enhanced electrically insulative adhesive paste
JP5388329B2 (ja) * 2008-11-26 2014-01-15 株式会社デンソー 放熱用シリコーングリース組成物
JP5430136B2 (ja) * 2008-12-08 2014-02-26 電気化学工業株式会社 部材表面の改質方法。
CN102348763B (zh) 2009-03-16 2013-04-10 道康宁公司 导热润滑脂以及使用所述润滑脂的方法和器件
JP2011140566A (ja) * 2010-01-07 2011-07-21 Dow Corning Toray Co Ltd 熱伝導性シリコーングリース組成物
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JP6383993B2 (ja) * 2014-02-18 2018-09-05 協同油脂株式会社 シリコーングリース組成物
US9822326B2 (en) * 2014-03-31 2017-11-21 Exxonmobil Research And Engineering Company Low viscosity, low volatility lubricating oil basestocks
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EP3150672B1 (de) 2015-10-02 2018-05-09 Shin-Etsu Chemical Co., Ltd. Wärmeleitende und silikonzusammensetzung und halbleiterbauelement
JP6580949B2 (ja) * 2015-11-06 2019-09-25 株式会社トクヤマ 複合充填材およびこれを含む樹脂組成物
JP6607166B2 (ja) 2016-10-31 2019-11-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
JP6919716B2 (ja) 2017-11-09 2021-08-18 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP6866877B2 (ja) 2018-05-31 2021-04-28 信越化学工業株式会社 低熱抵抗シリコーン組成物
CN112805334B (zh) 2018-11-07 2023-08-04 陶氏环球技术有限责任公司 导热组合物以及使用所述组合物的方法和装置
WO2020129555A1 (ja) 2018-12-21 2020-06-25 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
JP7076400B2 (ja) 2019-05-27 2022-05-27 信越化学工業株式会社 熱伝導性シリコーン組成物、半導体装置及びその製造方法
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RU2757253C2 (ru) * 2019-12-26 2021-10-12 Федеральное государственное автономное образовательное учреждение высшего образования "Уральский федеральный университет имени первого Президента России Б.Н. Ельцина" Полимерная композиционная теплопроводная паста с нановолокнистым модификатором
JP7398733B2 (ja) * 2020-02-27 2023-12-15 株式会社トクヤマ 複合窒化アルミニウム粒子の製造方法、及び複合窒化アルミニウム粒子
JP7393975B2 (ja) * 2020-02-27 2023-12-07 株式会社トクヤマ 複合窒化アルミニウム粉末及びその製造方法
JP7262417B2 (ja) * 2020-04-27 2023-04-21 デクセリアルズ株式会社 熱伝導性樹脂組成物及びこれを用いた熱伝導性シート
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Also Published As

Publication number Publication date
JPH10110179A (ja) 1998-04-28
DE69703603D1 (de) 2001-01-04
EP0823451B1 (de) 2000-11-29
US5981641A (en) 1999-11-09
EP0823451A1 (de) 1998-02-11
JP3142800B2 (ja) 2001-03-07

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