DE69526637D1 - Reinigungsmittelzusammensetzung und Verfahren zum Entfernen von Photoresist mit dieser Zusammensetzung - Google Patents

Reinigungsmittelzusammensetzung und Verfahren zum Entfernen von Photoresist mit dieser Zusammensetzung

Info

Publication number
DE69526637D1
DE69526637D1 DE69526637T DE69526637T DE69526637D1 DE 69526637 D1 DE69526637 D1 DE 69526637D1 DE 69526637 T DE69526637 T DE 69526637T DE 69526637 T DE69526637 T DE 69526637T DE 69526637 D1 DE69526637 D1 DE 69526637D1
Authority
DE
Germany
Prior art keywords
composition
removing photoresist
detergent composition
detergent
photoresist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69526637T
Other languages
English (en)
Other versions
DE69526637T2 (de
Inventor
Ryuji Hasemi
Keiichi Iwata
Mayumi Hada
Hidetoshi Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP207795A external-priority patent/JPH08190205A/ja
Priority claimed from JP6974695A external-priority patent/JPH08262746A/ja
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Application granted granted Critical
Publication of DE69526637D1 publication Critical patent/DE69526637D1/de
Publication of DE69526637T2 publication Critical patent/DE69526637T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/36—Imagewise removal not covered by groups G03F7/30 - G03F7/34, e.g. using gas streams, using plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D9/00—Chemical paint or ink removers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/906—Cleaning of wafer as interim step

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Detergent Compositions (AREA)
DE69526637T 1995-01-10 1995-12-13 Reinigungsmittelzusammensetzung und Verfahren zum Entfernen von Photoresist mit dieser Zusammensetzung Expired - Fee Related DE69526637T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP207795A JPH08190205A (ja) 1995-01-10 1995-01-10 フォトレジスト剥離剤組成物および剥離方法
JP6974695A JPH08262746A (ja) 1995-03-28 1995-03-28 フォトレジスト剥離剤組成物および剥離方法

Publications (2)

Publication Number Publication Date
DE69526637D1 true DE69526637D1 (de) 2002-06-13
DE69526637T2 DE69526637T2 (de) 2002-10-17

Family

ID=26335396

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69526637T Expired - Fee Related DE69526637T2 (de) 1995-01-10 1995-12-13 Reinigungsmittelzusammensetzung und Verfahren zum Entfernen von Photoresist mit dieser Zusammensetzung

Country Status (5)

Country Link
US (1) US5567574A (de)
EP (1) EP0723205B1 (de)
KR (1) KR100377445B1 (de)
DE (1) DE69526637T2 (de)
TW (1) TW389848B (de)

