DE69535250D1 - Flip-Chip mit wärmeleitender Schicht - Google Patents

Flip-Chip mit wärmeleitender Schicht

Info

Publication number
DE69535250D1
DE69535250D1 DE69535250T DE69535250T DE69535250D1 DE 69535250 D1 DE69535250 D1 DE 69535250D1 DE 69535250 T DE69535250 T DE 69535250T DE 69535250 T DE69535250 T DE 69535250T DE 69535250 D1 DE69535250 D1 DE 69535250D1
Authority
DE
Germany
Prior art keywords
flip
chip
heat
conducting layer
conducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69535250T
Other languages
English (en)
Other versions
DE69535250T2 (de
Inventor
Hua Quen Tserng
Paul Saunier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
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Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of DE69535250D1 publication Critical patent/DE69535250D1/de
Application granted granted Critical
Publication of DE69535250T2 publication Critical patent/DE69535250T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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DE69535250T 1994-08-31 1995-08-28 Flip-Chip mit wärmeleitender Schicht Expired - Lifetime DE69535250T2 (de)

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US08/298,822 US5521406A (en) 1994-08-31 1994-08-31 Integrated circuit with improved thermal impedance
US298822 1994-08-31

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Publication number Publication date
US5614442A (en) 1997-03-25
US5532506A (en) 1996-07-02
US5717231A (en) 1998-02-10
JPH08213474A (ja) 1996-08-20
US5521406A (en) 1996-05-28
EP0703614A2 (de) 1996-03-27
US5612257A (en) 1997-03-18
EP0703614A3 (de) 1997-03-12
EP0703614B1 (de) 2006-10-04
JP4231111B2 (ja) 2009-02-25
DE69535250T2 (de) 2007-08-23

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