DE69531633D1 - Harzbeschichtete kupferfolie für mehrschichtige gedruckte leiterplatte und mit dieser kupferfolie versehene mehrschichtige gedruckte leiterplatte - Google Patents

Harzbeschichtete kupferfolie für mehrschichtige gedruckte leiterplatte und mit dieser kupferfolie versehene mehrschichtige gedruckte leiterplatte

Info

Publication number
DE69531633D1
DE69531633D1 DE69531633T DE69531633T DE69531633D1 DE 69531633 D1 DE69531633 D1 DE 69531633D1 DE 69531633 T DE69531633 T DE 69531633T DE 69531633 T DE69531633 T DE 69531633T DE 69531633 D1 DE69531633 D1 DE 69531633D1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
copper foil
layer printed
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69531633T
Other languages
German (de)
English (en)
Inventor
Tetsurou Satoh
Hiroaki Tsuyoshi
Nobuo Hayasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Kinzoku Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Application granted granted Critical
Publication of DE69531633D1 publication Critical patent/DE69531633D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31605—Next to free metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE69531633T 1995-07-04 1995-07-04 Harzbeschichtete kupferfolie für mehrschichtige gedruckte leiterplatte und mit dieser kupferfolie versehene mehrschichtige gedruckte leiterplatte Expired - Lifetime DE69531633D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1995/001335 WO1997002728A1 (fr) 1995-07-04 1995-07-04 Feuille de cuivre revetue de resine pour panneau de cablage multicouches imprime et panneau de cablage multicouches imprime le contenant

Publications (1)

Publication Number Publication Date
DE69531633D1 true DE69531633D1 (de) 2003-10-02

Family

ID=14126071

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69531633T Expired - Lifetime DE69531633D1 (de) 1995-07-04 1995-07-04 Harzbeschichtete kupferfolie für mehrschichtige gedruckte leiterplatte und mit dieser kupferfolie versehene mehrschichtige gedruckte leiterplatte

Country Status (7)

Country Link
US (1) US6165617A (enExample)
EP (1) EP0843509B1 (enExample)
JP (1) JP3676375B2 (enExample)
DE (1) DE69531633D1 (enExample)
MY (1) MY113910A (enExample)
TW (1) TW316359B (enExample)
WO (1) WO1997002728A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0989172A1 (en) * 1998-09-24 2000-03-29 Hitachi Chemical Co., Ltd. Adhesive composition for metal foil, adhesive-coated metal foil, metal clad laminate and related materials using the same
DE19914587C2 (de) * 1999-03-31 2001-05-03 Orga Kartensysteme Gmbh Chipkarte
US6551711B1 (en) * 1999-06-18 2003-04-22 The University Of Connecticut Curable episulfide systems having enhanced adhesion to metal
JP2002179772A (ja) * 2000-12-08 2002-06-26 Mitsui Mining & Smelting Co Ltd プリント配線板の層間絶縁層構成用の樹脂化合物、その樹脂化合物を用いた絶縁層形成用樹脂シート及び樹脂付銅箔、並びにそれらを用いた銅張積層板
US20030075270A1 (en) * 2001-08-22 2003-04-24 Landi Vincent R. Method for improving bonding of circuit substrates to metal and articles formed thereby
US20050208278A1 (en) * 2001-08-22 2005-09-22 Landi Vincent R Method for improving bonding of circuit substrates to metal and articles formed thereby
JP4927317B2 (ja) * 2002-02-01 2012-05-09 シェル・エルノイエルバーレ・エネルギエン・ゲーエムベーハー 高分子量ポリオール含有硬化性樹脂製のバリヤー層
JP4240448B2 (ja) * 2002-08-22 2009-03-18 三井金属鉱業株式会社 樹脂層付銅箔を用いた多層プリント配線板の製造方法
JP2004231788A (ja) * 2003-01-30 2004-08-19 Hitachi Chem Co Ltd 絶縁樹脂シートおよび絶縁樹脂付き金属箔の製造方法
TWI451816B (zh) * 2007-03-20 2014-09-01 Mitsui Mining & Smelting Co And a resin composition for insulating layer constituting a printed circuit board
KR20140030890A (ko) * 2012-09-04 2014-03-12 삼성전기주식회사 다층 인쇄회로기판의 절연 조성물, 및 이를 절연층으로 포함하는 다층 인쇄회로기판
CN105408525B (zh) 2013-07-23 2019-03-08 Jx日矿日石金属株式会社 表面处理铜箔、附载体铜箔、基材、树脂基材、印刷配线板、覆铜积层板及印刷配线板的制造方法
TWI577256B (zh) 2013-07-24 2017-04-01 Jx Nippon Mining & Metals Corp 表面處理銅箔、附載體銅箔、基材、樹脂基材、印刷配線板、覆銅積層板及印刷配線板之製造方法
JP6640567B2 (ja) 2015-01-16 2020-02-05 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板、電子機器の製造方法及びプリント配線板の製造方法
KR101852671B1 (ko) 2015-01-21 2018-06-04 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법
KR101942621B1 (ko) 2015-02-06 2019-01-25 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법
JP2017193778A (ja) 2016-04-15 2017-10-26 Ｊｘ金属株式会社 銅箔、高周波回路用銅箔、キャリア付銅箔、高周波回路用キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
US11359062B1 (en) 2021-01-20 2022-06-14 Thintronics, Inc. Polymer compositions and their uses
US11596066B1 (en) 2022-03-22 2023-02-28 Thintronics. Inc. Materials for printed circuit boards