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JP3614242B2 (ja) * 1996-04-12 2005-01-26 三菱瓦斯化学株式会社 フォトレジスト剥離剤及び半導体集積回路の製造方法
US6132522A (en) * 1996-07-19 2000-10-17 Cfmt, Inc. Wet processing methods for the manufacture of electronic components using sequential chemical processing
US6030932A (en) 1996-09-06 2000-02-29 Olin Microelectronic Chemicals Cleaning composition and method for removing residues
US5989353A (en) * 1996-10-11 1999-11-23 Mallinckrodt Baker, Inc. Cleaning wafer substrates of metal contamination while maintaining wafer smoothness
US5968848A (en) * 1996-12-27 1999-10-19 Tokyo Ohka Kogyo Co., Ltd. Process for treating a lithographic substrate and a rinse solution for the treatment
SG85093A1 (en) * 1997-03-07 2001-12-19 Chartered Semiconductor Mfg Apparatus and method for polymer removal after metal etching in a plasma reactor
US5798323A (en) * 1997-05-05 1998-08-25 Olin Microelectronic Chemicals, Inc. Non-corrosive stripping and cleaning composition
US6268323B1 (en) 1997-05-05 2001-07-31 Arch Specialty Chemicals, Inc. Non-corrosive stripping and cleaning composition
JP2002505037A (ja) * 1997-06-13 2002-02-12 シーエフエムテイ・インコーポレーテツド 半導体ウェーハ処理方法
EP0907203A3 (de) 1997-09-03 2000-07-12 Siemens Aktiengesellschaft Strukturierungsverfahren
US6012469A (en) 1997-09-17 2000-01-11 Micron Technology, Inc. Etch residue clean
US6231677B1 (en) 1998-02-27 2001-05-15 Kanto Kagaku Kabushiki Kaisha Photoresist stripping liquid composition
US6105588A (en) 1998-05-27 2000-08-22 Micron Technology, Inc. Method of resist stripping during semiconductor device fabrication
KR100288769B1 (ko) * 1998-07-10 2001-09-17 윤종용 포토레지스트용스트리퍼조성물
JP2000200744A (ja) * 1999-01-07 2000-07-18 Mitsubishi Electric Corp レジスト残渣除去装置及び除去方法
JP2000284506A (ja) * 1999-03-31 2000-10-13 Sharp Corp フォトレジスト剥離剤組成物および剥離方法
US6723691B2 (en) * 1999-11-16 2004-04-20 Advanced Technology Materials, Inc. Post chemical-mechanical planarization (CMP) cleaning composition
US6492308B1 (en) * 1999-11-16 2002-12-10 Esc, Inc. Post chemical-mechanical planarization (CMP) cleaning composition
US6194366B1 (en) * 1999-11-16 2001-02-27 Esc, Inc. Post chemical-mechanical planarization (CMP) cleaning composition
US6310019B1 (en) * 2000-07-05 2001-10-30 Wako Pure Chemical Industries, Ltd. Cleaning agent for a semi-conductor substrate
US6455479B1 (en) * 2000-08-03 2002-09-24 Shipley Company, L.L.C. Stripping composition
JP3787085B2 (ja) 2001-12-04 2006-06-21 関東化学株式会社 フォトレジスト残渣除去液組成物
CN1240816C (zh) * 2001-12-12 2006-02-08 海力士半导体有限公司 除去光致抗蚀剂的洗涤液
KR100518714B1 (ko) * 2002-02-19 2005-10-05 주식회사 덕성 레지스트 박리액 조성물
KR101017738B1 (ko) * 2002-03-12 2011-02-28 미츠비시 가스 가가쿠 가부시키가이샤 포토레지스트 박리제 조성물 및 세정 조성물
JP4252758B2 (ja) * 2002-03-22 2009-04-08 関東化学株式会社 フォトレジスト残渣除去液組成物
TWI295076B (en) * 2002-09-19 2008-03-21 Dongwoo Fine Chem Co Ltd Washing liquid for semiconductor substrate and method of producing semiconductor device
PL1787168T3 (pl) * 2004-07-15 2010-11-30 Avantor Performance Mat Inc Zawierające fruktozę, niewodne kompozycje do czyszczenia mikroelektroniki
US9217929B2 (en) * 2004-07-22 2015-12-22 Air Products And Chemicals, Inc. Composition for removing photoresist and/or etching residue from a substrate and use thereof
US20060063687A1 (en) * 2004-09-17 2006-03-23 Minsek David W Composition and process for ashless removal of post-etch photoresist and/or bottom anti-reflective material on a substrate
SG158920A1 (en) * 2005-01-27 2010-02-26 Advanced Tech Materials Compositions for processing of semiconductor substrates
US7923423B2 (en) * 2005-01-27 2011-04-12 Advanced Technology Materials, Inc. Compositions for processing of semiconductor substrates
JP4988165B2 (ja) * 2005-03-11 2012-08-01 関東化学株式会社 フォトレジスト剥離液組成物及びフォトレジストの剥離方法
WO2007046655A1 (en) * 2005-10-21 2007-04-26 Samsung Electronics Co., Ltd. Stripper composition for removing dry etching residue and stripping method
US9329486B2 (en) 2005-10-28 2016-05-03 Dynaloy, Llc Dynamic multi-purpose composition for the removal of photoresists and method for its use
US8263539B2 (en) 2005-10-28 2012-09-11 Dynaloy, Llc Dynamic multi-purpose composition for the removal of photoresists and methods for its use
US7632796B2 (en) * 2005-10-28 2009-12-15 Dynaloy, Llc Dynamic multi-purpose composition for the removal of photoresists and method for its use
TW200734448A (en) * 2006-02-03 2007-09-16 Advanced Tech Materials Low pH post-CMP residue removal composition and method of use
US20080076688A1 (en) * 2006-09-21 2008-03-27 Barnes Jeffrey A Copper passivating post-chemical mechanical polishing cleaning composition and method of use
US8685909B2 (en) 2006-09-21 2014-04-01 Advanced Technology Materials, Inc. Antioxidants for post-CMP cleaning formulations
WO2008039730A1 (en) * 2006-09-25 2008-04-03 Advanced Technology Materials, Inc. Compositions and methods for the removal of photoresist for a wafer rework application
TW200925268A (en) * 2007-12-06 2009-06-16 Mallinckrodt Baker Inc Fluoride-containing photoresist stripper or residue removing cleaning compositions containing conjugate oligomeric or polymeric material of alpha-hydroxycarbonyl compound/amine or ammonia reaction
TW200925800A (en) * 2007-12-06 2009-06-16 Mallinckrodt Baker Inc Fluoride-free photoresist stripper or residue removing cleaning compositions containing conjugate oligomeric or polymeric material of alpha-hydroxycarbonyl compound/amine or ammonia reaction
WO2010048139A2 (en) 2008-10-21 2010-04-29 Advanced Technology Materials, Inc. Copper cleaning and protection formulations
KR101579846B1 (ko) * 2008-12-24 2015-12-24 주식회사 이엔에프테크놀로지 포토레지스트 패턴 제거용 조성물 및 이를 이용한 금속 패턴의 형성 방법
JP5659729B2 (ja) * 2010-11-24 2015-01-28 三菱瓦斯化学株式会社 フォトレジスト剥離剤組成物
US9158202B2 (en) 2012-11-21 2015-10-13 Dynaloy, Llc Process and composition for removing substances from substrates
KR102468776B1 (ko) 2015-09-21 2022-11-22 삼성전자주식회사 폴리실리콘 습식 식각용 조성물 및 이를 이용한 반도체 소자의 제조 방법
US10400167B2 (en) 2015-11-25 2019-09-03 Versum Materials Us, Llc Etching compositions and methods for using same
CN105695126B (zh) * 2016-04-19 2018-09-18 福州大学 一种用于印刷线路板的环保型水基清洗剂
US10948826B2 (en) * 2018-03-07 2021-03-16 Versum Materials Us, Llc Photoresist stripper

