AU1064899A - Methods of making flexible substrates for electronic packaging and flexible substrates formed by the method - Google Patents

Methods of making flexible substrates for electronic packaging and flexible substrates formed by the method

Info

Publication number
AU1064899A
AU1064899A AU10648/99A AU1064899A AU1064899A AU 1064899 A AU1064899 A AU 1064899A AU 10648/99 A AU10648/99 A AU 10648/99A AU 1064899 A AU1064899 A AU 1064899A AU 1064899 A AU1064899 A AU 1064899A
Authority
AU
Australia
Prior art keywords
flexible substrates
methods
electronic packaging
making
substrates formed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU10648/99A
Inventor
William D Brown
Timothy G. Lenihan
Ajay P Malshe
Leonard W Schaper
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Arkansas
Original Assignee
University of Arkansas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Arkansas filed Critical University of Arkansas
Publication of AU1064899A publication Critical patent/AU1064899A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AU10648/99A 1997-10-03 1998-10-01 Methods of making flexible substrates for electronic packaging and flexible substrates formed by the method Abandoned AU1064899A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US6111097P 1997-10-03 1997-10-03
US60061110 1997-10-03
PCT/US1998/020669 WO1999018607A1 (en) 1997-10-03 1998-10-01 Methods of making flexible substrates for electronic packaging and flexible substrates formed by the method

Publications (1)

Publication Number Publication Date
AU1064899A true AU1064899A (en) 1999-04-27

Family

ID=22033649

Family Applications (1)

Application Number Title Priority Date Filing Date
AU10648/99A Abandoned AU1064899A (en) 1997-10-03 1998-10-01 Methods of making flexible substrates for electronic packaging and flexible substrates formed by the method

Country Status (2)

Country Link
AU (1) AU1064899A (en)
WO (1) WO1999018607A1 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5838064A (en) * 1994-04-22 1998-11-17 Nec Corporation Supporting member for cooling means and electronic package using the same
US5521406A (en) * 1994-08-31 1996-05-28 Texas Instruments Incorporated Integrated circuit with improved thermal impedance
JPH09172113A (en) * 1995-12-18 1997-06-30 Nec Corp Heat sink for semiconductor device
US5646446A (en) * 1995-12-22 1997-07-08 Fairchild Space And Defense Corporation Three-dimensional flexible assembly of integrated circuits

Also Published As

Publication number Publication date
WO1999018607A1 (en) 1999-04-15

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase