DE69535250D1 - Flip-Chip mit wärmeleitender Schicht - Google Patents

Flip-Chip mit wärmeleitender Schicht

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Publication number
DE69535250D1
DE69535250D1 DE69535250T DE69535250T DE69535250D1 DE 69535250 D1 DE69535250 D1 DE 69535250D1 DE 69535250 T DE69535250 T DE 69535250T DE 69535250 T DE69535250 T DE 69535250T DE 69535250 D1 DE69535250 D1 DE 69535250D1
Authority
DE
Germany
Prior art keywords
flip
chip
heat
conducting layer
conducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69535250T
Other languages
English (en)
Other versions
DE69535250T2 (de
Inventor
Hua Quen Tserng
Paul Saunier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of DE69535250D1 publication Critical patent/DE69535250D1/de
Publication of DE69535250T2 publication Critical patent/DE69535250T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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    • H01L2924/351Thermal stress

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Bipolar Integrated Circuits (AREA)
DE69535250T 1994-08-31 1995-08-28 Flip-Chip mit wärmeleitender Schicht Expired - Lifetime DE69535250T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US298822 1994-08-31
US08/298,822 US5521406A (en) 1994-08-31 1994-08-31 Integrated circuit with improved thermal impedance

Publications (2)

Publication Number Publication Date
DE69535250D1 true DE69535250D1 (de) 2006-11-16
DE69535250T2 DE69535250T2 (de) 2007-08-23

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DE69535250T2 (de) 2007-08-23
EP0703614A3 (de) 1997-03-12
US5521406A (en) 1996-05-28
US5614442A (en) 1997-03-25
JP4231111B2 (ja) 2009-02-25
JPH08213474A (ja) 1996-08-20
EP0703614B1 (de) 2006-10-04
US5532506A (en) 1996-07-02
US5717231A (en) 1998-02-10
EP0703614A2 (de) 1996-03-27
US5612257A (en) 1997-03-18

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