Family Cites Families (6)

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Publication number Priority date Publication date Assignee Title
JPH0612455B2 (ja) * 1985-08-10 1994-02-16 長瀬産業株式会社 剥離剤組成物
US4744834A (en) * 1986-04-30 1988-05-17 Noor Haq Photoresist stripper comprising a pyrrolidinone, a diethylene glycol ether, a polyglycol and a quaternary ammonium hydroxide
JP2578821B2 (ja) * 1987-08-10 1997-02-05 東京応化工業株式会社 ポジ型ホトレジスト用剥離液
US5185235A (en) * 1987-09-09 1993-02-09 Tokyo Ohka Kogyo Co., Ltd. Remover solution for photoresist
JPH072923B2 (ja) * 1990-07-20 1995-01-18 ユシロ化学工業株式会社 保護塗膜の除去用洗浄剤
US5279771A (en) * 1990-11-05 1994-01-18 Ekc Technology, Inc. Stripping compositions comprising hydroxylamine and alkanolamine

Also Published As

Publication number Publication date
EP0723205A1 (de) 1996-07-24
DE69526637T2 (de) 2002-10-17
KR100377445B1 (ko) 2003-08-21
EP0723205B1 (de) 2002-05-08
TW389848B (en) 2000-05-11
US5567574A (en) 1996-10-22
KR960029911A (ko) 1996-08-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee