DE69534364T2 - Herstellungsfehler Analysator - Google Patents

Herstellungsfehler Analysator Download PDF

Info

Publication number
DE69534364T2
DE69534364T2 DE69534364T DE69534364T DE69534364T2 DE 69534364 T2 DE69534364 T2 DE 69534364T2 DE 69534364 T DE69534364 T DE 69534364T DE 69534364 T DE69534364 T DE 69534364T DE 69534364 T2 DE69534364 T2 DE 69534364T2
Authority
DE
Germany
Prior art keywords
manufacturing error
error analyzer
analyzer
manufacturing
error
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69534364T
Other languages
English (en)
Other versions
DE69534364D1 (de
Inventor
Philip J Stringer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teradyne Inc
Original Assignee
Teradyne Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23283569&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69534364(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Teradyne Inc filed Critical Teradyne Inc
Publication of DE69534364D1 publication Critical patent/DE69534364D1/de
Application granted granted Critical
Publication of DE69534364T2 publication Critical patent/DE69534364T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
DE69534364T 1994-10-25 1995-10-23 Herstellungsfehler Analysator Expired - Lifetime DE69534364T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/329,031 US5521513A (en) 1994-10-25 1994-10-25 Manufacturing defect analyzer

Publications (2)

Publication Number Publication Date
DE69534364D1 DE69534364D1 (de) 2005-09-15
DE69534364T2 true DE69534364T2 (de) 2006-06-14

Family

ID=23283569

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69534364T Expired - Lifetime DE69534364T2 (de) 1994-10-25 1995-10-23 Herstellungsfehler Analysator

Country Status (5)

Country Link
US (2) US5521513A (de)
EP (1) EP0714032B1 (de)
JP (1) JP3816975B2 (de)
DE (1) DE69534364T2 (de)
TW (1) TW283205B (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5736862A (en) * 1995-06-22 1998-04-07 Genrad, Inc. System for detecting faults in connections between integrated circuits and circuit board traces
US5966020A (en) * 1996-10-30 1999-10-12 Intel Corporation Method and apparatus for facilitating detection of solder opens of SMT components
US6227957B1 (en) * 1998-05-22 2001-05-08 Nilfisk-Advance, Inc. Battery powered, riding, floor burnishing machine
US6266787B1 (en) * 1998-10-09 2001-07-24 Agilent Technologies, Inc. Method and apparatus for selecting stimulus locations during limited access circuit test
US6783620B1 (en) 1998-10-13 2004-08-31 Matsushita Electronic Materials, Inc. Thin-laminate panels for capacitive printed-circuit boards and methods for making the same
US6114015A (en) * 1998-10-13 2000-09-05 Matsushita Electronic Materials, Inc. Thin-laminate panels for capacitive printed-circuit boards and methods for making the same
US6661242B1 (en) * 2001-12-20 2003-12-09 Xilinx, Inc. Using a DUT pin at known voltage to determine channel path resistance in automated test equipment test channels
GB2389471B (en) * 2002-06-06 2005-09-21 Sun Microsystems Inc Latent fault detection in redundant power supply systems
US6948140B2 (en) * 2002-09-01 2005-09-20 Agilent Technologies, Inc. Methods and apparatus for characterizing board test coverage
GB2394780B (en) * 2002-10-29 2006-06-14 Ifr Ltd A method of and apparatus for testing for integrated circuit contact defects
CN100437130C (zh) * 2005-04-06 2008-11-26 华硕电脑股份有限公司 制造缺陷分析系统及其检测方法
TWI275812B (en) * 2005-04-11 2007-03-11 Asustek Comp Inc Test converting card and test apparatus with test converting card
US7279907B2 (en) * 2006-02-28 2007-10-09 Freescale Semiconductor, Inc. Method of testing for power and ground continuity of a semiconductor device
US7496466B2 (en) * 2007-01-19 2009-02-24 Huntron, Inc. System for fault determinations for high frequency electronic circuits
FR2928060B1 (fr) * 2008-02-25 2010-07-30 Groupe Des Ecoles De Telecommunications Get Ecole Nat Superieure Des Telecommunications Enst Procede de test de circuits de cryptographie, circuit de cryptographie securise apte a etre teste, et procede de cablage d'un tel circuit.
TWI375809B (en) * 2008-04-07 2012-11-01 King Yuan Electronics Co Ltd Method for continuity test of integrated circuit
CN101571570B (zh) * 2008-04-29 2013-05-22 京元电子股份有限公司 集成电路连续性测试方法及集成电路接触电阻的测量方法
TWI461715B (zh) * 2012-12-06 2014-11-21 Wistron Corp 測試裝置以及電子裝置的測試方法
US9664728B2 (en) 2013-04-14 2017-05-30 Infineon Technologies Austria Ag Detection of defective electrical connections
JP6780085B2 (ja) * 2017-02-15 2020-11-04 株式会社Ｆｕｊｉ 装着機、測定方法
CN110967615B (zh) * 2018-09-30 2022-06-21 鸿富锦精密电子（成都）有限公司 电路板故障诊断装置及诊断方法
US11191152B2 (en) * 2019-01-18 2021-11-30 Hewlett Packard Enterprise Development Lp Printed circuit board signal layer testing

