DE69523100D1 - Oberflaechenemittierender laser und herstellungsverfahren - Google Patents

Oberflaechenemittierender laser und herstellungsverfahren

Info

Publication number
DE69523100D1
DE69523100D1 DE69523100T DE69523100T DE69523100D1 DE 69523100 D1 DE69523100 D1 DE 69523100D1 DE 69523100 T DE69523100 T DE 69523100T DE 69523100 T DE69523100 T DE 69523100T DE 69523100 D1 DE69523100 D1 DE 69523100D1
Authority
DE
Germany
Prior art keywords
manufacturing
emitting laser
emitting
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69523100T
Other languages
English (en)
Other versions
DE69523100T2 (de
Inventor
Hideaki Iwano
Katsumi Mori
Takayuki Kondo
Tatsuya Asaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Application granted granted Critical
Publication of DE69523100D1 publication Critical patent/DE69523100D1/de
Publication of DE69523100T2 publication Critical patent/DE69523100T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18341—Intra-cavity contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H01S5/423—Arrays of surface emitting lasers having a vertical cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S2301/00—Functional characteristics
    • H01S2301/18—Semiconductor lasers with special structural design for influencing the near- or far-field
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S2304/00—Special growth methods for semiconductor lasers
    • H01S2304/04—MOCVD or MOVPE
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/0014—Measuring characteristics or properties thereof
    • H01S5/0042—On wafer testing, e.g. lasers are tested before separating wafer into chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/0607—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature
    • H01S5/0612—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature controlled by temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
    • H01S5/1221—Detuning between Bragg wavelength and gain maximum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18361—Structure of the reflectors, e.g. hybrid mirrors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18361—Structure of the reflectors, e.g. hybrid mirrors
    • H01S5/18369—Structure of the reflectors, e.g. hybrid mirrors based on dielectric materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
    • H01S5/2211—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on II-VI materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
    • H01S5/2213—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on polyimide or resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
    • H01S5/2214—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on oxides or nitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H01S5/4068—Edge-emitting structures with lateral coupling by axially offset or by merging waveguides, e.g. Y-couplers

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
DE69523100T 1994-01-20 1995-01-20 Oberflaechenemittierender laser und herstellungsverfahren Expired - Lifetime DE69523100T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP485994 1994-01-20
PCT/JP1995/000060 WO1995020254A1 (en) 1994-01-20 1995-01-20 Surface emission type semiconductor laser, method and apparatus for producing the same

Publications (2)

Publication Number Publication Date
DE69523100D1 true DE69523100D1 (de) 2001-11-15
DE69523100T2 DE69523100T2 (de) 2002-06-06

Family

ID=11595411

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69523100T Expired - Lifetime DE69523100T2 (de) 1994-01-20 1995-01-20 Oberflaechenemittierender laser und herstellungsverfahren

Country Status (6)

Country Link
US (1) US5621750A (de)
EP (1) EP0691045B1 (de)
JP (1) JP3766976B2 (de)
KR (1) KR100363503B1 (de)
DE (1) DE69523100T2 (de)
WO (1) WO1995020254A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3818388B1 (ja) * 1994-01-20 2006-09-06 セイコーエプソン株式会社 面発光型半導体レーザ装置およびその製造方法
US6531193B2 (en) 1997-07-07 2003-03-11 The Penn State Research Foundation Low temperature, high quality silicon dioxide thin films deposited using tetramethylsilane (TMS) for stress control and coverage applications
US6668005B2 (en) 1998-01-31 2003-12-23 Klaus Streubel Pre-fusion oxidized and wafer-bonded vertical cavity laser
GB2333895B (en) * 1998-01-31 2003-02-26 Mitel Semiconductor Ab Pre-fusion oxidized and wafer-bonded vertical cavity laser
US6528829B1 (en) * 1999-03-25 2003-03-04 Trw Inc. Integrated circuit structure having a charge injection barrier
AT409905B (de) * 1999-12-09 2002-12-27 Femtolasers Produktions Gmbh Mehrschichtiger spiegel zur herbeiführung einer vorgegebenen gruppenverzögerungsdispersion
US6646292B2 (en) * 1999-12-22 2003-11-11 Lumileds Lighting, U.S., Llc Semiconductor light emitting device and method
JP3791584B2 (ja) * 1999-12-28 2006-06-28 セイコーエプソン株式会社 面発光型半導体レーザおよび面発光型半導体レーザアレイ
JP2002083999A (ja) * 2000-06-21 2002-03-22 Sharp Corp 半導体発光素子
JP2002164622A (ja) * 2000-11-22 2002-06-07 Toshiba Electronic Engineering Corp 半導体光素子
DE10131608B4 (de) * 2001-06-29 2004-02-05 Forschungszentrum Jülich GmbH Photosensor für ein Durchlichtverfahren zur Detektion der Bewegungsrichtung von Intensitätsmaxima und Intensitätsminima einer optischen stehenden Welle
US7767928B2 (en) * 2001-09-05 2010-08-03 Lasertec Gmbh Depth measurement and depth control or automatic depth control for a hollow to be produced by a laser processing device
JP4056347B2 (ja) * 2002-09-30 2008-03-05 ローム株式会社 半導体発光装置およびその製造方法
US6853669B2 (en) * 2002-12-10 2005-02-08 Ut-Battelle, Llc Nanocrystal waveguide (NOW) laser
JP4439199B2 (ja) * 2003-03-20 2010-03-24 株式会社リコー 垂直共振器型面発光半導体レーザ装置、およびそれを用いた光論理演算装置、波長変換装置、光パルス波形整形装置、ならびに光伝送システム
US20060056473A1 (en) * 2004-08-20 2006-03-16 Tatsuya Tanigawa Semiconductor light emitting element and method for fabricating the same
JP4495052B2 (ja) * 2005-08-26 2010-06-30 古河電気工業株式会社 面発光レーザ素子、光送信モジュール、光コネクタおよび光通信システム
GB2432715A (en) * 2005-11-25 2007-05-30 Sharp Kk Nitride semiconductor light emitting devices
JP2008034795A (ja) * 2006-07-07 2008-02-14 Seiko Epson Corp 面発光型半導体レーザ
WO2008114707A1 (ja) * 2007-03-22 2008-09-25 Nec Corporation 面発光型半導体レーザ
JP5274038B2 (ja) * 2008-02-06 2013-08-28 キヤノン株式会社 垂直共振器型面発光レーザの製造方法とレーザアレイの製造方法
JP5221180B2 (ja) * 2008-03-28 2013-06-26 Ｄｏｗａエレクトロニクス株式会社 発光素子
JP5871458B2 (ja) * 2010-11-02 2016-03-01 キヤノン株式会社 垂直共振器型面発光レーザ、画像形成装置
US9335262B2 (en) * 2011-08-25 2016-05-10 Palo Alto Research Center Incorporated Gap distributed Bragg reflectors
FR3079681B1 (fr) * 2018-03-29 2021-09-17 Commissariat Energie Atomique Diode laser de type vcsel a confinement de porteurs et son procede de fabrication.

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Publication number Priority date Publication date Assignee Title
JPS62189784A (ja) * 1986-02-17 1987-08-19 Nec Corp 埋込み型半導体レ−ザ及びその製造方法
FR2606223B1 (fr) * 1986-10-29 1996-03-01 Seiko Epson Corp Laser a semiconducteur et son procede de fabrication
JPH01196894A (ja) * 1988-02-02 1989-08-08 Matsushita Electric Ind Co Ltd 半導体レーザ装置
JP2641483B2 (ja) * 1988-03-22 1997-08-13 株式会社日立製作所 半導体発光素子の作製方法
JPH01320408A (ja) * 1988-06-23 1989-12-26 Nippon Steel Corp レーザーを使った膜厚モニター及び膜厚測定方法
US5182757A (en) * 1990-09-12 1993-01-26 Seiko Epson Corporation Surface emission type semiconductor laser
JP3240636B2 (ja) * 1990-09-12 2001-12-17 セイコーエプソン株式会社 面発光型半導体レーザ
US5356832A (en) * 1990-09-12 1994-10-18 Seiko Epson Corporation Method of making surface emission type semiconductor laser
JPH04144183A (ja) * 1990-10-04 1992-05-18 Seiko Epson Corp 面発光型半導体レーザ
JPH0548202A (ja) * 1990-12-27 1993-02-26 Furukawa Electric Co Ltd:The 半導体レーザ素子
JP2888455B2 (ja) * 1991-01-07 1999-05-10 日本電信電話株式会社 半導体発光装置
JPH04275478A (ja) * 1991-03-04 1992-10-01 Nec Corp 面発光半導体レーザの製造方法
WO1992017925A1 (en) * 1991-03-28 1992-10-15 Seiko Epson Corporation Surface emitting type semiconductor laser and its manufacturing method
JPH0669585A (ja) * 1992-08-12 1994-03-11 Fujitsu Ltd 面発光半導体レーザ及びその製造方法
JP3095545B2 (ja) * 1992-09-29 2000-10-03 株式会社東芝 面発光型半導体発光装置およびその製造方法
US5351256A (en) * 1993-04-28 1994-09-27 The United States Of America As Represented By The United States Department Of Energy Electrically injected visible vertical cavity surface emitting laser diodes

Also Published As

Publication number Publication date
WO1995020254A1 (en) 1995-07-27
JP3766976B2 (ja) 2006-04-19
KR100363503B1 (ko) 2003-02-05
US5621750A (en) 1997-04-15
DE69523100T2 (de) 2002-06-06
EP0691045B1 (de) 2001-10-10
JPH08508137A (ja) 1996-08-27
EP0691045A1 (de) 1996-01-10
KR960701496A (ko) 1996-02-24

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