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US3172921A (en) * 1961-10-27 1965-03-09 Gen Electric Resinous compositions
US3962520A (en) * 1973-06-20 1976-06-08 Sumitomo Bakelite Company, Limited Adhesive composition for flexible printed circuit and method for using the same
DE2612438C2 (de) * 1976-03-24 1983-04-28 Aeg Isolier- Und Kunststoff Gmbh, 3500 Kassel Haftvermittlerschicht zur Herstellung von Leiterplatten
JPS54162174A (en) * 1978-06-14 1979-12-22 Sumitomo Bakelite Co Method of producing flexible printed circuit board
US4719255A (en) * 1984-08-23 1988-01-12 Kabushiki Kaisha Toshiba Epoxy resin composition for encapsulation of semi-conductor device
JPH0719972B2 (ja) * 1986-08-29 1995-03-06 富士通株式会社 多層プリント板用樹脂付き銅箔
US5153987A (en) * 1988-07-15 1992-10-13 Hitachi Chemical Company, Ltd. Process for producing printed wiring boards
US4985294A (en) * 1988-08-25 1991-01-15 The Yokohama Rubber Co., Ltd. Printed wiring board
JP2579195B2 (ja) * 1988-08-25 1997-02-05 横浜ゴム株式会社 プリント配線板用銅張り絶縁フィルム
DE69000924T2 (de) * 1989-04-28 1993-06-03 Nikken Ind Corp Leiterplatte und ueberzug.
US5162140A (en) * 1989-04-28 1992-11-10 Nikkan Industries Co., Ltd. Flexible printed circuit board and coverlay film and manufacture methods therefor
US4915797A (en) * 1989-05-24 1990-04-10 Yates Industries, Inc. Continuous process for coating printed circuit grade copper foil with a protective resin
JPH03296587A (ja) * 1990-04-17 1991-12-27 Hitachi Chem Co Ltd 銅張積層板用接着剤
DE4113231A1 (de) * 1990-04-23 1991-10-24 Mitsubishi Gas Chemical Co Verfahren zur herstellung einer printplatine
JP2718844B2 (ja) * 1991-08-29 1998-02-25 日立化成工業株式会社 銅張積層板用銅箔接着剤
JPH05255651A (ja) * 1992-03-13 1993-10-05 Hitachi Chem Co Ltd 金属箔張り積層板用接着剤
US5362534A (en) * 1993-08-23 1994-11-08 Parlex Corporation Multiple layer printed circuit boards and method of manufacture
JP3326448B2 (ja) * 1993-09-30 2002-09-24 三井金属鉱業株式会社 接着剤層を有する銅箔
JPH08193188A (ja) * 1995-01-18 1996-07-30 Mitsui Mining & Smelting Co Ltd 銅箔用接着剤および該接着剤付き銅箔
JP3400186B2 (ja) * 1995-05-01 2003-04-28 三井金属鉱業株式会社 多層プリント配線板およびその製造方法

Also Published As

Publication number Publication date
TW316359B (enExample) 1997-09-21
EP0843509A1 (en) 1998-05-20
JP3676375B2 (ja) 2005-07-27
MY113910A (en) 2002-06-29
US6165617A (en) 2000-12-26
EP0843509A4 (en) 2000-01-05
EP0843509B1 (en) 2003-08-27
WO1997002728A1 (fr) 1997-01-23

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Legal Events

Date Code Title Description
8332 No legal effect for de