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3763430A (en) * 1972-01-14 1973-10-02 Burroughs Corp Circuit testing method and apparatus
AT391762B (de) * 1985-11-26 1990-11-26 Alcatel Austria Ag Vorrichtung zum pruefen von leiterplatten
US4864219A (en) * 1987-03-19 1989-09-05 Genrad, Inc. Method and apparatus for verifying proper placement of integrated circuits on circuit boards
US4779041A (en) * 1987-05-20 1988-10-18 Hewlett-Packard Company Integrated circuit transfer test device system
US4779043A (en) * 1987-08-26 1988-10-18 Hewlett-Packard Company Reversed IC test device and method
US4894605A (en) * 1988-02-24 1990-01-16 Digital Equipment Corporation Method and on-chip apparatus for continuity testing
FR2660072B1 (fr) * 1990-03-21 1992-07-24 Int Market Dev Appareil de test de circuit imprime.
US5072175A (en) * 1990-09-10 1991-12-10 Compaq Computer Corporation Integrated circuit having improved continuity testability and a system incorporating the same
US5254953A (en) * 1990-12-20 1993-10-19 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US5124660A (en) * 1990-12-20 1992-06-23 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
DE4110551C1 (de) * 1991-03-30 1992-07-23 Ita Ingenieurbuero Fuer Testaufgaben Gmbh, 2000 Hamburg, De
US5426361A (en) * 1991-09-09 1995-06-20 Simmons; Selwyn D. Electronic reconfigurable interconnect system
US5469064A (en) * 1992-01-14 1995-11-21 Hewlett-Packard Company Electrical assembly testing using robotic positioning of probes
IT1259395B (it) * 1992-05-29 1996-03-13 Luciano Bonaria Metodo di rilevamento di connesioni erronee in schede elettroniche
GB9212646D0 (en) * 1992-06-15 1992-07-29 Marconi Instruments Ltd A method of and equipment for testing the electrical conductivity of a connection
US5294883A (en) * 1992-08-04 1994-03-15 International Business Machines Corporation Test detector/shutoff and method for BiCMOS integrated circuit
JP3214766B2 (ja) * 1992-08-06 2001-10-02 アジレント・テクノロジーズ・インク 接続検査のための装置
US5357191A (en) * 1992-11-09 1994-10-18 Probot, Inc. Method and apparatus for testing circuit boards
US5420500A (en) * 1992-11-25 1995-05-30 Hewlett-Packard Company Pacitive electrode system for detecting open solder joints in printed circuit assemblies

Also Published As

Publication number Publication date
EP0714032B1 (de) 2005-08-10
US5521513A (en) 1996-05-28
JPH08242100A (ja) 1996-09-17
JP3816975B2 (ja) 2006-08-30
TW283205B (de) 1996-08-11
EP0714032A3 (de) 1997-04-09
US5554928A (en) 1996-09-10
EP0714032A2 (de) 1996-05-29
DE69534364D1 (de) 2005-09-15

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