DE69524011D1 - Verfahren zum Auffrischen von stromlosen Gold-Plattierungsbädern - Google Patents

Verfahren zum Auffrischen von stromlosen Gold-Plattierungsbädern

Info

Publication number
DE69524011D1
DE69524011D1 DE69524011T DE69524011T DE69524011D1 DE 69524011 D1 DE69524011 D1 DE 69524011D1 DE 69524011 T DE69524011 T DE 69524011T DE 69524011 T DE69524011 T DE 69524011T DE 69524011 D1 DE69524011 D1 DE 69524011D1
Authority
DE
Germany
Prior art keywords
refreshing
gold plating
electroless gold
plating baths
baths
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69524011T
Other languages
English (en)
Other versions
DE69524011T2 (de
Inventor
Donald Francis Canaperi
Rangarajan Jagannathan
Mahadevaiver Krishnan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69524011D1 publication Critical patent/DE69524011D1/de
Publication of DE69524011T2 publication Critical patent/DE69524011T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
DE69524011T 1994-08-30 1995-07-19 Verfahren zum Auffrischen von stromlosen Gold-Plattierungsbädern Expired - Fee Related DE69524011T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29799894A 1994-08-30 1994-08-30

Publications (2)

Publication Number Publication Date
DE69524011D1 true DE69524011D1 (de) 2002-01-03
DE69524011T2 DE69524011T2 (de) 2002-08-01

Family

ID=23148565

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69524011T Expired - Fee Related DE69524011T2 (de) 1994-08-30 1995-07-19 Verfahren zum Auffrischen von stromlosen Gold-Plattierungsbädern

Country Status (4)

Country Link
US (1) US5635253A (de)
EP (1) EP0699778B1 (de)
JP (1) JP3065514B2 (de)
DE (1) DE69524011T2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5803957A (en) * 1993-03-26 1998-09-08 C. Uyemura & Co.,Ltd. Electroless gold plating bath
US6429120B1 (en) 2000-01-18 2002-08-06 Micron Technology, Inc. Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals
US5728433A (en) * 1997-02-28 1998-03-17 Engelhard Corporation Method for gold replenishment of electroless gold bath
US6211073B1 (en) 1998-02-27 2001-04-03 Micron Technology, Inc. Methods for making copper and other metal interconnections in integrated circuits
US6284656B1 (en) 1998-08-04 2001-09-04 Micron Technology, Inc. Copper metallurgy in integrated circuits
US6288442B1 (en) 1998-09-10 2001-09-11 Micron Technology, Inc. Integrated circuit with oxidation-resistant polymeric layer
US6359328B1 (en) 1998-12-31 2002-03-19 Intel Corporation Methods for making interconnects and diffusion barriers in integrated circuits
US20020127845A1 (en) * 1999-03-01 2002-09-12 Paul A. Farrar Conductive structures in integrated circuits
US6420262B1 (en) 2000-01-18 2002-07-16 Micron Technology, Inc. Structures and methods to enhance copper metallization
US7262130B1 (en) * 2000-01-18 2007-08-28 Micron Technology, Inc. Methods for making integrated-circuit wiring from copper, silver, gold, and other metals
US7211512B1 (en) 2000-01-18 2007-05-01 Micron Technology, Inc. Selective electroless-plated copper metallization
US6376370B1 (en) 2000-01-18 2002-04-23 Micron Technology, Inc. Process for providing seed layers for using aluminum, copper, gold and silver metallurgy process for providing seed layers for using aluminum, copper, gold and silver metallurgy
US6674167B1 (en) * 2000-05-31 2004-01-06 Micron Technology, Inc. Multilevel copper interconnect with double passivation
US6423629B1 (en) * 2000-05-31 2002-07-23 Kie Y. Ahn Multilevel copper interconnects with low-k dielectrics and air gaps
US6500482B1 (en) * 2001-08-31 2002-12-31 Boules H. Morcos Electroless nickel plating solution and process for its use
US7220665B2 (en) 2003-08-05 2007-05-22 Micron Technology, Inc. H2 plasma treatment
US7294565B2 (en) * 2003-10-01 2007-11-13 International Business Machines Corporation Method of fabricating a wire bond pad with Ni/Au metallization
US20070145543A1 (en) * 2005-12-28 2007-06-28 Zeng Xiang Y Plating bar design for high speed package design
TWI535874B (zh) * 2006-12-13 2016-06-01 環球展覽公司 用於固相材料之改良蒸發方法
US20100055422A1 (en) * 2008-08-28 2010-03-04 Bob Kong Electroless Deposition of Platinum on Copper
KR101617657B1 (ko) * 2013-08-23 2016-05-03 숭실대학교 산학협력단 무전해 도금법을 이용한 금박막 제조방법
US10731258B2 (en) * 2014-10-27 2020-08-04 Surface Technology, Inc. Plating bath solutions
US10006126B2 (en) * 2014-10-27 2018-06-26 Surface Technology, Inc. Plating bath solutions
JP6841969B1 (ja) * 2020-10-30 2021-03-10 松田産業株式会社 シアン化金カリウム結晶及びシアン化金カリウム溶液
CN112730731B (zh) * 2020-12-01 2021-12-07 成都四威高科技产业园有限公司 一种亚硫酸盐镀金液的维护方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3589916A (en) * 1964-06-24 1971-06-29 Photocircuits Corp Autocatalytic gold plating solutions
GB1547028A (en) * 1976-11-19 1979-06-06 Mine Safety Appliances Co Electroless gold plating baths
US4337091A (en) * 1981-03-23 1982-06-29 Hooker Chemicals & Plastics Corp. Electroless gold plating
GB8812329D0 (en) * 1988-05-25 1988-06-29 Engelhard Corp Electroless deposition
GB2225026A (en) * 1988-11-22 1990-05-23 American Chem & Refining Co Electroless gold plating composition
US5130168A (en) * 1988-11-22 1992-07-14 Technic, Inc. Electroless gold plating bath and method of using same
US5258062A (en) * 1989-06-01 1993-11-02 Shinko Electric Industries Co., Ltd. Electroless gold plating solutions

Also Published As

Publication number Publication date
US5635253A (en) 1997-06-03
JP3065514B2 (ja) 2000-07-17
DE69524011T2 (de) 2002-08-01
EP0699778A1 (de) 1996-03-06
JPH0874061A (ja) 1996-03-19
EP0699778B1 (de) 2001-11-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee